公开(公告)号：US20100025849A1

公开(公告)日：2010-02-04

申请号：US12489409

申请日：2009-06-22

申请人： Yong Chuan KOH ,  Jimmy SIAT ,  Jeffrey Nantes SALAMAT ,  Lope Vallespin PEPITO, JR. ,  Ronaldo Cayetano CALDERON ,  Rodel MANALAC ,  Pang Hup ONG ,  Kian Teng ENG

发明人： Yong Chuan KOH ,  Jimmy SIAT ,  Jeffrey Nantes SALAMAT ,  Lope Vallespin PEPITO, JR. ,  Ronaldo Cayetano CALDERON ,  Rodel MANALAC ,  Pang Hup ONG ,  Kian Teng ENG

IPC分类号： H01L23/498 ,  H01L21/60 ,  B23K31/02

CPC分类号： H01L25/0657 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48478 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85395 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85447 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4826 ,  H01L2924/00015 ,  H01L2924/01049 ,  H01L2924/01006

摘要： A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate and a second contact region is disposed on the die. The first contact region, for example, comprises copper coated with an OSP material. A copper wire bond electrically couples the first and second contact regions. Wire bonding includes forming a ball bump on the first contact region having a flat top surface. Providing the flat top surface is achieved with a smoothing process. A ball bond is formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.

摘要翻译： 公开了一种用于构造封装的半导体封装和方法。 该包装包括一个基片和一个附着于其上的管芯。 第一接触区域设置在基板上，并且第二接触区域设置在管芯上。 第一接触区域例如包括用OSP材料涂覆的铜。 铜线接合电耦合第一和第二接触区域。 线接合包括在具有平坦顶表面的第一接触区域上形成球凸点。 通过平滑处理实现提供平坦的顶面。 在第二接触区域上形成球接合，然后将线缝合到第一接触区域上的球凸块的平坦顶表面上。

公开(公告)号：US20090165815A1

公开(公告)日：2009-07-02

申请号：US12326908

申请日：2008-12-03

申请人： Debbie Tuerca ALCALA ,  Hendri Yanto KWEE ,  Michael TI-IN ,  Kian Teng ENG ,  Rodel MANALAC ,  Jimmy SIAT

发明人： Debbie Tuerca ALCALA ,  Hendri Yanto KWEE ,  Michael TI-IN ,  Kian Teng ENG ,  Rodel MANALAC ,  Jimmy SIAT

IPC分类号： H05H1/00 ,  B08B7/00

CPC分类号： H01L24/97 ,  B08B7/0035 ,  H01L21/67028 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/85013 ,  H01L2224/85913 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A plasma clean tool that includes a cleaning chamber for cleaning an article by plasma cleaning and a charge shield for surrounding an article to be cleaned is presented. The charge shield prevents charged components of plasma from passing therethrough to charge the article during plasma cleaning of the article.

摘要翻译： 提供了一种等离子体清洁工具，其包括用于通过等离子体清洁来清洁物品的清洁室和用于包围待清洁物品的电荷屏蔽物。 电荷屏蔽防止等离子体的带电组分通过其中，以在物品的等离子体清洁期间对物品充电。

公开(公告)号：US20090008796A1

公开(公告)日：2009-01-08

申请号：US11965252

申请日：2007-12-27

申请人： Kian Teng Eng ,  Wolfgang Johannes HETZEL ,  Werner Josef REISS ,  Florian AMMER ,  Yong Chuan KOH ,  Jimmy SIAT

发明人： Kian Teng Eng ,  Wolfgang Johannes HETZEL ,  Werner Josef REISS ,  Florian AMMER ,  Yong Chuan KOH ,  Jimmy SIAT

IPC分类号： H01L23/49 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85375 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/48471 ,  H01L2924/00015 ,  H01L2924/01049 ,  H01L2224/4554 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2224/43848

摘要： Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and the first semiconductor chip has an Organic Solderability Preservative (OSP) material coated on at least a portion of one surface, and the first copper wire is wire bonded through the OSP material to the first substrate and the first semiconductor chip.

摘要翻译： 提供一种半导体封装及其构造方法，包括第一基板，附接到第一基板的第一半导体芯片和第一铜线。 第一衬底和第一半导体芯片中的至少一个具有涂覆在一个表面的至少一部分上的有机可焊性防腐剂（OSP）材料，并且第一铜线通过OSP材料引线键合到第一衬底，并且第一衬底 半导体芯片