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公开(公告)号：US20210359153A1
公开(公告)日：2021-11-18
申请号：US16916011
申请日：2020-06-29
发明人： SHIUE-LUNG CHEN , CHENG-KUO FENG
IPC分类号： H01L33/00 , H01L25/075
摘要： A back plate for rapid and fluid-assisted assembly of micro light emitting elements thereon includes a substrate with a driving circuit, and blocking walls made to protrude from a top surface of the substrate. The top surface of the substrate defines grooves for accommodating and powering micro light emitting elements. Each of the blocking walls semi-surrounds one groove and defines a notch. The notches defined by each blocking wall all face a single direction and the blocking walls and notches impede and gather micro light emitting elements which are made to flow in a fluid suspension and render them much more likely to tumble into the groove. A method for fluid-assisted assembly is also disclosed.
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公开(公告)号：US10510931B2
公开(公告)日：2019-12-17
申请号：US15972240
申请日：2018-05-07
发明人： Hou-Te Lin , Yi-Sen Lin , Chin-Fu Cheng , Wen-Liang Tseng , Pin-Chuan Chen
摘要： A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.
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公开(公告)号：US10164142B2
公开(公告)日：2018-12-25
申请号：US15634997
申请日：2017-06-27
发明人： Po-Min Tu , Chien-Shiang Huang , Chien-Chung Peng , Tzu-Chien Hung , Shih-Cheng Huang , Chang-Ho Chen , Tsau-Hua Hsieh , Jong-Jan Lee , Paul-John Schuele
摘要： A flip chip light emitting diode includes a semiconductor layer comprising an epitaxial layer an N-semiconductor layer, a light active layer and a P-semiconductor layer arranged from top to bottom in series. A first electrode mounted on the semiconductor layer. A second electrode mounted on the semiconductor layer. A insulating layer mounted on the semiconductor layer. The N-semiconductor layer protrudes away from the epitaxial layer to form a protruding portion. The light active layer and the P-semiconductor layer mounts on the protruding portion in series. The insulating layer mounts between the first electrode and the protruding portion, the light active layer, the P-semiconductor layer and the second electrode. The flip chip light emitting diode also comprises a supporting portion, the supporting portion is mounted on a top surface of the epitaxial layer by a connecting portion. The connecting portion has same or different materials with the supporting portion.
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公开(公告)号：US09842968B2
公开(公告)日：2017-12-12
申请号：US15482975
申请日：2017-04-10
CPC分类号： H01L33/382 , H01L33/387 , H01L33/44 , H01L33/486 , H01L2933/0016
摘要： A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.
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公开(公告)号：US09786818B2
公开(公告)日：2017-10-10
申请号：US14823129
申请日：2015-08-11
发明人： Ching-Hsueh Chiu , Chia-Hung Huang , Ya-Wen Lin , Po-Min Tu , Shih-Cheng Huang
CPC分类号： H01L33/405 , H01L33/0095 , H01L33/32 , H01L33/385 , H01L33/44 , H01L2933/0016
摘要： A light emitting diode includes a first electrode, a second electrode and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. The second electrode surrounds periphery of the epitaxial structure to reflect light from the epitaxial structure to emit out from the top of the epitaxial structure. This disclosure also relates to a method for manufacturing the light emitting diode. The light emitting diode and the method help solve the problem of low light efficiency of the light emitting diode.
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公开(公告)号：US09666568B2
公开(公告)日：2017-05-30
申请号：US15222978
申请日：2016-07-29
发明人： Hou-Te Lin , Chao-Hsiung Chang , Pin-Chuan Chen , Lung-Hsin Chen
CPC分类号： H01L25/167 , H01L23/60 , H01L25/165 , H01L29/866 , H01L33/483 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.
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公开(公告)号：US09620692B2
公开(公告)日：2017-04-11
申请号：US14876980
申请日：2015-10-07
发明人： Yau-Tzu Jang , Yu-Liang Huang , Wen-Liang Tseng , Pin-Chuan Chen , Lung-Hsin Chen , Hsing-Fen Lo , Chao-Hsiung Chang , Che-Hsang Huang , Yu-Lun Hsieh
IPC分类号： H01L33/00 , H01L33/62 , H01L25/075 , H01L33/60 , H01L25/16 , H01L29/866 , H01L33/52
CPC分类号： H01L33/647 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L29/866 , H01L33/502 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137
摘要： An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.
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公开(公告)号：US09577163B2
公开(公告)日：2017-02-21
申请号：US14835954
申请日：2015-08-26
发明人： Ching-Hsueh Chiu , Ya-Wen Lin , Po-Min Tu , Shih-Cheng Huang
CPC分类号： H01L33/54 , H01L25/0753 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： The present disclosure provides a light emitting diode package including a substrate, a first electrode and a second electrode located on a first surface of the substrate, a plurality of light emitting diodes (LEDs) located between the first electrode and the second electrode, a plurality of retaining ring located on the first surface of the substrate. The LEDs are surrounded by the retaining ring therein. An encapsulation layer is mounted in the retaining ring and covers the LEDs therein. The encapsulation layer includes a first surface and an side surface extending from edges of the first surface. The side of the encapsulation layer contacts an inner surface of the retaining ring. The present disclosre also provides a method for manufacturing the above light emitting diode package.
摘要翻译： 本公开提供了一种发光二极管封装，其包括位于基板的第一表面上的基板，第一电极和第二电极，位于第一电极和第二电极之间的多个发光二极管（LED），多个 位于基板的第一表面上的保持环。 LED由保持环包围。 封装层安装在固定环中并覆盖其中的LED。 封装层包括从第一表面的边缘延伸的第一表面和侧表面。 封装层的一侧接触保持环的内表面。 本发明还提供了制造上述发光二极管封装的方法。
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公开(公告)号：US09557047B2
公开(公告)日：2017-01-31
申请号：US14310792
申请日：2014-06-20
发明人： Ming-Ta Tsai , Chung-Min Chang , Hao-Xiang Lin
摘要： A light emitting diode (LED) lamp includes a hollow connector, an LED module mounted on the connector, and a fin unit received in the connector. The connector has an inlet and an outlet couple to the inlet. Heat generated from the LED module is transferred to the connector to dissipate. The fan unit includes a first fan and a second fan rotating along contrary directions.
摘要翻译： 发光二极管（LED）灯包括中空连接器，安装在连接器上的LED模块和容纳在连接器中的散热片单元。 连接器具有入口和出口连接到入口。 从LED模块产生的热量传递到连接器以消散。 风扇单元包括第一风扇和沿相反方向旋转的第二风扇。
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公开(公告)号：US09465205B2
公开(公告)日：2016-10-11
申请号：US14445486
申请日：2014-07-29
CPC分类号： G02B19/0061 , F21V5/046 , F21V7/0091 , F21V9/30 , G02B19/0028
摘要： An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided.
摘要翻译： 光学透镜包括位于其底部的第一光学表面，位于其顶部并与第一光学表面相对布置的第三光学表面，以及在第一光学表面和第三光学表面之间延伸的第二光学表面。 第三光学表面向下朝向第一光学表面凹陷。 来自LED光源的光通过第一光学表面进入光学透镜，大部分入射光通过第二光学表面直接从光学透镜折射出来，并且进入第三光学表面的入射光的一部分 首先由第三光学表面通过全内反射朝向第二光学表面反射，然后通过第二光学表面折射出光学透镜。 还提供了包括光学透镜的背光模块。
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