公开(公告)号：US08624366B2

公开(公告)日：2014-01-07

申请号：US13456660

申请日：2012-04-26

申请人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

发明人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

IPC分类号： H01L23/495

CPC分类号： H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76885 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00015 ,  H01L2924/00

摘要： A semiconductor package structure is provided, including: a semiconductor chip having electrode pads disposed thereon and metal bumps disposed on the electrode pads; an encapsulant encapsulating the semiconductor chip; a dielectric layer formed on the encapsulant and having a plurality of patterned intaglios formed therein for exposing the metal bumps; a wiring layer formed in the patterned intaglios of the dielectric layer and electrically connected to the metal bumps; and a metal foil having a plurality of metal posts disposed on a surface thereof such that the metal foil is disposed on the encapsulant with the metal posts penetrating the encapsulant so as to extend to the inactive surface of the semiconductor chip. Compared with the prior art, the present invention reduces the overall thickness of the package structure, increases the electrical transmission efficiency and improves the heat dissipating effect.

摘要翻译： 提供一种半导体封装结构，包括：具有设置在其上的电极焊盘的半导体芯片和设置在电极焊盘上的金属凸块; 封装半导体芯片的密封剂; 介电层，其形成在所述密封剂上并且具有形成在其中的多个图案化的凹凸，用于暴露所述金属凸块; 形成在电介质层的图案化凹凸中并与金属凸块电连接的布线层; 以及具有设置在其表面上的多个金属柱的金属箔，使得金属箔设置在密封剂上，金属柱穿透密封剂，以延伸到半导体芯片的非活性表面。 与现有技术相比，本发明减小了封装结构的整体厚度，提高了电传输效率并提高了散热效果。

公开(公告)号：US08513796B2

公开(公告)日：2013-08-20

申请号：US13413003

申请日：2012-03-06

申请人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

发明人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/214 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2224/29099 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A package structure, a method of fabricating the package structure, and a package-on-package device are provided, where the package structure includes a metal sheet having perforations and a semiconductor chip including an active surface having electrode pads thereon, where the semiconductor chip is combined with the metal sheet via an inactive surface thereof. Also, a protective buffer layer is formed on the active surface to cover the conductive bumps, and the perforations are arranged around a periphery of the inactive surface of the semiconductor chip. Further, an encapsulant is formed on the metal sheet and in the perforations, for encapsulating the semiconductor chip and exposing the protective buffer layer; and a circuit fan-out layer is formed on the encapsulant and the protective buffer layer and having conductive vias penetrating the protective buffer layer and electrically connecting to the conductive bumps.

摘要翻译： 提供封装结构，制造封装结构的方法和封装封装器件，其中封装结构包括具有穿孔的金属片和包括其上具有电极焊盘的有源表面的半导体芯片，其中半导体芯片 经由其非活性表面与金属片结合。 此外，在活性表面上形成保护缓冲层以覆盖导电凸块，并且穿孔布置在半导体芯片的非活性表面周围。 此外，在金属板和穿孔中形成密封剂，用于封装半导体芯片并暴露保护缓冲层; 并且在密封剂和保护缓冲层上形成电路扇出层，并且具有穿过保护缓冲层并电连接到导电凸块的导电通孔。

公开(公告)号：US20130040427A1

公开(公告)日：2013-02-14

申请号：US13588030

申请日：2012-08-17

申请人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

发明人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

IPC分类号： H01L21/56

CPC分类号： H01L23/49827 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/1412 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10515 ,  H01L2924/00

摘要： A packaging substrate having a through-holed interposer embedded therein and a fabrication method of the packaging substrate are provided, where the packaging substrate includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer.

摘要翻译： 提供一种嵌入其中的通孔插入器的封装衬底和封装衬底的制造方法，其中所述封装衬底包括：具有相反的第一和第二表面的成型层; 嵌入在模制层中并与第二表面齐平的穿孔插入器; 重分布层结构，其嵌入在所述成型层中并且设置在所述穿孔插入件上，并且具有从所述成型层的第一表面露出的多个电极焊盘; 以及设置在模制层的第二表面上并与穿孔插入件电连接的组合结构。

公开(公告)号：US08269337B2

公开(公告)日：2012-09-18

申请号：US13074467

申请日：2011-03-29

申请人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

发明人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

IPC分类号： H01L23/12

CPC分类号： H01L23/49827 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/1412 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10515 ,  H01L2924/00

摘要： A packaging substrate having a through-holed interposer embedded therein is provided, which includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer. By embedding the through-holed interposer in the molding layer and forming the built-up structure on the second surface of the molding layer, the present invention eliminates the need of a core board and reduces the thickness of the overall structure. Further, since the through-holed interposer has a CIE close to or the same as that of a silicon wafer, the structural reliability during thermal cycle testing is improved.

摘要翻译： 提供一种具有嵌入其中的通孔插入器的封装基板，其包括：具有相对的第一和第二表面的成型层; 嵌入在模制层中并与第二表面齐平的穿孔插入器; 重分布层结构，其嵌入在所述成型层中并且设置在所述穿孔插入件上，并且具有从所述成型层的第一表面露出的多个电极焊盘; 以及设置在模制层的第二表面上并与穿孔插入件电连接的组合结构。 通过将贯穿孔插入件嵌入成型层中并在成型层的第二表面上形成积层结构，本发明消除了对于芯板的需要并减小了整体结构的厚度。 此外，由于通孔插入器的CIE与硅晶片的CIE接近或相同，所以热循环测试期间的结构可靠性得到改善。

公开(公告)号：US20120217627A1

公开(公告)日：2012-08-30

申请号：US13191793

申请日：2011-07-27

申请人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

发明人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

IPC分类号： H01L23/485 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/97 ,  H01L2224/02313 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/838 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00012

摘要： A package structure is provided that includes a metal plate; a semiconductor chip having an active surface, electrode pads disposed on the active surface, conductive bumps disposed on the electrode pads, and an inactive surface opposing the active surface and attached with the metal plate by a thermal conductive adhesive; an encapsulant formed on the metal plate for encapsulating a perimeter of the semiconductor chip, with the active surface of the semiconductor chip being exposed thereon; a first dielectric layer formed on the encapsulant and the active surface of the semiconductor chip, and having wiring trenches for exposing the conductive bumps; and a first wiring layer formed in the wiring trenches of the first dielectric layer and electrically connected to the conductive bumps. The wiring layer, through the electrical connection of the conductive bumps with the semiconductor chip prevents the use of bonding wires as a conductive pathway.

摘要翻译： 提供包括金属板的封装结构; 具有活性表面的半导体芯片，设置在有源表面上的电极焊盘，设置在电极焊盘上的导电凸块，以及与活性表面相对的非活性表面，并通过导热粘合剂附着在金属板上; 形成在所述金属板上用于封装所述半导体芯片的周边的密封剂，所述半导体芯片的有源表面暴露在其上; 形成在所述密封剂和所述半导体芯片的有源表面上的第一介电层，并且具有用于暴露所述导电凸块的布线沟槽; 以及形成在第一电介质层的布线沟槽中并电连接到导电凸块的第一布线层。 通过导电凸块与半导体芯片的电连接的布线层防止使用接合线作为导电路径。

公开(公告)号：US08709865B2

公开(公告)日：2014-04-29

申请号：US13588030

申请日：2012-08-17

申请人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

发明人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

IPC分类号： H01L21/00

CPC分类号： H01L23/49827 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/1412 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10515 ,  H01L2924/00

摘要： A packaging substrate having a through-holed interposer embedded therein and a fabrication method of the packaging substrate are provided, where the packaging substrate includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer.

摘要翻译： 提供一种嵌入其中的通孔插入器的封装衬底和封装衬底的制造方法，其中所述封装衬底包括：具有相反的第一和第二表面的成型层; 嵌入在模制层中并与第二表面齐平的穿孔插入器; 重分布层结构，其嵌入在所述成型层中并且设置在所述穿孔插入件上，并且具有从所述成型层的第一表面露出的多个电极焊盘; 以及设置在模制层的第二表面上并与穿孔插入件电连接的组合结构。

公开(公告)号：US20120273930A1

公开(公告)日：2012-11-01

申请号：US13456660

申请日：2012-04-26

申请人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

发明人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

IPC分类号： H01L23/495 ,  H01L21/78

CPC分类号： H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76885 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00015 ,  H01L2924/00

摘要： A semiconductor package structure is provided, including: a semiconductor chip having electrode pads disposed thereon and metal bumps disposed on the electrode pads; an encapsulant encapsulating the semiconductor chip; a dielectric layer formed on the encapsulant and having a plurality of patterned intaglios formed therein for exposing the metal bumps; a wiring layer formed in the patterned intaglios of the dielectric layer and electrically connected to the metal bumps; and a metal foil having a plurality of metal posts disposed on a surface thereof such that the metal foil is disposed on the encapsulant with the metal posts penetrating the encapsulant so as to extend to the inactive surface of the semiconductor chip. Compared with the prior art, the present invention reduces the overall thickness of the package structure, increases the electrical transmission efficiency and improves the heat dissipating effect.

摘要翻译： 提供一种半导体封装结构，包括：具有设置在其上的电极焊盘的半导体芯片和设置在电极焊盘上的金属凸块; 封装半导体芯片的密封剂; 介电层，其形成在所述密封剂上并且具有形成在其中的多个图案化的凹凸，用于暴露所述金属凸块; 形成在电介质层的图案化凹凸中并与金属凸块电连接的布线层; 以及具有设置在其表面上的多个金属柱的金属箔，使得金属箔设置在密封剂上，金属柱穿透密封剂，以延伸到半导体芯片的非活性表面。 与现有技术相比，本发明减小了封装结构的整体厚度，提高了电传输效率并提高了散热效果。

公开(公告)号：US20120228764A1

公开(公告)日：2012-09-13

申请号：US13413003

申请日：2012-03-06

申请人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

发明人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/214 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2224/29099 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A package structure, a method of fabricating the package structure, and a package-on-package device are provided, where the package structure includes a metal sheet having perforations and a semiconductor chip including an active surface having electrode pads thereon, where the semiconductor chip is combined with the metal sheet via an inactive surface thereof. Also, a protective buffer layer is formed on the active surface to cover the conductive bumps, and the perforations are arranged around a periphery of the inactive surface of the semiconductor chip. Further, an encapsulant is formed on the metal sheet and in the perforations, for encapsulating the semiconductor chip and exposing the protective buffer layer; and a circuit fan-out layer is formed on the encapsulant and the protective buffer layer and having conductive vias penetrating the protective buffer layer and electrically connecting to the conductive bumps.

摘要翻译： 提供封装结构，制造封装结构的方法和封装封装器件，其中封装结构包括具有穿孔的金属片和包括其上具有电极焊盘的有源表面的半导体芯片，其中半导体芯片 经由其非活性表面与金属片结合。 此外，在活性表面上形成保护缓冲层以覆盖导电凸块，并且穿孔布置在半导体芯片的非活性表面周围。 此外，在金属板和穿孔中形成密封剂，用于封装半导体芯片并暴露保护缓冲层; 并且在密封剂和保护缓冲层上形成电路扇出层，并且具有穿过保护缓冲层并电连接到导电凸块的导电通孔。

公开(公告)号：US20120146209A1

公开(公告)日：2012-06-14

申请号：US13074467

申请日：2011-03-29

申请人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

发明人： Yu-Shan Hu ,  Dyi-Chung Hu ,  Tzyy-Jang Tseng

IPC分类号： H01L23/48 ,  H05K1/18 ,  H01L21/50

CPC分类号： H01L23/49827 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/1412 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10515 ,  H01L2924/00

摘要： A packaging substrate having a through-holed interposer embedded therein is provided, which includes: a molding layer having opposite first and second surfaces; a through-holed interposer embedded in the molding layer and flush with the second surface; a redistribution-layer structure embedded in the molding layer and disposed on the through-holed interposer and having a plurality of electrode pads exposed from the first surface of the molding layer; and a built-up structure disposed on the second surface of the molding layer and electrically connected to the through-holed interposer. By embedding the through-holed interposer in the molding layer and forming the built-up structure on the second surface of the molding layer, the present invention eliminates the need of a core board and reduces the thickness of the overall structure. Further, since the through-holed interposer has a CIE close to or the same as that of a silicon wafer, the structural reliability during thermal cycle testing is improved.

摘要翻译： 提供一种具有嵌入其中的通孔插入器的封装基板，其包括：具有相对的第一和第二表面的成型层; 嵌入在模制层中并与第二表面齐平的穿孔插入器; 重分布层结构，其嵌入在所述成型层中并且设置在所述穿孔插入件上，并且具有从所述成型层的第一表面露出的多个电极焊盘; 以及设置在模制层的第二表面上并与穿孔插入件电连接的组合结构。 通过将贯穿孔插入件嵌入成型层中并在成型层的第二表面上形成积层结构，本发明消除了对于芯板的需要并减小了整体结构的厚度。 此外，由于通孔插入器的CIE与硅晶片的CIE接近或相同，所以热循环测试期间的结构可靠性得到改善。

公开(公告)号：US08304923B2

公开(公告)日：2012-11-06

申请号：US11692933

申请日：2007-03-29

申请人： Dyi-Chung Hu ,  Yu-Shan Hu ,  Chih-Wei Lin

发明人： Dyi-Chung Hu ,  Yu-Shan Hu ,  Chih-Wei Lin

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L24/28 ,  H01L24/32 ,  H01L25/105 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/32057 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/1815 ,  H01L2924/01026 ,  H01L2924/01028

摘要： A chip packaging structure comprising a chip, a plurality of conductive pillars surrounding the chip, an encapsulation encapsulating the chip and the conductive pillars, and a connecting layer is provided. The encapsulation has a first side and a second side corresponding to the first side. The connecting layer is disposed at the first side of the encapsulation and electrically connected between the chip and the conductive pillars. Furthermore, a chip packaging process accompanying the chip packaging structure is also provided. The chip packaging structure is more useful and powerful and is suitable for various chip packaging applications, and the chip packaging process can reduce the manufacturing time and save the production cost.

摘要翻译： 一种芯片封装结构，包括芯片，围绕芯片的多个导电柱，封装芯片和导电柱的封装以及连接层。 封装具有对应于第一侧的第一侧和第二侧。 连接层设置在封装的第一侧并电连接在芯片和导电柱之间。 此外，还提供了伴随芯片封装结构的芯片封装工艺。 芯片封装结构更加实用，功能强大，适用于各种芯片封装应用，芯片封装工艺可以缩短制造时间，节省生产成本。