公开(公告)号：WO98031498A1

公开(公告)日：1998-07-23

申请号：PCT/US1998/001187

申请日：1998-01-21

IPC: B23K26/03 ,  B23K26/02

CPC classification number: H01L24/85 ,  B23K26/032 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/78 ,  H01L24/79 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/4518 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8501 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/00015

Abstract: A method and apparatus for laser microwelding and wire bonding apparatus with a laser source (116) such as a Nd:YAG laser, a second laser pulse source (122) for providing a visible aiming beam, the beams passing through an optical fiber (126) followed by a beam imaging system, followed by a beam splitter compartment (132). A monitoring system consisting of a camera (134) and a monitor (136) is used. In operation the laser pulses are applied to the end of an elongated length of conductive material to deform an end to a spherical shape, the spherical end is welded to a bonding pad, another laser beam is used to sever the elongated material, and the new end has a beam applied to deform it to a spherical shape, and the new end is microwelded to a second bonding pad.

Abstract translation: 一种用于激光微焊接和引线接合装置的方法和装置，其具有诸如Nd：YAG激光器的激光源（116），用于提供可见瞄准光束的第二激光脉冲源（122），所述光束通过光纤（126 ），随后是光束成像系统，随后是分束室（132）。 使用由相机（134）和监视器（136）组成的监视系统。 在操作中，将激光脉冲施加到细长长度的导电材料的端部以将端部变形为球形，将球形端焊接到焊盘，另一激光束用于切割细长材料，并且新的 端部具有用于使其变形为球形的梁，并且新端部被微焊接到第二接合焊盘。

公开(公告)号：WO2010020753A3

公开(公告)日：2010-06-24

申请号：PCT/GB2009001966

申请日：2009-08-11

Applicant: SEMBLANT LTD ,  HUMPHRIES MARK ROBSON ,  FERDINANDI FRANK ,  SMITH RODNEY EDWARD

Inventor： HUMPHRIES MARK ROBSON ,  FERDINANDI FRANK ,  SMITH RODNEY EDWARD

IPC: H05K3/28 ,  C12Q1/00 ,  H01H13/70 ,  H01L23/485 ,  H05K3/34

CPC classification number: H05K3/282 ,  H01H13/78 ,  H01H2215/004 ,  H01H2229/012 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/06 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45149 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/4517 ,  H01L2224/45171 ,  H01L2224/45173 ,  H01L2224/45178 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/8502 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/284 ,  H05K3/328 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/049 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20758

Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB进一步包括附着到衬底的至少一个表面的多个导电迹线。 PCB还包括沉积在基底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，并且（ii）包括至少一个由卤代烃聚合物形成的层。 所述PCB还包括至少一个电子部件，所述至少一个电子部件通过焊点连接到至少一个导电轨道，其中所述焊点焊接穿过所述多层涂层，使得所述焊点邻接所述多层涂层。

公开(公告)号：WO2012002764A2

公开(公告)日：2012-01-05

申请号：PCT/KR2011004838

申请日：2011-07-01

Applicant: KOREA ELECTRONICS TELECOMM ,  KIM HYUN-TAK ,  KIM BONG JUN

Inventor： KIM HYUN-TAK ,  KIM BONG JUN

IPC: H01L23/36

CPC classification number: H01L23/62 ,  H01L25/167 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45149 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/45172 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/00 ,  H01L2224/48

Abstract: Provided are metal-semiconductor convergence electric circuit devices. The device includes a semiconductor device, a metal resistor exhibiting resistance increased with an increase in temperature thereof, and an interconnection line connecting the semiconductor device with the metal resistor in series and having a resistance lower than that of the metal resistor. The semiconductor device is configured to exhibit resistance decreased with an increase in temperature thereof and compensate the resistance increase of the metal resistor.

Abstract translation: 提供了金属 - 半导体会聚电路装置。 该器件包括半导体器件，呈现电阻随温度升高而呈现电阻的金属电阻器，以及将半导体器件与金属电阻器串联连接并具有低于金属电阻器的电阻的互连线。 半导体器件被配置为表现出随着其温度升高而降低的电阻并且补偿金属电阻器的电阻增加。

公开(公告)号：WO2010020753A2

公开(公告)日：2010-02-25

申请号：PCT/GB2009/001966

申请日：2009-08-11

Applicant: SEMBLANT LIMITED ,  HUMPHRIES, Mark, Robson ,  FERDINANDI, Frank ,  SMITH, Rodney, Edward

Inventor： HUMPHRIES, Mark, Robson ,  FERDINANDI, Frank ,  SMITH, Rodney, Edward

IPC: H05K3/28

CPC classification number: H05K3/282 ,  H01H13/78 ,  H01H2215/004 ,  H01H2229/012 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/06 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45149 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/4517 ,  H01L2224/45171 ,  H01L2224/45173 ,  H01L2224/45178 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/8502 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85484 ,  H01L2224/85611 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/284 ,  H05K3/328 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/049 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20758

Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。