摘要:
A process of producing a solvent useful in coal liquefaction which includes separating the heavy liquid produced from the liquefaction of coal into a fraction boiling at 200.degree. to 210.degree. C., a fraction boiling at 211.degree. to 230.degree. C., and a fraction boiling at not less than 231.degree. subjecting the fraction boiling at 211.degree. to 230.degree. C. to a hydrogenation treatment to produce a hydrogenated fraction, mixing the hydrogenated fraction with the fraction boiling at 200.degree. to 210.degree. C. to form a resultant mixture, and mixing a portion of the resultant mixture with a portion of the fraction boiling at not less than 231.degree. C. Alternately, the solvent is produced from the heavy liquid by separating it into a fraction boiling at 200.degree. C. to 210.degree. C., a fraction boiling at 211.degree. C. to 230.degree. C., a fraction boiling at 231.degree. C. to 250.degree. C., a fraction boiling at 251.degree. C. to 350.degree. C. and a fraction boiling at not less than 351.degree. C., subjecting each of the middle three fractions to a hydrogenation treatment to form three hydrogenated fractions, mixing the three hydrogenated fractions with the fraction boiling at 200.degree. C. to 210.degree. C. to form a resultant mixture, and mixing the resultant mixture with a portion of the fraction boiling at not less than 351.degree. C.
摘要:
A solvent useful in coal liquefaction is obtained by separating the heavy liquid resulting from coal liquefaction into a fraction boiling at temperatures of between 200.degree. to 210.degree. C., a fraction boiling at temperatures between 211.degree. to 250.degree. C., and a fraction boiling at not less than 250.degree. C., subjecting the fraction boiling at between 211.degree. C. to 250.degree. C. to two hydrogenation treatments, mixing the hydrogenated product with the fraction boiling at between 200.degree. to 210.degree. C. which optionally has been hydrogenated to form a resultant mixture and mixing a portion of the resultant mixture with the fraction boiling at not less than 250.degree. C. which has been optionally hydrogenated.
摘要:
A coal-based heavy oil is refined so as to remove quinoline insolubles and provide a hydrocarbon product suitable for making carbon stocks by heating to remove the volatile components which have boiling points ranging from the initial boiling point of the heavy oil to up to at least 200.degree. C. and at most 270.degree. C., thereby leaving a residual coal-based heavy oil, the residual coal-based heavy oil is mixed with a ketone-type solvent having a boiling point less than 200.degree. C. to form an insoluble precipitate (including quinoline insolubles) and a supernatent, the supernatent is treated to recover the ketone-type solvent, and the remaining hydrocarbon mixture is easily processed by vacuum distillation to produce a hydrocarbon product suitable for making carbon stocks.
摘要:
PROBLEMAn object of the present invention is to easily and inexpensively manufacture an array-type photo module and, in addition, coexist high-density array and low crosstalk.SOLUTIONThe present invention provides an array-type photo module M including a filter 31, which, in each channel, transmits therethrough a portion of emitting light from an incident optical fiber 11 on the opposite side of a gradient-index lens array 2 and reflects another portion of the emitting light from the incident optical fiber 11 toward the gradient-index lens array 2, and a light-shielding member 32 (33) which is arranged on the opposite side of the gradient-index lens array 2 of the filter 31 so as to be spaced from the filter 31 and, in each channel, has an opening 34 (35) passing therethrough transmitted light from the filter 31 on the opposite side of the filter 31.
摘要:
A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the first impurity region (102) being higher in impurity concentration than the silicon substrate (101), forming a second impurity region (102b) at a position adjacent to the first impurity region (102a) in the depth direction of the silicon substrate (101), the second impurity region (102b) being higher in impurity concentration than the first impurity region (102a), forming an etch stop layer (103) on the first surface, forming an etch mask layer (104) having an opening on the second surface of the silicon substrate (101) opposite to the first surface, and etching the silicon substrate (101) until at least the etch stop layer (103) is exposed via the opening.
摘要:
After a barrier film is formed on a pad electrode, Ni particles having a diameter of 2 μm or less are selectively deposited on the barrier film, thereby forming a Ni fine particle film. Then, a bump electrode made of a solder ball is provided on the pad electrode through the Ni fine particle film. Thereafter, the bump electrode is melted by a heat treatment to join the Ni fine particle film to the bump electrode. Thus, a bump electrode structure is finished.
摘要:
A method of manufacturing a liquid discharge head, comprising the steps of forming a film of an inorganic material in the form of a liquid flow path pattern on a substrate having liquid discharge elements formed thereon, forming a liquid flow path member on the film of the inorganic material using one of silicon oxide, silicon carbide, and carbon doped silicon oxide (SiOC), forming liquid discharge openings in corresponding portions above the liquid discharge elements, and eluting the film of the inorganic material so as to form a liquid flow path.
摘要:
In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要:
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.
摘要:
There is provided a semiconductor device in which redundancy fuses formed in an upper layer wiring region can be cut without damaging an underlying Si substrate or adjacent regions. The semiconductor device comprises a lower layer wiring formed within an interlayer insulating film on the Si substrate, and an upper layer metal wiring made of Al, Cu or the like, formed above the lower layer wiring and connected thereto through a via metal, wherein the redundancy fuses are formed in the same wiring layer as the upper layer metal wiring. For cutting a fuse by irradiating with a laser having a wavelength in a range of 1,000 to 1,100 nm and a beam diameter D (&mgr;m), the fuse may be designed to have a film thickness T (&mgr;m) and a width W (&mgr;m) which satisfy T≦(−0.15 (D+2&sgr;)+0.46) exp (2W), where &sgr; (&mgr;m) is an alignment accuracy of the center of the laser beam to the center of the fuse, with the result that the fuse formed in the same wiring layer as the upper layer metal wiring can be cut without damaging the Si substrate, an adjacent fuse and the upper layer metal wiring.