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    Vehicle body frame, die-cast product, mold for die-cast product and die-cast method
    1.
    发明授权
    Vehicle body frame, die-cast product, mold for die-cast product and die-cast method 有权
    车身框架，压铸产品，压铸模具和压铸方法

    公开(公告)号：US07726382B2

    公开(公告)日：2010-06-01

    申请号：US11605389

    申请日：2006-11-29

    申请人： Toshimitsu Suzuki ,  Yoshitaka Seki ,  Jun Hariu ,  Shin Watanabe ,  Koichi Ota ,  Satoshi Hirayanagi ,  Takashi Doi ,  Yoshiyuki Kurayoshi

    发明人： Toshimitsu Suzuki ,  Yoshitaka Seki ,  Jun Hariu ,  Shin Watanabe ,  Koichi Ota ,  Satoshi Hirayanagi ,  Takashi Doi ,  Yoshiyuki Kurayoshi

    IPC分类号： B22D33/04 ,  B22C9/10

    CPC分类号： B22C9/108 ,  B22C9/064 ,  B22D17/24

    摘要： A mold and a die-cast manufacturing method for the die-cast product, in which a main frame which is contiguously formed with a head pipe constitutes a portion of a hollow light-weight-metal-made vehicle-body frame. The mold includes a core for forming an inner space of the hollow vehicle-body frame. The core includes a core body and a plurality of splints mounted on the core body, the splints having approximately elliptical cross-sectional shapes. The long axes direction of ellipses of the splints are set parallel to a mold split surface of the mold. As a result, measurement of the positional accuracy of the splints is facilitated, a clearance between the splint and the mold can decrease by increasing the dimensional accuracy of splint mounting portions of the mold based on sizes of the splints, and the frame can be manufactured with high dimensional accuracy.

    摘要翻译： 用于压铸产品的模具和压铸制造方法，其中与头管连续地形成的主框架构成中空轻质金属制成的车身框架的一部分。 模具包括用于形成中空车身框架的内部空间的芯。 芯部包括芯体和安装在芯体上的多个夹板，夹板具有大致椭圆形的横截面形状。 夹板的椭圆的长轴方向平行于模具的模具分割面设置。 结果，夹板的位置精度的测量变得容易，通过基于夹板的尺寸增加模具的夹板安装部分的尺寸精度，可以减小夹板和模具之间的间隙，并且可以制造框架 尺寸精度高。

    Vehicle body frame, die-cast product, mold for die-cast product and die-cast method
    2.
    发明申请
    Vehicle body frame, die-cast product, mold for die-cast product and die-cast method 有权
    车身框架，压铸产品，压铸模具和压铸方法

    公开(公告)号：US20070131377A1

    公开(公告)日：2007-06-14

    申请号：US11605389

    申请日：2006-11-29

    申请人： Toshimitsu Suzuki ,  Yoshitaka Seki ,  Jun Hariu ,  Shin Watanabe ,  Koichi Ota ,  Satoshi Hirayanagi ,  Takashi Doi ,  Yoshiyuki Kurayoshi

    发明人： Toshimitsu Suzuki ,  Yoshitaka Seki ,  Jun Hariu ,  Shin Watanabe ,  Koichi Ota ,  Satoshi Hirayanagi ,  Takashi Doi ,  Yoshiyuki Kurayoshi

    IPC分类号： B22D33/04 ,  B22C9/10

    CPC分类号： B22C9/108 ,  B22C9/064 ,  B22D17/24

    摘要： A mold and a die-cast manufacturing method for the die-cast product, in which a main frame which is contiguously formed with a head pipe constitutes a portion of a hollow light-weight-metal-made vehicle-body frame. The mold includes a core for forming an inner space of the hollow vehicle-body frame. The core includes a core body and a plurality of splints mounted on the core body, the splints having approximately elliptical cross-sectional shapes. The long axes direction of ellipses of the splints are set parallel to a mold split surface of the mold. As a result, measurement of the positional accuracy of the splints is facilitated, a clearance between the splint and the mold can decrease by increasing the dimensional accuracy of splint mounting portions of the mold based on sizes of the splints, and the frame can be manufactured with high dimensional accuracy.

    摘要翻译： 用于压铸产品的模具和压铸制造方法，其中与头管连续地形成的主框架构成中空轻质金属制成的车身框架的一部分。 模具包括用于形成中空车身框架的内部空间的芯。 芯部包括芯体和安装在芯体上的多个夹板，夹板具有大致椭圆形的横截面形状。 夹板的椭圆的长轴方向平行于模具的模具分割面设置。 结果，夹板的位置精度的测量变得容易，通过基于夹板的尺寸增加模具的夹板安装部分的尺寸精度，可以减小夹板和模具之间的间隙，并且可以制造框架 尺寸精度高。

    Group III nitride compound semiconductor light-emitting device
    4.
    发明授权
    Group III nitride compound semiconductor light-emitting device 有权
    III族氮化物化合物半导体发光器件

    公开(公告)号：US07304325B2

    公开(公告)日：2007-12-04

    申请号：US09845336

    申请日：2001-05-01

    申请人： Toshiya Uemura ,  Koichi Ota

    发明人： Toshiya Uemura ,  Koichi Ota

    IPC分类号： H01L21/00

    CPC分类号： H01L33/20 ,  H01L33/46

    摘要： A semiconductor laminate containing a light-emitting layer is etched to reveal a side surface. A reflection surface opposite to the side surface of the semiconductor laminate is provided in one and the same chip as the semiconductor laminate. A groove may be formed in the laminate by a dicing saw, and an outer side surface of the groove may be provided as the reflection surface.

    摘要翻译： 蚀刻含有发光层的半导体层叠体，以露出侧面。 与半导体层叠体的侧面相反的反射面设置在与半导体层叠体同一芯片中。 可以通过切割锯在层叠体中形成凹槽，并且可以设置凹槽的外侧表面作为反射表面。