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    WAFER LEVEL IMAGE SENSOR PACKAGE WITH DIE RECEIVING CAVITY AND METHOD OF THE SAME
    1.
    发明申请
    WAFER LEVEL IMAGE SENSOR PACKAGE WITH DIE RECEIVING CAVITY AND METHOD OF THE SAME 审中-公开
    带有接收孔的滤波器水平图像传感器封装及其方法

    公开(公告)号：US20080191297A1

    公开(公告)日：2008-08-14

    申请号：US11673701

    申请日：2007-02-12

    申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Chih-Wei Lin ,  Chao-Nan Chou

    发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Chih-Wei Lin ,  Chao-Nan Chou

    IPC分类号： H01L31/0232 ,  H01L31/18

    CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/24227 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

    摘要： The present invention provides a structure of package comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and a through holes structure formed there through, wherein a terminal pads are formed under the through holes structure and the substrate includes a conductive trace formed on a lower surface of the substrate. A die is disposed within the die receiving cavity by adhesion and a dielectric layer formed on the die and the substrate. A re-distribution metal layer (RDL) is formed on the dielectric layer and coupled to the die and the through holes structure. Conductive bumps are coupled to the terminal pads. An opening is formed within the dielectric layer and a top protection layer to expose the micro lens area of the die for Image Sensor chip. A protection layer (film) be coated on the micro lens area with water repellent and oil repellent to away the particle contamination. A transparent cover with coated IR filter is optionally formed over the micron lens area for protection.

    摘要翻译： 本发明提供一种封装结构，其包括：衬底，其具有形成在衬底的上表面内的管芯容纳空腔和形成在其上的通孔结构，其中端子焊盘形成在通孔结构下方，并且衬底包括导电 痕迹形成在基底的下表面上。 通过粘合将模具设置在模具接收腔内，并且在模具和基板上形成介电层。 在介电层上形成再分配金属层（RDL），并与管芯和通孔结构相连。 导电凸块耦合到端子焊盘。 在电介质层内形成一个开口和一个顶部保护层，以露出图像传感器芯片的芯片的微透镜区域。 保护层（膜）涂覆在微透镜区域上，具有防水和防油性，以消除颗粒污染。 可选地，在微透镜区域上形成具有涂覆的IR滤光器的透明盖，用于保护。

    TOOLS STRUCTURE FOR CHIP REDISTRIBUTION AND METHOD OF THE SAME
    10.
    发明申请
    TOOLS STRUCTURE FOR CHIP REDISTRIBUTION AND METHOD OF THE SAME 审中-公开
    用于芯片重新分配的工具结构及其相关方法

    公开(公告)号：US20080142939A1

    公开(公告)日：2008-06-19

    申请号：US11609944

    申请日：2006-12-13

    申请人： Wen-Kun Yang ,  Chun-Hui Yu ,  Chih-Wei Lin

    发明人： Wen-Kun Yang ,  Chun-Hui Yu ,  Chih-Wei Lin

    IPC分类号： H01L23/12 ,  H01L21/58

    CPC分类号： H01L24/96 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/68368 ,  H01L2224/29014 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01094 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

    摘要： The present invention discloses a tool structure for chip redistribution and method of chip redistribution. The tool structure comprises a base substrate, a separable adhesion film formed on the base substrate, and the patterned glues placed on the separable adhesion film for fixating the dice covered by the core paste materials formed on a fixed substrate. The fixed substrate is bonding on the core paste materials and dice to form the panel wafer. The method comprises printing the pluralities of patterned glues placed on the separable adhesion film and the bonding pluralities of dice covered by the core paste materials, and then, the fixed substrate is bonding on the core paste materials and pluralities of dice. The method further comprises curing and separating the glues and the pluralities of dice with the fixed substrate, and then cleaning the residual glues on the panel wafer (pluralities of dice).

    摘要翻译： 本发明公开了一种用于芯片再分配的工具结构和芯片再分配方法。 工具结构包括基底基底，形成在基底基底上的可分离粘合膜，以及放置在可分离粘合膜上的图案化胶，用于固定由形成在固定基底上的芯糊材料覆盖的骰子。 固定基板粘合在芯糊材料和芯片上以形成面板晶片。 该方法包括印刷放置在可分离粘合膜上的多个图案化胶和由芯糊材料覆盖的多个骰子的接合，然后固定的基底粘合在芯糊材料和多个骰子上。 该方法还包括用固定基板固化和分离胶水和多个骰子，然后清洁面板晶片上的残留胶（多个骰子）。