公开(公告)号：US20240105667A1

公开(公告)日：2024-03-28

申请号：US18263000

申请日：2022-01-25

申请人： TANAKA DENSHI KOGYO K.K. ,  MITSUBISHI ELECTRIC CORPORATION

发明人： Shuichi MITOMA ,  Tsukasa ICHIKAWA ,  Tsuyoshi URAJI ,  Tatsunori YANAGIMOTO ,  Dai NAKAJIMA

IPC分类号： H01L23/00 ,  C22C21/00 ,  C22F1/00 ,  C22F1/04

CPC分类号： H01L24/45 ,  C22C21/00 ,  C22F1/002 ,  C22F1/04 ,  H01L24/05 ,  H01L24/48 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05138 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05663 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/29139 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45105 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/4516 ,  H01L2224/45172 ,  H01L2224/4801 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091

摘要： An aluminum wire with which, at the time of bonding a bonding wire for a power semiconductor, the wire is not detached from a wedge tool, and a long life is achieved in a power cycle test. The aluminum wire is made of an aluminum alloy having an aluminum purity of 99 mass % or more and contains, relative to a total amount of all elements of the aluminum alloy, a total of 0.01 mass % or more and 1 mass % or less of iron and silicon. In a lateral cross-section in a direction perpendicular to a wire axis of the aluminum wire, an orientation index of is 1 or more, an orientation index of is 1 or less, and an area ratio of precipitated particles is in a range of 0.02% or more to 2% or less.

公开(公告)号：US09536855B2

公开(公告)日：2017-01-03

申请号：US14784127

申请日：2014-03-27

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Koji Yamazaki ,  Takeshi Araki

IPC分类号： H01L23/00 ,  B23K20/00 ,  B23K35/30 ,  C22C5/06 ,  H01L23/495 ,  H01L23/49

CPC分类号： H01L24/49 ,  B23K20/004 ,  B23K35/3006 ,  C22C5/06 ,  H01L23/49 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/26175 ,  H01L2224/2733 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/32507 ,  H01L2224/4501 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/48225 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/49173 ,  H01L2224/83011 ,  H01L2224/83014 ,  H01L2224/8309 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/85801 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device includes, an alloy layer sandwiched between a first Ag layer formed on a mounting board or circuit board and a second Ag layer formed on a semiconductor element, wherein the alloy layer contains an intermetallic compound of Ag3Sn formed by Ag components of the first Ag layer and the second Ag layer and Sn, and wherein a plurality of wires containing Ag are arranged extended from an outside-facing periphery of the alloy layer.

摘要翻译： 半导体装置包括：夹在形成于安装基板或电路基板上的第一Ag层与形成在半导体元件上的第二Ag层之间的合金层，其中，所述合金层含有由所述第一Ag的Ag成分形成的Ag 3 Sn的金属间化合物， Ag层和第二Ag层和Sn，并且其中包含Ag的多个布线从合金层的面向外周延伸设置。

公开(公告)号：US20090026480A1

公开(公告)日：2009-01-29

申请号：US12179327

申请日：2008-07-24

申请人： Masaki HAYASHI ,  Yuji Okada ,  Koji Kuroda

发明人： Masaki HAYASHI ,  Yuji Okada ,  Koji Kuroda

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/46 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/45184 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00015

摘要： Provided is a light emitting device with high extraction efficiency, in which absorption of light by a conductive wire is prevented effectively. The light emitting device includes a conductive wire electrically connecting an electrode of a light emitting element and an electrically conductive member. The surface of the bonding portion of the conductive wire between the conductive wire and at least one of the electrode of the light emitting element and the electrically conductive member is covered with a metal film. The reflectivity of the metal film is higher than that of the conductive wire at the emission peak wavelength of the light emitting element.

摘要翻译： 提供了一种具有高提取效率的发光器件，其中有效地防止了由导线吸收光。 发光器件包括将发光元件的电极和导电构件电连接的导线。 在导线与发光元件的电极和导电部件的至少一个之间的导线的接合部分的表面被金属膜覆盖。 在发光元件的发射峰值波长处，金属膜的反射率高于导线的反射率。

公开(公告)号：US20080197461A1

公开(公告)日：2008-08-21

申请号：US11706193

申请日：2007-02-15

申请人： Chen-Hua Yu ,  Hui-Lin Chang ,  Yung-Cheng Lu ,  Mirng-Ji Lii ,  Yung-Ching Chen

发明人： Chen-Hua Yu ,  Hui-Lin Chang ,  Yung-Cheng Lu ,  Mirng-Ji Lii ,  Yung-Ching Chen

IPC分类号： H01L21/60 ,  B23K37/00 ,  H01L23/495

CPC分类号： H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45012 ,  H01L2224/45013 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4516 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/00 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An apparatus for wire bonding and a capillary tool thereof are provided. An exemplary embodiment of a capillary tool capable of a wire bonding comprises a body having a first internal channel of a first diameter for accommodating a flow of a conductive wire. A compressible head is connected to the body, having a second internal channel of a second diameter for accommodating the flow of the conductive wire, wherein the first diameter is fixed and the second diameter is variable, the second diameter is not more than the first diameter and a diameter the conductive wire flowed through the compressible head is adjustable. An integrated circuit (IC) package is also provided.

摘要翻译： 提供一种用于引线接合的装置及其毛细管工具。 能够引线接合的毛细管工具的示例性实施例包括具有用于容纳导线流动的第一直径的第一内部通道的主体。 可压缩头连接到主体，具有用于容纳导线流动的第二直径的第二内部通道，其中第一直径是固定的，第二直径是可变的，第二直径不大于第一直径 并且流过可压缩头的导线的直径是可调节的。 还提供集成电路（IC）封装。

公开(公告)号：US07138725B2

公开(公告)日：2006-11-21

申请号：US10954181

申请日：2004-10-01

申请人： Hiroshi Horibe

发明人： Hiroshi Horibe

IPC分类号： H01L23/48 ,  H01L23/485

CPC分类号： H01L23/50 ,  H01L23/4952 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/48095 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/85399 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： In order to provide a downsized semiconductor device increased in function level with output terminals arranged along at least three sides of a semiconductor chip, the semiconductor device includes a semiconductor chip having a row of aggregated pads arranged on a main surface, and a row of output terminals arranged along at least three sides at a perimeter of the semiconductor chip, wire-bonded with the row of aggregated pads.

摘要翻译： 为了提供在半导体芯片的至少三侧布置的输出端子的功能水平增加的小型化半导体器件，半导体器件包括半导体芯片，其具有排列在主表面上的一排聚集焊盘和一排输出 端子沿半导体芯片的周边至少三边布置，与一排聚集的焊盘导线接合。

公开(公告)号：US6140583A

公开(公告)日：2000-10-31

申请号：US864339

申请日：1997-05-28

申请人： Satoshi Suzuki ,  Morimasa Tanimoto

发明人： Satoshi Suzuki ,  Morimasa Tanimoto

IPC分类号： C23C28/02 ,  H01L21/60 ,  H01L23/48 ,  H01L23/49 ,  H01L23/50 ,  H05K1/00

CPC分类号： H01L24/45 ,  H01L24/43 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45611 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45663 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/4851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19043

摘要： A lead member for electronic parts which has excellent heat resistance, oxidation resistance and corrosion resistance and is especially excellent in solderability and a process of producing such a lead member at low cost by plating are provided. The lead member comprises a base, at least a surface region of which is made of Cu or a Cu alloy, a primary coat of Ni, Co, a Ni alloy or a Co alloy and a surface layer of Pd, Ru, a Pd alloy or a Ru alloy formed sequentially on the base in the order mentioned. The primary coat consists of grains having a grain size of 20 .mu.m or more.

摘要翻译： 提供了具有优异的耐热性，抗氧化性和耐腐蚀性并且特别优异的可焊性的电子部件的引线部件和通过电镀以低成本制造这种引线部件的工艺。 引线构件包括基底，至少其表面区域由Cu或Cu合金制成，Ni，Co，Ni合金或Co合金的初级涂层以及Pd，Ru，Pd合金的表面层 或Ru合金按照所述顺序依次形成在基材上。 初级涂层由粒径20μm以上的晶粒构成。

公开(公告)号：US20170025344A1

公开(公告)日：2017-01-26

申请号：US15177658

申请日：2016-06-09

申请人： Fuji Electric Co., Ltd.

发明人： Naoyuki KANAI

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49894 ,  H01L21/4871 ,  H01L21/563 ,  H01L23/053 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/60 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/45 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12032 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/2076 ,  H01L2224/37099

摘要： A semiconductor module includes an insulated circuit board that includes an insulating substrate, a first conductive plate arranged on a first principal surface of the insulating substrate and within the outer edges of the insulating substrate, and a second conductive plate arranged within the outer edges of the insulating substrate on a second principal surface of the insulating substrate that faces the first principal surface. Furthermore, boundary edges between the first principal surface of the insulating substrate and the side faces of the first conductive plate are covered by an ion gel that contains an ionic liquid.

摘要翻译： 半导体模块包括绝缘电路板，​​其包括绝缘基板，布置在绝缘基板的第一主表面上并在绝缘基板的外边缘内的第一导电板，以及布置在绝缘基板的外边缘内的第二导电板 在所述绝缘基板的面向所述第一主面的第二主面上的绝缘基板。 此外，绝缘基板的第一主表面与第一导电板的侧面之间的边界被包含离子液体的离子凝胶覆盖。

公开(公告)号：US20160086909A1

公开(公告)日：2016-03-24

申请号：US14859680

申请日：2015-09-21

申请人： MC10, Inc.

发明人： David G. Garlock ,  Xia Li ,  Sanjay Gupta ,  Mitul Dalal

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/48 ,  G06K19/07779 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45118 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/4809 ,  H01L2224/48092 ,  H01L2224/48137 ,  H01L2224/48463 ,  H01L2224/48511 ,  H01L2224/78252 ,  H01L2224/78301 ,  H01L2224/78349 ,  H01L2224/78611 ,  H01L2224/85207 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A capillary tool for use in feeding, bending, and attaching a bonding wire between a pair of bond pads includes a body and a heating element. The body has an internal tube that extends from a first surface of the capillary tool to a second surface of the capillary tool. In some implementations, the internal tube has a portion with a generally helical shape that includes at least a portion of one complete revolution about a central axis of the body. The heating element is coupled to the body to provide a heat affected zone along a portion of the internal tube that heats the bonding wire as the bonding wire is fed through the internal tube.

摘要翻译： 用于在一对接合焊盘之间馈送，弯曲和连接接合线的毛细管工具包括主体和加热元件。 主体具有从毛细管工具的第一表面延伸到毛细管工具的第二表面的内管。 在一些实施方案中，内管具有大致螺旋形状的部分，其包括围绕主体的中心轴的一整圈的至少一部分。 加热元件联接到主体，以沿着内管的一部分提供热影响区域，该内部管道在接合线通过内管进给时加热接合线。

公开(公告)号：US20140157592A1

公开(公告)日：2014-06-12

申请号：US14181466

申请日：2014-02-14

申请人： Tessera, Inc.

发明人： Cyprian Uzoh ,  Craig Mitchell

IPC分类号： H01B13/00

CPC分类号： H01B13/0036 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45605 ,  H01L2224/45609 ,  H01L2224/45611 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/45887 ,  H01L2224/45893 ,  H01L2224/48 ,  H01L2224/85207 ,  H01L2924/01015 ,  H01L2924/10253 ,  Y10T29/49117 ,  H01L2924/01074 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/01006

摘要： A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

摘要翻译： 公开了一种可被配置用于半导体器件的导线结构。 线可以包括由导体材料形成的细长柔性芯和覆盖芯的外表面的覆层。 包层可以是导体。 在各个方面，包覆层和芯具有不同的晶粒尺寸。 芯材的平均晶粒尺寸可以比包覆层材料的平均晶粒尺寸大几个数量级。 包覆层可以是在其厚度上具有不同浓度的次要组分的合金。 还公开了形成线结构的方法。

公开(公告)号：US08439251B2

公开(公告)日：2013-05-14

申请号：US13324117

申请日：2011-12-13

申请人： Giovanni Delrosso

发明人： Giovanni Delrosso

IPC分类号： B23K1/00 ,  B23K35/00 ,  B23K31/02

CPC分类号： H01L24/80 ,  H01C17/28 ,  H01G13/006 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/77 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45118 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/78 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/20754 ,  H01L2924/20756 ,  H01L2924/20755 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/013 ,  H01L2924/01028

摘要： To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at least one seat in which the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.

摘要翻译： 要将引线端子永久性地应用于电子或电光元件的相应电极，a。 提供包括张紧线的框架，b。 提供包括至少一个座椅的保持夹具，其中部件可以可拆卸地且暂时地保持在其中; c。 将各部件沿着相应的纵向方向对齐在各个电极上，d。 将保持夹具施加到框架并使其定向，使得纵向方向对应于拉紧线的方向，从而使拉伸的线基本上与彼此对准的电极（所有）基本上接触， 行组成部分， 将张紧的电线电气和机械地结合到相应的电极，以及f。 切割线以将部件彼此分离，从而为每个电极形成相应的引线端子。