公开(公告)号：US20100027261A1

公开(公告)日：2010-02-04

申请号：US12525166

申请日：2007-07-20

申请人： Katsunori Yashima ,  Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima ,  Takuya Okada ,  Keiji Takano ,  Toshikatsu Mitsunaga

发明人： Katsunori Yashima ,  Takeshi Miyakawa ,  Kenji Miyata ,  Taiki Nishi ,  Yoshihiko Okajima ,  Takuya Okada ,  Keiji Takano ,  Toshikatsu Mitsunaga

IPC分类号： F21S4/00

CPC分类号： C09J133/02 ,  C08K3/22 ,  C08K7/00 ,  C09J7/25 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2483/006 ,  G02F1/133603 ,  G02F2001/133628 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2203/0191

摘要： To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life.An LED light source unit comprising a printed board, at least one light emitting diode provided on the printed board, and an adhesive tape for fixing the printed board on the surface of a heat dissipating member, wherein the thermal conductivity of the adhesive tape is from 1 to 4 W/mK, and the withstand voltage between a rear side conductor circuit and a metal housing is at least 1.0 kV.

摘要翻译： 提供散热性能优异的LED光源单元，能够防止LED损坏，亮度高，寿命长。 一种LED光源单元，包括印刷电路板，设置在印刷电路板上的至少一个发光二极管和用于将印刷电路板固定在散热构件表面上的胶带，其中胶带的导热率来自 1〜4W / mK，后侧导体电路与金属外壳之间的耐电压为1.0kV以上。

公开(公告)号：US20090279300A1

公开(公告)日：2009-11-12

申请号：US12302035

申请日：2007-05-31

申请人： Yoshihiko Okajima ,  Katsunori Yashima ,  Toshikatsu Mitsunaga ,  Takuya Okada

发明人： Yoshihiko Okajima ,  Katsunori Yashima ,  Toshikatsu Mitsunaga ,  Takuya Okada

IPC分类号： F21S4/00

CPC分类号： H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2203/0191

摘要： To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life.An LED light source unit comprising a printed board, at least one light emitting diode provided on the printed board, and an adhesive tape for fixing the printed board on the surface of a heat dissipating member, wherein the thermal conductivity of the adhesive tape is from 1 to 4 W/mK, and the withstand voltage between the fixing face of the printed board and the fixing face of the heat dissipating member is at least 1.0 kV.

摘要翻译： 提供散热性能优异的LED光源单元，能够防止LED损坏，亮度高，寿命长。 一种LED光源单元，包括印刷电路板，设置在印刷电路板上的至少一个发光二极管和用于将印刷电路板固定在散热构件表面上的胶带，其中胶带的导热率来自 1〜4W / mK，印刷电路板的固定面与散热构件的固定面之间的耐电压为1.0kV以上。

公开(公告)号：US08071882B2

公开(公告)日：2011-12-06

申请号：US11911914

申请日：2006-04-19

申请人： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

发明人： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

IPC分类号： H05K1/03

CPC分类号： H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

摘要： To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it. A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it.

摘要翻译： 为了提供一种薄的金属基底电路板，其不仅可以安装在平坦部分上，而且可以紧密地附接到壳体的侧面或底面，或者台阶或弯曲部分，并且散热性能优异，电绝缘性能 灵活性; 一个生产过程; 和混合集成电路，LED模块和采用它的明亮，超长寿命的LED光源。 具有交替层叠绝缘层和导电电路或金属箔的金属基电路板，其特征在于，各导电电路或金属箔的厚度为5μm〜450μm，绝缘层由树脂组合物的固化物 包括无机填料和热固性树脂，并且每个绝缘层的厚度为9μm至300μm; 和采用它的混合电路板。

公开(公告)号：US20090032295A1

公开(公告)日：2009-02-05

申请号：US11911914

申请日：2006-04-19

申请人： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

发明人： Yoshihiko Okajima ,  Katsunori Yashima ,  Keiji Takano ,  Takuya Okada

IPC分类号： H05K1/00 ,  H05K1/16

CPC分类号： H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

摘要： To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it.A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it. The metal base circuit board wherein a coverlay is provided, and a layer having a magnetic loss or a layer having a dielectric loss is laminated on the surface of the coverlay. A LED light source unit having at least one light-emitting diode (LED) mounted on the conductive circuit.

摘要翻译： 为了提供一种薄的金属基底电路板，其不仅可以安装在平坦部分上，而且可以紧密地附接到壳体的侧面或底部表面，或者可以是阶梯状或弯曲部分，并且散热性能优异，电绝缘性能 灵活性; 一个生产过程; 和混合集成电路，LED模块和采用它的明亮，超长寿命的LED光源。 具有交替层叠绝缘层和导电电路或金属箔的金属基电路板，其特征在于，每个导电电路或金属箔的厚度为5μm至450μm，每个绝缘层由树脂组合物的固化产物 包括无机填料和热固性树脂，并且每个绝缘层的厚度为9μm至300μm; 和采用它的混合电路板。 提供覆盖层的金属基底电路板，具有磁损耗的层或具有介电损耗的层层叠在覆盖层的表面上。 一种LED光源单元，其具有安装在导电电路上的至少一个发光二极管（LED）。

公开(公告)号：US20130056439A1

公开(公告)日：2013-03-07

申请号：US13696890

申请日：2011-04-06

申请人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

发明人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

IPC分类号： H05K3/20

CPC分类号： H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062

摘要： A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.

摘要翻译： 提供一种在金属基材料上制造具有绝缘粘合剂层和导体层的金属基底基板的方法。 该方法包括将分散相分散在含有润湿分散剂并构成绝缘粘合剂层的绝缘粘合剂分散介质中的步骤; 将导体箔上的绝缘性粘合剂层叠的方法，是将该辊状导体箔进行输送; 将导体箔上的绝缘粘合剂加热固化成B阶段状态，从而在B阶段形成导体箔和绝缘粘合剂层的复合物; 在B阶段的状态下将金属基材料层叠在绝缘性粘合剂层上，得到层叠体; 然后通过层叠体的热加压将B阶状态的绝缘性粘合层固化成C阶段状态。

公开(公告)号：US07709939B2

公开(公告)日：2010-05-04

申请号：US10553076

申请日：2004-04-15

申请人： Naomi Yonemura ,  Katsunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

发明人： Naomi Yonemura ,  Katsunori Yashima ,  Yoshihiko Tsujimura ,  Hidenori Ishikura ,  Takashi Saiki

IPC分类号： H01L23/02

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05666 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48472 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48666 ,  H01L2224/48711 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48766 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/4911 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/19051 ,  H01L2924/30105 ,  H05K1/0224 ,  H05K1/024 ,  H05K1/025 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09745 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48824 ,  H01L2224/48744 ,  H01L2224/4876 ,  H01L2224/4866

摘要： A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.

摘要翻译： 用于混合集成电路的金属基底电路板，包括经由绝缘层设置在金属板上的电路，安装在电路上的功率半导体以及控制半导体以控制电路上的功率半导体。 优选地，将低电容部分嵌入在其上安装有控制半导体的电路部分的下方。 低电容部由含有无机填料的树脂构成，介电常数为2〜9。

公开(公告)号：US08796145B2

公开(公告)日：2014-08-05

申请号：US13696890

申请日：2011-04-06

申请人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

发明人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

IPC分类号： H01L21/302 ,  H01L21/461 ,  H05K3/02 ,  H05K1/05

CPC分类号： H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062

摘要： A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.

摘要翻译： 提供一种在金属基材料上制造具有绝缘粘合剂层和导体层的金属基底基板的方法。 该方法包括将分散相分散在含有润湿分散剂并构成绝缘粘合剂层的绝缘粘合剂分散介质中的步骤; 将导体箔上的绝缘性粘合剂层叠的方法，是将该辊状导体箔进行输送; 将导体箔上的绝缘粘合剂加热固化成B阶段状态，从而在B阶段形成导体箔和绝缘粘合剂层的复合物; 在B阶段的状态下将金属基材料层叠在绝缘性粘合剂层上，得到层叠体; 然后通过层叠体的热加压将B阶状态的绝缘性粘合层固化成C阶段状态。