公开(公告)号：WO2017100708A1

公开(公告)日：2017-06-15

申请号：PCT/US2016/066017

申请日：2016-12-09

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC. ,  DATTA, Proyag ,  TOBEY, Dustin ,  THIELEN, Brianna ,  TALBOT, Neil ,  SIGEL, Deborah ,  OK, Jerry ,  GREENBERG, Robert, J. ,  SHA, Andrew

Inventor： DATTA, Proyag ,  TOBEY, Dustin ,  THIELEN, Brianna ,  TALBOT, Neil ,  SIGEL, Deborah ,  OK, Jerry ,  GREENBERG, Robert, J. ,  SHA, Andrew

IPC: A61N1/05

CPC classification number: A61N1/0543 ,  A61N1/36046

Abstract: Electrode arrays for biological implants are disclosed, particularly for stimulating a retina. The present disclosure provides array for improving apposition (reducing the space between the array and the retina. The present disclosure also provides electrode array designs that can be made approximately spherical to increase the field of view of a visual prosthesis while still maintaining good apposition.

Abstract translation: 公开了用于生物植入物的电极阵列，特别是用于刺激视网膜的电极阵列。 本公开提供了用于改善并置性（减少阵列和视网膜之间的空间）的阵列（本发明还提供了电极阵列设计，其可以制成近似球形以增加视觉假体的视野，同时仍保持良好的并置性。 / p>

公开(公告)号：WO2011137298A3

公开(公告)日：2011-11-03

申请号：PCT/US2011/034471

申请日：2011-04-29

Applicant: SECOND SIGHT MEDICAL PRODUCTS,INC. ,  FARAJI, Boozarjomehr ,  ZHOU, David, Daomin ,  GREENBERG, Robert, J. ,  OK, Jerry ,  TALBOT, Neil, Hamilton ,  LITTLE, James, Singleton

Inventor： FARAJI, Boozarjomehr ,  ZHOU, David, Daomin ,  GREENBERG, Robert, J. ,  OK, Jerry ,  TALBOT, Neil, Hamilton ,  LITTLE, James, Singleton

IPC: A61N1/36 ,  A61N1/375 ,  H01L21/60 ,  H01L21/56 ,  A61B5/04

Abstract: The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as by etching or by applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.

公开(公告)号：WO2008021524A2

公开(公告)日：2008-02-21

申请号：PCT/US2007018315

申请日：2007-08-18

Applicant: SECOND SIGHT MEDICAL PROD INC ,  OK JERRY ,  GREENBERG ROBERT J ,  TALBOT NEIL HAMILTON ,  LITTLE JAMES SINGLETON ,  DAI RONGQING ,  NEYSMITH JORDAN MATTHEW ,  MCCLURE KELLY H

Inventor： OK JERRY ,  GREENBERG ROBERT J ,  TALBOT NEIL HAMILTON ,  LITTLE JAMES SINGLETON ,  DAI RONGQING ,  NEYSMITH JORDAN MATTHEW ,  MCCLURE KELLY H

IPC: A61N1/00

CPC classification number: A61N1/36046 ,  A61F15/001 ,  A61N1/0529 ,  A61N1/0543 ,  A61N1/36125 ,  A61N1/375 ,  H01L23/055 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L24/16 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

Abstract translation: 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

公开(公告)号：WO2007149465A3

公开(公告)日：2007-12-27

申请号：PCT/US2007/014332

申请日：2007-06-19

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC. ,  ZHOU, Dao, Min ,  OK, Jerry ,  TALBOT, Neil, Hamilton ,  MECH, Brian, V. ,  LITTLE, James ,  GREENBERG, Robert, J.

Inventor： ZHOU, Dao, Min ,  OK, Jerry ,  TALBOT, Neil, Hamilton ,  MECH, Brian, V. ,  LITTLE, James ,  GREENBERG, Robert, J.

IPC: A61N1/05 ,  A61N1/36

Abstract: The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer. The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.

公开(公告)号：WO2006118679A2

公开(公告)日：2006-11-09

申请号：PCT/US2006/010041

申请日：2006-03-20

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC. ,  GREENBERG, Robert, J. ,  NEYSMITH, Jordan ,  WILKIN, Kevin ,  OK, Jerry

Inventor： GREENBERG, Robert, J. ,  NEYSMITH, Jordan ,  WILKIN, Kevin ,  OK, Jerry

IPC: A61N1/36

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

Abstract: The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.

Abstract translation: 本发明是用于植入人体的改进的密封包装。 本发明的可植入装置包括包含通过基底的导电通路的折衷不导电的低音。 电路倒装芯片结合到通孔的子集。 第二电路被引线接合到通孔的另一子集。 最后，将覆盖物粘合到基底上，使得盖，基底和通孔形成密封包装。

公开(公告)号：WO2011137298A2

公开(公告)日：2011-11-03

申请号：PCT/US2011034471

申请日：2011-04-29

Applicant: SECOND SIGHT MEDICAL PROD INC ,  FARAJI BOOZARJOMEHR ,  ZHOU DAVID DAOMIN ,  GREENBERG ROBERT J ,  OK JERRY ,  TALBOT NEIL HAMILTON ,  LITTLE JAMES SINGLETON

Inventor： FARAJI BOOZARJOMEHR ,  ZHOU DAVID DAOMIN ,  GREENBERG ROBERT J ,  OK JERRY ,  TALBOT NEIL HAMILTON ,  LITTLE JAMES SINGLETON

IPC: A61N1/36 ,  A61B5/04 ,  A61N1/375 ,  H01L21/56 ,  H01L21/60

CPC classification number: H01L21/563 ,  A61B5/04001 ,  A61B2562/125 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.

Abstract translation: 本发明是一种用于将密封包装连接到诸如用于可植入装置中的电极阵列的柔性电路的装置和方法。 通过导电粘合剂将柔性电路上的金属焊盘连接到密封设备上的金属焊盘是已知的。 光滑的金属，如铂，不能很好地粘结到导电环氧树脂上。 本发明提供了粗糙化的表面，例如蚀刻或施加高表面积的白金灰，以改善与铂或其它金属垫的粘合性。

公开(公告)号：WO2009002355A1

公开(公告)日：2008-12-31

申请号：PCT/US2007/081947

申请日：2007-10-19

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC. ,  OK, Jerry ,  GREENBERG, Robert, J.

Inventor： OK, Jerry ,  GREENBERG, Robert, J.

IPC: H05K3/40

CPC classification number: H05K3/4061 ,  B32B37/14 ,  C04B35/10 ,  C04B37/00 ,  C04B2237/064 ,  H05K1/0306 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/12 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4629 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10T156/10

Abstract: A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

Abstract translation: 一种制造密封电馈通的方法。 该方法包括提供具有上表面和下表面的陶瓷片，在从所述上表面延伸到所述下表面的所述陶瓷片中形成至少一个通孔，将导电厚膜糊剂插入所述通孔中，将陶瓷片层压 在上陶瓷片和下陶瓷片之间通过孔填充糊状物以形成层压陶瓷基板，将层叠的陶瓷基板烧制至烧结层叠陶瓷基板的温度，并使填充有通孔的浆料形成金属化通孔， 层叠陶瓷基板，以形成围绕所述金属化通孔的气密密封，并从烧结的层叠陶瓷基板上除去上陶瓷片和下陶瓷片材，以露出金属化通孔的上表面和下表面。

公开(公告)号：WO2007149465A2

公开(公告)日：2007-12-27

申请号：PCT/US2007014332

申请日：2007-06-19

Applicant: SECOND SIGHT MEDICAL PROD INC ,  ZHOU DAO MIN ,  OK JERRY ,  TALBOT NEIL HAMILTON ,  MECH BRIAN V ,  LITTLE JAMES ,  GREENBERG ROBERT J

Inventor： ZHOU DAO MIN ,  OK JERRY ,  TALBOT NEIL HAMILTON ,  MECH BRIAN V ,  LITTLE JAMES ,  GREENBERG ROBERT J

CPC classification number: A61N1/0543 ,  A61N1/36046

Abstract: The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer. The present invention provides A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer

Abstract translation: 本发明提供具有增加的稳定性的可植入电极，其具有聚集结构，其中电极的表面被包括填充有棒或柱的开口的材料覆盖。 本发明提供了具有增加的稳定性的可植入电极，其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。 本发明提供一种具有增加的稳定性的电极的制造方法，包括：在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。 本发明提供了一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层

公开(公告)号：WO2007106318A3

公开(公告)日：2007-12-21

申请号：PCT/US2007004741

申请日：2007-02-22

Applicant: SECOND SIGHT MEDICAL PROD INC ,  GREENBERG ROBERT J ,  OK JERRY

Inventor： GREENBERG ROBERT J ,  OK JERRY

IPC: A61N1/00

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  H01L2924/00

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子器件封装结合到电极或柔性电路的方法，以及适合于植入活体组织（例如用于视网膜或皮层电极阵列）的所得电子封装，以使视线恢复 某些不具视力的个人。 通过电镀铂或金等生物相容性材料，将密封的电子组件直接接合到柔性电路或电极上，从而有效地形成电镀铆钉形连接，其将柔性电路结合到电子组件。 由此产生的电子器件是生物相容性的，适用于长期植入活体组织。

公开(公告)号：WO2008021524A3

公开(公告)日：2008-02-21

申请号：PCT/US2007/018315

申请日：2007-08-18

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC. ,  OK, Jerry ,  GREENBERG, Robert, J. ,  TALBOT, Neil, Hamilton ,  LITTLE, James, Singleton ,  DAI, Rongqing ,  NEYSMITH, Jordan, Matthew ,  MCCLURE, Kelly, H.

Inventor： OK, Jerry ,  GREENBERG, Robert, J. ,  TALBOT, Neil, Hamilton ,  LITTLE, James, Singleton ,  DAI, Rongqing ,  NEYSMITH, Jordan, Matthew ,  MCCLURE, Kelly, H.

IPC: A61N1/00

Abstract: The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.