公开(公告)号：US09893018B2

公开(公告)日：2018-02-13

申请号：US14712382

申请日：2015-05-14

申请人： Yeong-Kwon Ko ,  Tae-Hyeong Kim ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

发明人： Yeong-Kwon Ko ,  Tae-Hyeong Kim ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

IPC分类号： H01L23/544 ,  H01L25/065 ,  B23K26/00 ,  H01L21/768

CPC分类号： H01L23/544 ,  B23K26/53 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/5448 ,  H01L2224/16225 ,  H01L2225/06541 ,  H01L2225/06593

摘要： Semiconductor devices and methods for manufacturing a semiconductor device include a first semiconductor substrate in which a first scribe line region and a first chip region are defined, a first alignment mark inside the first semiconductor substrate and in the first scribe line region so as to be spaced apart from an upper side of the first semiconductor substrate, a second semiconductor substrate on the first semiconductor substrate and in which a second scribe line region and a second chip region are defined, and a second alignment mark inside the second semiconductor substrate and in the second scribe line region so as to be spaced apart from an upper side of the second semiconductor substrate, wherein the second semiconductor substrate is on the first semiconductor substrate so that positions of the first alignment mark and the second alignment mark correspond to each other.

公开(公告)号：US09449930B2

公开(公告)日：2016-09-20

申请号：US14813084

申请日：2015-07-29

申请人： Tae-Hyeong Kim ,  Yeong-Kwon Ko ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

发明人： Tae-Hyeong Kim ,  Yeong-Kwon Ko ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

IPC分类号： H01L23/04 ,  H01L23/48 ,  H01L23/52 ,  H01L21/44 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00

CPC分类号： H01L24/06 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/034 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06 ,  H01L2224/0605 ,  H01L2224/06181 ,  H01L2224/065 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/119 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1405 ,  H01L2224/14181 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2224/05624 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/0347 ,  H01L2224/113 ,  H01L2924/00

摘要： A semiconductor device, a semiconductor package, and a package stack structure include a semiconductor substrate, a first bonding pad disposed on a first surface of the semiconductor substrate, and a first pillar disposed on the first bonding pad. An upper surface of the first pillar has a concave shape. Side surfaces of the first pillar are substantially planar.

摘要翻译： 半导体器件，半导体封装和封装堆叠结构包括半导体衬底，设置在半导体衬底的第一表面上的第一焊盘和设置在第一焊盘上的第一柱。 第一支柱的上表面具有凹形。 第一柱的侧表面基本上是平面的。