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公开(公告)号：US20080265437A1
公开(公告)日：2008-10-30
申请号：US11884613
申请日：2006-03-08
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H05K3/3436 , H01L21/563 , H01L23/49838 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17132 , H01L2224/17136 , H01L2224/17151 , H01L2224/17155 , H01L2224/17177 , H01L2224/17515 , H01L2224/29111 , H01L2224/2919 , H01L2224/32052 , H01L2224/32225 , H01L2224/73204 , H01L2224/83007 , H01L2224/83097 , H01L2224/83192 , H01L2224/83801 , H01L2224/83887 , H01L2224/83888 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15747 , H01L2924/30105 , H01L2924/3025 , H05K3/323 , H05K3/3484 , H05K2201/09781 , H05K2201/10977 , H05K2203/046 , Y02P70/613 , H01L2224/1713 , H01L2224/1715 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).
摘要翻译： 具有半导体芯片的高可靠性，高生产率的封装及其制造方法。 在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成多个电极端子（12） 分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）和电极端子（12）之间的连接端子（32）是电气 在自组装中形成的焊料凸点（17）共同连接，在芯片表面（10a）或表面（10a）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20） 35）对应于芯片表面（10a），并且焊料（19）积聚在电极图案（20）上。
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公开(公告)号：US07649267B2
公开(公告)日：2010-01-19
申请号：US11884613
申请日：2006-03-08
CPC分类号： H05K3/3436 , H01L21/563 , H01L23/49838 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17132 , H01L2224/17136 , H01L2224/17151 , H01L2224/17155 , H01L2224/17177 , H01L2224/17515 , H01L2224/29111 , H01L2224/2919 , H01L2224/32052 , H01L2224/32225 , H01L2224/73204 , H01L2224/83007 , H01L2224/83097 , H01L2224/83192 , H01L2224/83801 , H01L2224/83887 , H01L2224/83888 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15747 , H01L2924/30105 , H01L2924/3025 , H05K3/323 , H05K3/3484 , H05K2201/09781 , H05K2201/10977 , H05K2203/046 , Y02P70/613 , H01L2224/1713 , H01L2224/1715 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).
摘要翻译： 具有半导体芯片的高可靠性，高生产率的封装及其制造方法。 在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成有多个电极端子（12） 分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）上的连接端子（32）和电极端子（12）电连接 集体地通过自组装形成的焊料凸点（17），在芯片表面（10a）或表面（35）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20） 对应于芯片表面（10a）的安装基板（30），并且焊料（19）积聚在电极图案（20）上。
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公开(公告)号：US07136543B2
公开(公告)日：2006-11-14
申请号：US10879067
申请日：2004-06-30
CPC分类号： H01L31/035281 , G02B6/43 , H01L33/20 , H01L33/24 , H01L2224/16225 , H01L2924/1017 , Y02E10/50
摘要： A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly (100) is obtained by connecting a photo-electro conversion device (10a), spherical semiconductor devices (12a) and (12b) and an electro-photo conversion device (10b) through electrical-connection portions (14) so that a light received by the photo-electro conversion device (10a) is amplified by the spherical semiconductor devices (12a) and (12b) and then emitted from the electro-photo conversion device (10b).
摘要翻译： 一种安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且不需要在光传输线和安装组件之间的连接部分处的高度精确的垂直度。 通过电连接部分（100a）连接光电转换装置（10a），球形半导体装置（12a）和（12b）和电转换装置（10b） 14），使得由光电转换装置（10a）接收的光被球形半导体器件（12a）和（12b）放大，然后从电光转换装置（10b）发射。
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公开(公告)号：US20050002608A1
公开(公告)日：2005-01-06
申请号：US10879067
申请日：2004-06-30
IPC分类号： G02B6/12 , G02B6/02 , G02B6/43 , H01L23/52 , H01L27/00 , H01L31/0352 , H01L33/20 , H01L33/24 , G02B6/26
CPC分类号： H01L31/035281 , G02B6/43 , H01L33/20 , H01L33/24 , H01L2224/16225 , H01L2924/1017 , Y02E10/50
摘要： A mount assembly with an excellent handling property which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly is provided. The mount assembly 100 is obtained by connecting a photo-electro conversion device 10a, spherical semiconductor devices 12a and 12b and an electro-photo conversion device 10b through electrical-connection portions 14 so that a light received by the photo-electro conversion device 10a is amplified by the spherical semiconductor devices 12a and 12b and then emitted from the electro-photo conversion device 10b.
摘要翻译： 具有良好处理性能的安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且在光传输线与安装组件之间的连接部分不需要高度精确的垂直度， 提供。 通过电连接部14将光电转换装置10a，球形半导体装置12a，12b与电光转换装置10b连接，由光电转换装置10a接收的光为 由球形半导体器件12a和12b放大，然后从电光转换器件10b发射。
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5.发明授权公开(公告)号：US07752749B2
公开(公告)日：2010-07-13
申请号：US11886533
申请日：2006-03-17
CPC分类号： H01L24/81 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/131 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75822 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/83192 , H01L2224/83851 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01009 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/3436 , H05K2203/0195 , H05K2203/048 , Y02P70/613 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/49142 , Y10T29/49144 , Y10T29/49149 , H01L2924/00 , H01L2224/05599
摘要： One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.
摘要翻译： 电子部件的电极端子和布线基板的连接端子之一预先设置有焊料，确保了布线基板和电子部件中的一个，使电极端子和连接端子彼此抵接 保持布线基板和电子部件中的任一个（取决于不固定的）。 电子部件被加热使得焊料熔化，并且焊料在保持电子部件的同时固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔融的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的XY面上的表面相对于彼此微细移动; 方向。
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6.发明申请公开(公告)号：US20090049687A1
公开(公告)日：2009-02-26
申请号：US11886533
申请日：2006-03-17
IPC分类号： H05K3/34
CPC分类号： H01L24/81 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/131 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75822 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/83192 , H01L2224/83851 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01009 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/3436 , H05K2203/0195 , H05K2203/048 , Y02P70/613 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/49142 , Y10T29/49144 , Y10T29/49149 , H01L2924/00 , H01L2224/05599
摘要： [Problem] To improve productivity and reliability in mounting an electronic component.[Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.
摘要翻译： [问题]提高安装电子元件的生产力和可靠性。 解决问题的手段电子部件的电极端子和布线基板的连接端子中的至少一个预先设置有焊料，布线基板和电子部件中的一个被固定，电子端子 使布线基板的连接端子与布线基板和电子部件中的一方（以未固定的方式）保持的状态相互抵接。 然后，电子部件被加热使得焊料熔化，并且在保持电子部件的同时使焊料固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔化的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的表面在XYθ方向上相对于彼此微细移动。
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7.发明申请公开(公告)号：US20080298023A1
公开(公告)日：2008-12-04
申请号：US12127123
申请日：2008-05-27
CPC分类号： H05K1/183 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/16227 , H01L2224/32225 , H01L2924/00014 , H01L2924/15311 , H01L2924/16251 , H01L2924/19105 , H05K1/186 , H05K1/187 , H05K3/20 , H05K3/4614 , H05K2201/0394 , H05K2201/10378 , H05K2201/10454 , H05K2203/063 , Y10T29/49137 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.
摘要翻译： 含电子元件的模块包括电绝缘基板; 以及嵌入在所述电绝缘基板中的第一电子部件和第二电子部件，其中，所述第一电子部件从所述电绝缘基板的至少一个表面部分突出，并且所述第二电子部件容纳在所述电绝缘基板中。
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公开(公告)号：US08878559B2
公开(公告)日：2014-11-04
申请号：US13382690
申请日：2011-04-19
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： An IC current measuring apparatus is provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译： IC电流测量装置设置在IC和基板之间。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。 特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。 此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。 因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压 与IC端子相对应的插入电阻，他/她希望通过电流测量流动。
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公开(公告)号：US20120112737A1
公开(公告)日：2012-05-10
申请号：US13382690
申请日：2011-04-19
IPC分类号： G01R1/20
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： Provided is an IC current measuring apparatus provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译： 提供了设置在IC和基板之间的IC电流测量装置。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。 特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。 此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。 因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压 与IC端子相对应的插入电阻，他/她希望通过电流测量流动。
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公开(公告)号：US07346051B2
公开(公告)日：2008-03-18
申请号：US11149171
申请日：2005-06-10
CPC分类号： G06F13/409 , G06F13/4226 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.
摘要翻译： 公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。 堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。 这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。 此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令， 被连接在每个从设备中的不同位置。
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