SEMICONDUCTOR LIGHT EMITTING DEVICE
    3.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
    半导体发光器件

    公开(公告)号:US20120032209A1

    公开(公告)日:2012-02-09

    申请号:US13032934

    申请日:2011-02-23

    IPC分类号: H01L33/32

    摘要: According to one embodiment, a semiconductor light emitting device includes: semiconductor layers; a multilayered structural body; and a light emitting portion. The multilayered structural body is provided between the semiconductor layers, and includes a first layer and a second layer including In. The light emitting portion is in contact with the multilayered structural body between the multilayered structural body and p-type semiconductor layer, and includes barrier layers and a well layer including In with an In composition ratio among group III elements higher than an In composition ratio among group III elements in the second layer. An average lattice constant of the multilayered structural body is larger than that of the n-type semiconductor layer. Difference between the average lattice constant of the multilayered structural body and that of the light emitting portion is less than difference between that of the multilayered structural body and that of the n-type semiconductor layer.

    摘要翻译: 根据一个实施例,半导体发光器件包括:半导体层; 多层结构体; 和发光部分。 多层结构体设置在半导体层之间,并且包括第一层和包括In的第二层。 发光部分与多层结构体和p型半导体层之间的多层结构体接触,并且包括阻挡层和包括In的阱层,III族元素中的In组成比高于In组成比中的In组成比 第三组元素在第二层。 多层结构体的平均晶格常数大于n型半导体层的平均晶格常数。 多层结构体的平均晶格常数与发光部的平均晶格常数之差小于多层结构体与n型半导体层的平均晶格常数之差。

    Method for manufacturing a semiconductor light emitting device
    6.
    发明授权
    Method for manufacturing a semiconductor light emitting device 有权
    半导体发光元件的制造方法

    公开(公告)号:US08093083B1

    公开(公告)日:2012-01-10

    申请号:US13029416

    申请日:2011-02-17

    IPC分类号: H01L21/00 H01L33/00

    摘要: In one embodiment, a method is disclosed for manufacturing a semiconductor light emitting device. The device includes a crystal layer including a nitride semiconductor. The crystal layer contains In and Ga atoms. The method can include forming the crystal layer by supplying a source gas including a first molecule including Ga atoms and a second molecule including In atoms onto a base body. The crystal layer has a ratio xs of a number of the In atoms to a total of the In atoms and the Ga atoms being not less than 0.2 and not more than 0.4. A vapor phase supply ratio xv of In is a ratio of a second partial pressure to a total of first and second partial pressures. The first and second partial pressures are pressure of the first and second molecules and degradation species of the first and second molecules on the source gas, respectively. (1−1/xv)/(1−1/xs) is less than 0.1.

    摘要翻译: 在一个实施例中,公开了一种用于制造半导体发光器件的方法。 该器件包括包含氮化物半导体的晶体层。 晶体层含有In和Ga原子。 该方法可以包括通过将包括Ga原子的第一分子和包括In原子的第二分子的源气体供应到基体上来形成晶体层。 晶体层的In原子数与In原子的总和的比xs和Ga原子的比率不小于0.2且不大于0.4。 In的气相供给比xv是第二分压与第一和第二分压的总和的比。 第一和第二分压分别是源气体上的第一和第二分子的压力和第一和第二分子的降解物质。 (1-1 / xv)/(1-1 / xs)小于0.1。

    VAPOR DEPOSITION METHOD AND VAPOR DEPOSITION APPARATUS
    8.
    发明申请
    VAPOR DEPOSITION METHOD AND VAPOR DEPOSITION APPARATUS 有权
    蒸气沉积法和蒸气沉积装置

    公开(公告)号:US20110143463A1

    公开(公告)日:2011-06-16

    申请号:US12875835

    申请日:2010-09-03

    IPC分类号: H01L21/66 C23C16/00 C23C16/34

    摘要: According to one embodiment, a vapor deposition method is disclosed for forming a nitride semiconductor layer on a substrate by supplying a group III source-material gas and a group V source-material gas. The method can deposit a first semiconductor layer including a nitride semiconductor having a compositional proportion of Al in group III elements of not less than 10 atomic percent by supplying the group III source-material gas from a first outlet and by supplying the group V source-material gas from a second outlet. The method can deposit a second semiconductor layer including a nitride semiconductor having a compositional proportion of Al in group III elements of less than 10 atomic percent by mixing the group III and group V source-material gases and supplying the mixed group III and group V source-material gases from at least one of the first outlet and the second outlet.

    摘要翻译: 根据一个实施例,公开了一种通过提供III族源材料气体和V族原料气体在衬底上形成氮化物半导体层的气相沉积方法。 该方法可以通过从第一出口提供III族源材料气体并且通过提供第V族源极材料来沉积包括具有不小于10原子%的III族元素中Al的组分比例的氮化物半导体的第一半导体层, 来自第二出口的原料气体。 该方法可以通过混合第III族和第V族源材料气体并将第III族和V族源混合,从而沉积包含具有小于10原子%的III族元素中的Al的组分比例的氮化物半导体的第二半导体层 - 来自第一出口和第二出口中的至少一个的材料气体。

    Vapor deposition method and vapor deposition apparatus
    9.
    发明授权
    Vapor deposition method and vapor deposition apparatus 有权
    气相沉积法和蒸镀装置

    公开(公告)号:US08815717B2

    公开(公告)日:2014-08-26

    申请号:US12875835

    申请日:2010-09-03

    IPC分类号: H01L21/20 H01L21/36

    摘要: According to one embodiment, a vapor deposition method is disclosed for forming a nitride semiconductor layer on a substrate by supplying a group III source-material gas and a group V source-material gas. The method can deposit a first semiconductor layer including a nitride semiconductor having a compositional proportion of Al in group III elements of not less than 10 atomic percent by supplying the group III source-material gas from a first outlet and by supplying the group V source-material gas from a second outlet. The method can deposit a second semiconductor layer including a nitride semiconductor having a compositional proportion of Al in group III elements of less than 10 atomic percent by mixing the group III and group V source-material gases and supplying the mixed group III and group V source-material gases from at least one of the first outlet and the second outlet.

    摘要翻译: 根据一个实施例,公开了一种通过提供III族源材料气体和V族原料气体在衬底上形成氮化物半导体层的气相沉积方法。 该方法可以通过从第一出口提供III族源材料气体并且通过提供第V族源极材料来沉积包括具有不小于10原子%的III族元素中Al的组分比例的氮化物半导体的第一半导体层, 来自第二出口的原料气体。 该方法可以通过混合第III族和第V族源材料气体并将第III族和V族源混合,从而沉积包含具有小于10原子%的III族元素中的Al的组分比例的氮化物半导体的第二半导体层 - 来自第一出口和第二出口中的至少一个的材料气体。