公开(公告)号：EP3387673A2

公开(公告)日：2018-10-17

申请号：EP16874040.5

申请日：2016-12-12

Applicant: Thin Film Electronics ASA

Inventor： TAKASHIMA, Mao

IPC: H01L23/488 ,  H01L23/538

CPC classification number: H05K1/181 ,  H01L21/4867 ,  H01L23/49822 ,  H01L23/49855 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/09 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09281 ,  H05K2201/09772

Abstract: An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.

公开(公告)号：EP3309829A1

公开(公告)日：2018-04-18

申请号：EP17194324.4

申请日：2017-10-02

Applicant: Iriso Electronics Co., Ltd.

Inventor： Sugaya, Yujiro ,  Asanuma, Yuki

IPC: H01L23/498

CPC classification number: H05K1/09 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H05K1/112 ,  H05K1/144 ,  H05K3/366 ,  H05K3/4038 ,  H05K2201/0338 ,  H05K2201/041 ,  H05K2201/09727 ,  H05K2201/098 ,  H05K2201/09827 ,  H05K2201/10265

Abstract: To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board 100 includes a substrate 101 including a hole portion 110 that penetrates the substrate 101 in a plate thickness direction, and a connector region including a first conductor layer 202 that closes one side of the hole portion 110, liquid metal 210 disposed in a recess 201 formed by the hole portion 110 and the first conductor layer 202, and a sealing layer 212 that is the liquid metal 210 cured on a liquid surface side. The liquid metal 210 may be in contact with a second conductor layer 204 formed in the recess 201.

Abstract translation: 提供一种能够建立电连接的电路板，该电路板较薄且具有较高的可维护性。 电路基板100具备：基板101，其具有在板厚方向上贯通基板101的孔部110;以及连接器区域，该连接器区域包括将孔部110的一侧封闭的第一导体层202，配置在基板101上的液态金属210 由孔部110和第一导体层202形成的凹部201和在液面侧固化的作为液态金属210的密封层212。 液态金属210可以与形成在凹槽201中的第二导体层204接触。

公开(公告)号：EP2644010A4

公开(公告)日：2017-09-27

申请号：EP11852165

申请日：2011-12-23

Applicant: LG INNOTEK CO LTD

Inventor： LEE SANG MYUNG ,  YOON SUNG WOON ,  LEE HYUK SOO ,  LEE SUNG WON ,  CHUN KI DO

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/46 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed.

Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 。 通孔包括第一部分，在第一部分下方的第二部分以及在第一和第二部分之间的第三部分，并且第三部分包括与第一和第二部分的金属不同的金属。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。

公开(公告)号：EP3182471A1

公开(公告)日：2017-06-21

申请号：EP16195947.3

申请日：2016-10-27

Applicant: LG Electronics Inc.

Inventor： HONG, Jaepyo ,  KIM, Jaechan ,  KIM, Injoong

IPC: H01L33/62 ,  H01L33/64 ,  F21V29/74

CPC classification number: F21V29/713 ,  F21S2/005 ,  F21V3/0625 ,  F21V23/06 ,  F21V29/503 ,  F21V29/74 ,  F21V29/763 ,  F21V29/83 ,  F21V31/00 ,  F21Y2115/10 ,  H01L33/64 ,  H01L33/647 ,  H05K1/0209 ,  H05K1/053 ,  H05K3/107 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/1355

Abstract: A light source module (100) includes: at least one light source emitting light; and a body supporting the light source, wherein the body includes: a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside; an insulating part provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties; and a plating part (40) provided on the insulating part, wherein the plating part (40) includes: a contact heat dissipation part (203, 303) contacting a portion of a bottom surface of the light source to receive heat generated from the light source; and a diffusion heat dissipation part (350) connected to the contact heat dissipation part (203, 303), the diffusion heat dissipation part (350) receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed, so that it is possible to obtain effects such as improvement of the lifespan of products, enhancement of the stability of products, rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, and improvement of the reliability of products. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

Abstract translation: 一种光源模块（100）包括：至少一个发光的光源; 以及支撑所述光源的主体，其中，所述主体包括：散热器，所述散热器在所述光源的顶面上支撑所述光源，所述散热器从所述光源吸收热量并将所述热量散发到外部; 设置在所述散热器的至少一个表面上的绝缘部件，所述绝缘层具有电绝缘性能; 和设置在绝缘部分上的电镀部分（40），其中电镀部分（40）包括：接触散热部分（203,303），接触光源的底表面的一部分以接收从光产生的热量 资源; 以及连接到所述接触散热部件（203,303）的扩散散热部件（350），所述扩散散热部件（350）从所述接触散热部件接收热量以将所述热量排放到所述散热器。 因此，可以实现快速散热，从而可以获得诸如提高产品使用寿命，提高产品稳定性，快速制造工艺，便宜的制造成本，便于大量生产，提高产品成品率， 导电材料的保护以及产品可靠性的提高。 此外，可以通过实施例中描述的配置来获得可以理解的各种效果。

公开(公告)号：EP2908227A4

公开(公告)日：2016-07-20

申请号：EP14858277

申请日：2014-10-30

Applicant: LG CHEMICAL LTD

Inventor： KIM YONG CHAN ,  LIM JIN HYONG ,  KIM KI-HWAN ,  YOON JUNGHWAN ,  LEE ILHA

IPC: G06F3/041 ,  H01B1/02 ,  H05K1/09

CPC classification number: H05K1/09 ,  G06F1/16 ,  G06F3/041 ,  H01B1/026 ,  H01L31/022433 ,  H01L31/022475 ,  H01L31/022483 ,  H01L31/1884 ,  H01L51/445 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/06 ,  H05K5/0017 ,  H05K2201/0108 ,  H05K2201/0338 ,  Y02E10/50

Abstract: The present application relates to a conductive film, a method for manufacturing the same, and a display device including the same.

Abstract translation: 本申请涉及导电膜，其制造方法和包括该导电膜的显示装置。

公开(公告)号：EP2924695A1

公开(公告)日：2015-09-30

申请号：EP12888811.2

申请日：2012-11-21

Applicant: Sumitomo Riko Company Limited

Inventor： TAGUCHI, Yutaro ,  KAWAGUCHI, Junya ,  KOBAYASHI, Jun ,  YOSHIKAWA, Hitoshi ,  YOSHIKAWA, Takeaki

IPC: H01B5/14 ,  G01L1/14 ,  G01L5/00 ,  H04R19/00 ,  H05K1/09

CPC classification number: G01L1/146 ,  H04R7/06 ,  H04R19/005 ,  H04R19/016 ,  H04R31/003 ,  H05K1/0283 ,  H05K1/095 ,  H05K3/245 ,  H05K2201/0133 ,  H05K2201/0323 ,  H05K2201/0338

Abstract: A flexible conductive member of the present invention includes an elastic substrate (31) and a plurality of conductive layers (32, 33) arranged on a surface of the substrate (31) in at least one of a stacked manner and a parallel manner. The conductive layers (32, 33) include: a first conductive layer (33) including a highly conductive material that contains an elastomer and a conductive agent and has a volume resistivity of 5 × 10 -2 Ω·cm or less in an unextended condition; and a second conductive layer (32) including a highly extensible conductive material that has a volume resistivity in an unextended condition larger than the volume resistivity of the highly conductive material in an unextended condition, contains an elastomer and a conductive agent, and has a change in volume resistivity at an elongation of 50% relative to an unextended condition of 10 times or less.

公开(公告)号：EP2908227A1

公开(公告)日：2015-08-19

申请号：EP14858277.8

申请日：2014-10-30

Applicant: LG Chem, Ltd.

Inventor： KIM, Yong Chan ,  LIM, Jin Hyong ,  KIM, Ki-Hwan ,  YOON, Junghwan ,  LEE, Ilha

IPC: G06F3/041

CPC classification number: H05K1/09 ,  G06F1/16 ,  G06F3/041 ,  H01B1/026 ,  H01L31/022433 ,  H01L31/022475 ,  H01L31/022483 ,  H01L31/1884 ,  H01L51/445 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/06 ,  H05K5/0017 ,  H05K2201/0108 ,  H05K2201/0338 ,  Y02E10/50

Abstract: The present application relates to a conductive film, a method for manufacturing the same, and a display device including the same.

公开(公告)号：EP2804022A4

公开(公告)日：2015-07-15

申请号：EP13736429

申请日：2013-01-11

Applicant: PANASONIC IP MAN CO LTD

Inventor： MORITA YOSUKE

IPC: G01V8/20 ,  G01C3/06 ,  G01J1/02 ,  G01J1/42 ,  G01S7/481 ,  G01S17/02 ,  G06F3/03 ,  G06F3/0354 ,  H01L23/12 ,  H03K17/94 ,  H03K17/945 ,  H05K1/02 ,  H05K3/08 ,  H05K3/10

CPC classification number: G01V8/20 ,  G01B11/14 ,  G01J1/429 ,  G01J5/0025 ,  G01J5/0809 ,  G01J5/0868 ,  G01J5/0896 ,  G01S7/4813 ,  G01S7/4815 ,  G01S17/00 ,  G01S17/026 ,  G06F3/0304 ,  G06F3/03547 ,  H01L2924/15156 ,  H03K17/943 ,  H03K2017/9455 ,  H03K2217/94111 ,  H05K1/0284 ,  H05K3/108 ,  H05K2201/0338 ,  H05K2201/10151 ,  H05K2201/2054

公开(公告)号：EP2820596A1

公开(公告)日：2015-01-07

申请号：EP13764036.3

申请日：2013-03-20

Applicant: LG Innotek Co., Ltd.

Inventor： Lim, Seol Hee

IPC: G06K19/077 ,  H05K1/18

CPC classification number: H05K1/05 ,  C25D3/14 ,  C25D3/16 ,  C25D5/022 ,  C25D5/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/0104 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/10159 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

Abstract translation: 用于存储卡的印刷电路板包括在绝缘层; 在绝缘层的第一表面的安装部分，该安装部分被电连接到存储装置; 和在所述绝缘层的第二表面上的端子部，所述端子部电连接到外部电子设备，worin具有相同的属性是形成在安装部和所述端子部分的暴露的表面上的相同的金属层。

公开(公告)号：EP2773169A1

公开(公告)日：2014-09-03

申请号：EP12842736.6

申请日：2012-09-28

Applicant: Kyocera Corporation

Inventor： NAKAMURA,Kiyotaka ,  OHASHI,Yoshio ,  SHIKATA,Kunihide

IPC: H05K1/09 ,  H05K3/24

CPC classification number: H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

Abstract: [Object] To provide a circuit board having good heat dissipation characteristics capable of promptly dissipating the heat generated by a metal wiring layer on the basis of operations of an electronic component and exhibiting high reliability enabling a long term of use by improving the adhesion strength between a ceramic sintered body and a metal wiring layer and, thereby, reducing peeling of the metal wiring layer due to cooling/heating cycles when operation and non-operation of the electronic component are repeated, and an electronic apparatus in which an electronic component is mounted on the circuit board.
[Solution] A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12b is smaller than the average grain size in the second region 12b.

Abstract translation: 本发明提供一种具有良好的散热特性的电路板，其能够基于电子部件的操作迅速地消散由金属布线层产生的热量，并且具有高的可靠性，能够长期使用，从而提高第 陶瓷烧结体和金属布线层，并且由此在电子部件的操作和不操作被重复时由于冷却/加热循环而减少金属布线层的剥离;以及电子装置，其中安装电子部件 在电路板上。 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主面接触的第一区域12a， 包含位于第一区域12a上并且不含有玻璃成分的玻璃成分和第二区域12b，第一区域12a的厚度为金属布线的厚度的35％以上且70％以下 层12，第一区域12b的平均粒径小于第二区域12b的平均粒径。