公开(公告)号：US20140071689A1

公开(公告)日：2014-03-13

申请号：US13835075

申请日：2013-03-15

申请人： Yeo Chan Yoon ,  Jae Hwan Jung ,  Sung Joo Oh ,  Jin Seong Kim

发明人： Yeo Chan Yoon ,  Jae Hwan Jung ,  Sung Joo Oh ,  Jin Seong Kim

IPC分类号： F21V7/00 ,  F21V13/04 ,  F21V13/08

CPC分类号： F21V7/00 ,  F21V13/04 ,  F21V13/08 ,  H01L33/405 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/1301 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed are a light emitting device. The light emitting device includes a body having a cavity; a plurality of lead frames in the cavity; a light emitting chip; a first molding member having a first metal oxide material around the light emitting chip; and a second molding member having a second metal oxide material on the first molding member and the light emitting chip, wherein the light emitting chip includes a reflective electrode layer under a light emitting structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting chip and a lateral side of the reflective electrode layer at a predetermined curvature, and wherein a bottom surface of the second molding member includes a curved surface which is convex toward the first molding member.

摘要翻译： 公开了一种发光器件。 发光装置包括具有空腔的主体; 空腔中的多个引线框架; 发光芯片; 具有围绕所述发光芯片的第一金属氧化物材料的第一模制构件; 以及在所述第一模制件和所述发光芯片上具有第二金属氧化物材料的第二模制构件，其中所述发光芯片包括在发光结构下的反射电极层，其中所述第一模制构件的顶表面从 在所述发光芯片的上表面与所述反射电极层的侧面之间的预定曲率的区域，并且其中所述第二成型构件的底面包括朝向所述第一成型构件凸出的弯曲表面。

公开(公告)号：US20140070249A1

公开(公告)日：2014-03-13

申请号：US13835555

申请日：2013-03-15

申请人： Yeo Chan Yoon ,  Sung Joo Oh ,  Jae Hwan Jung ,  Jin Seong Kim ,  Bong Kul Min

发明人： Yeo Chan Yoon ,  Sung Joo Oh ,  Jae Hwan Jung ,  Jin Seong Kim ,  Bong Kul Min

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L33/54 ,  H01L2224/16 ,  H01L2924/1301 ,  H01L2924/00

摘要： A light emitting device according to the embodiment includes a body; a first lead electrode having a first bonding part and a second bonding part; a second lead electrode having a third bonding part and a fourth bonding part; a gap part between the first and second lead electrodes; a third lead electrode on a bottom surface of the body; a fourth lead electrode on the bottom surface of the body; a first connection electrode; a second connection electrode; a light emitting chip; and a first bonding member, wherein the gap part includes a first gap part disposed between the first and third bonding parts, and the first gap part includes first and second regions spaced apart from each other corresponding to a width of the third bonding part, and a third region connected to the first and second regions and disposed perpendicularly to the first and second regions.

摘要翻译： 根据实施例的发光器件包括主体; 具有第一接合部和第二接合部的第一引线电极; 具有第三接合部和第四接合部的第二引线电极; 第一和第二引线电极之间的间隙部分; 主体底面上的第三引线电极; 身体底面上的第四引线电极; 第一连接电极; 第二连接电极; 发光芯片; 和第一接合部件，其中所述间隙部分包括设置在所述第一和第三接合部之间的第一间隙部分，并且所述第一间隙部分包括与所述第三接合部的宽度相对应的彼此间隔开的第一和第二区域，以及 连接到第一和第二区域并垂直于第一和第二区域设置的第三区域。

公开(公告)号：US20140070259A1

公开(公告)日：2014-03-13

申请号：US13836574

申请日：2013-03-15

申请人： Yeo Chan YOON ,  Jae Hwan Jung ,  Yun Shick Eom ,  Ki Rok Hur ,  Jin Seong Kim

发明人： Yeo Chan YOON ,  Jae Hwan Jung ,  Yun Shick Eom ,  Ki Rok Hur ,  Jin Seong Kim

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01015

摘要： Disclosed are a light emitting device and a lighting system having the same. The light emitting device includes a body including first and second lateral side parts, third and fourth lateral side parts, and a cavity, a first lead frame extending in a direction of the first lateral side part of the body, a second lead frame extending in a direction of the second lateral side part of the body, a gap part between the first and second lead frames, and a molding member in the cavity. The first lead frame includes a first recess part having a first depth, and a second recess part recessed at a second depth in a region adjacent to the first lateral side part of the body, and the first depth of the first recess part is different from the second depth of the second recess part.

摘要翻译： 公开了一种发光器件和具有该发光器件的照明系统。 发光装置包括主体，该主体包括第一和第二横向侧部，第三和第四横向侧部，以及空腔，沿主体的第一横向侧部分的方向延伸的第一引线框架， 主体的第二横向侧部分的方向，第一和第二引线框架之间的间隙部分和空腔中的模制部件。 第一引线框架包括具有第一深度的第一凹部和在与主体的第一侧面侧相邻的区域中的第二深度凹陷的第二凹部，并且第一凹部的第一深度不同于 第二凹部的第二深度。

公开(公告)号：US08338229B1

公开(公告)日：2012-12-25

申请号：US12846973

申请日：2010-07-30

申请人： Ludovico E. Bancod ,  Jin Seong Kim ,  Kurt Peter Wachtler

发明人： Ludovico E. Bancod ,  Jin Seong Kim ,  Kurt Peter Wachtler

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/16225 ,  H01L2924/00

摘要： A method of forming a stackable plasma cleaned via package includes forming interconnection balls on terminals. The interconnection balls are encapsulated in a package body, e.g., molding compound. Via apertures are formed through the package body to expose the interconnection balls, wherein a contamination is formed on the interconnection balls. The contamination is removed using a plasma cleaning process. By removing the contamination, robust reflow of the interconnection balls is insured thus maximizing yield. Further, the plasma cleaning process is a cost efficient high volume process with no adverse effect on package reliability.

摘要翻译： 通过封装形成可堆叠等离子体清洗的方法包括在端子上形成互连球。 互连球被封装在包装体中，例如模塑料。 通过孔通过封装体形成露出互连球，其中在互连球上形成污染物。 使用等离子体清洗工艺除去污染物。 通过去除污染，保证互连球的稳定的回流，从而使产量最大化。 此外，等离子体清洗过程是成本有效的高体积过程，对包装可靠性没有不利影响。

公开(公告)号：US07091571B1

公开(公告)日：2006-08-15

申请号：US10735184

申请日：2003-12-11

申请人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

发明人： Sung Soon Park ,  Jin Seong Kim ,  Young Ho Kim

IPC分类号： H01L31/0232 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H05K1/189 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed is an image sensor package and a method for manufacturing the same. The image sensor package comprises an image sensor die, a substrate, a support wall having screw threads on the outer peripheral surface thereof and a mount into which a barrel including a plurality of lenses and an infrared blocking glass is mounted. The screw threads formed on the outer peripheral surface of the support wall are engaged with those formed on the inner peripheral surface of the mount. At least one passive element is provided on the substrate at the outer peripheral side of the support wall, thereby increasing the packaging density of the image sensor package.

摘要翻译： 公开了一种图像传感器封装及其制造方法。 图像传感器封装包括图像传感器芯片，基板，在其外周表面上具有螺纹的支撑壁和安装有安装有多个透镜和红外阻挡玻璃的镜筒的安装件。 形成在支撑壁的外周面上的螺纹与安装件的内周面上形成的螺纹接合。 在支撑壁的外周侧的基板上设置至少一个无源元件，从而增加图像传感器封装的封装密度。

公开(公告)号：US09721872B1

公开(公告)日：2017-08-01

申请号：US13398646

申请日：2012-02-16

申请人： Louis W. Nicholls ,  Roger D. St. Amand ,  Jin Seong Kim ,  Woon Kab Jung ,  Sung Jin Yang ,  Robert F. Darveaux

发明人： Louis W. Nicholls ,  Roger D. St. Amand ,  Jin Seong Kim ,  Woon Kab Jung ,  Sung Jin Yang ,  Robert F. Darveaux

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L23/48

CPC分类号： H01L23/48 ,  H01L21/4846 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/5389 ,  H01L2224/13025 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107

摘要： A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.

公开(公告)号：US08089145B1

公开(公告)日：2012-01-03

申请号：US12272606

申请日：2008-11-17

申请人： Gwang Ho Kim ,  Jin Seong Kim ,  Dong Joo Park ,  Dae Byoung Kang

发明人： Gwang Ho Kim ,  Jin Seong Kim ,  Dong Joo Park ,  Dae Byoung Kang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495 ,  H01L23/02 ,  H01L29/40 ,  H01L23/28

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00

摘要： In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.

摘要翻译： 根据本发明，提供了包括唯一配置的引线框的半导体封装（例如，QFP封装），其尺寸和配置为使半导体封装中的暴露引线的可用数量最大化。 更具体地，本发明的半导体封装包括限定多个周边边缘段的大致平面的管芯焊盘或管芯焊盘。 此外，半导体封装包括多个引线。 这些引线中的一些以两个同心的行或环提供，其至少部分地绕过管芯焊盘，其他引线包括从半导体封装的封装主体的相应侧表面突出的部分。 连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到至少一些引线。 芯片焊盘，引线和半导体管芯的至少一部分被封装体封装。

公开(公告)号：US20070208594A1

公开(公告)日：2007-09-06

申请号：US11513813

申请日：2006-08-31

申请人： Young Kwon Yang ,  Jin Seong Kim ,  Ji Seung Lee ,  Keun Ho Bang ,  Byoung Min Lee

发明人： Young Kwon Yang ,  Jin Seong Kim ,  Ji Seung Lee ,  Keun Ho Bang ,  Byoung Min Lee

IPC分类号： G06Q10/00 ,  H04M15/00 ,  G06Q40/00

CPC分类号： G06F19/328 ,  G06F19/00 ,  G06Q20/102 ,  G06Q30/04 ,  G06Q50/22

摘要： Disclosed is a method for electronic examination of medical fees, and more particularly to a method for electronic examination of medical fees using a system for electronic examination of medical fees. The system includes a transmit/receive server, a bill examination server, a management terminal and examiner terminals, and communicates with each medical institution server and a national health insurance corporation server. The bill examination server checks any error in medical bills and specifications received from each medical institution server through description inspection, automatic inspection, specialist inspection and computational examination. The bill examination server returns, corrects or adjusts any erroneous bill or specification, or inserts a message into the erroneous bill or specification. The management terminal distributes medical bills and specifications on which computational examination has been completed to the examiner terminals. Each examiner terminal produces a statement of examination adjustment according to the examination results inputted by an examiner during on-screen examination and sends the statement to the bill examination server. Then the bill examination server generates an examination decision file based on the examination results and sends the file to the corresponding medical institution server and simultaneously to the national health insurance corporation server.

摘要翻译： 公开了一种医疗费的电子化检查方法，更具体地说，涉及使用电子检查医疗费用系统电子检查医疗费用的方法。 该系统包括发送/接收服务器，账单检查服务器，管理终端和审查者终端，并与每个医疗机构服务器和国家健康保险公司服务器进行通信。 票据检查服务器通过描述检查，自动检查，专家检查和计算检查，检查从医疗机构服务器收到的医疗费用和规格的错误。 帐单检查服务器返回，纠正或调整任何错误的帐单或规格，或将错误的帐单或规格插入消息。 管理终端向检查员终端分发完成了计算检查的医疗费用和规格。 每个检验员终端根据检查员在屏幕检查期间输入的检查结果生成检查调整表，并将该陈述发送给帐单检查服务器。 然后，票据检查服务器根据检查结果生成检查决定文件，并将文件发送到相应的医疗机构服务器，同时发送给国家健康保险公司服务器。

公开(公告)号：US20140097744A1

公开(公告)日：2014-04-10

申请号：US13921780

申请日：2013-06-19

申请人： Shunichi KUBOTA ,  Jin Seong Kim

发明人： Shunichi KUBOTA ,  Jin Seong Kim

IPC分类号： C09K11/77 ,  H05B33/14

CPC分类号： C09K11/7728 ,  C09K11/7734 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/181 ,  H05B33/14 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A phosphor and a light emitting device including the phosphor may be provided that emits light having a peak wavelength between a green wavelength band and a yellow wavelength band and has a triclinic system crystal structure of which the chemical formula is MSi2N2O2, M═CaxSryEuz(x+y+z=1), wherein, when three sides of a unit crystal lattice of the crystal structure are a, b and c and corner angles are α, β and γ, the crystal structure has relationships of a≠b≠c and α≠β≠γ, and wherein, in a, b and c, any one of them is more than twice as much as one of the other two, and the values of the other two are so similar that they do not exceed the double of each.

摘要翻译： 可以提供一种荧光体和包括该荧光体的发光器件，其发射具有绿色波长带和黄色波长带之间的峰值波长的光，并且具有其化学式为MSi2N2O2，M=CaxSryEuz（x）的三斜晶系​​晶体结构 + y + z = 1），其中，当晶体结构的单晶晶格的三边为a，b和c，角角为α，＆bgr; 和γ，晶体结构具有≠b≠c和α≠＆bgr;≠γ的关系，并且其中，在a，b和c中，其中任何一个都是其他两个之一的两倍以上，以及 其他两个的值是相似的，它们不超过每个的两倍。

公开(公告)号：US08525318B1

公开(公告)日：2013-09-03

申请号：US12943540

申请日：2010-11-10

申请人： Jin Seong Kim ,  Dong Joo Park ,  Kwang Ho Kim ,  Ye Sul Ahn

发明人： Jin Seong Kim ,  Dong Joo Park ,  Kwang Ho Kim ,  Ye Sul Ahn

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed are a semiconductor device capable of efficiently radiating heat of a semiconductor die and a method of fabricating the same. The semiconductor device efficiently radiates the heat by preventing an encapsulant from reaching the semiconductor die by an encapsulant dam so that an upper surface of the semiconductor die is exposed out of the encapsulant. In addition, the semiconductor device is configured to expose a pre-solder ball or a conductive pattern of a substrate through a via of the encapsulant. Therefore, electrical connection between the pre-solder ball and a solder ball of another semiconductor device stacked thereon is easily achieved.

摘要翻译： 公开了能够有效地辐射半导体管芯的热的半导体器件及其制造方法。 半导体器件通过防止密封剂通过密封剂坝到达半导体管芯而有效地散热，使得半导体管芯的上表面暴露于密封剂外。 此外，半导体器件被配置为通过密封剂的通孔来暴露衬底的预焊球或导电图案。 因此，可以容易地实现预焊球与另一半导体器件的焊球之间的电连接。