公开(公告)号：EP2225540A1

公开(公告)日：2010-09-08

申请号：EP08861031.6

申请日：2008-12-04

Applicant: Continental Automotive GmbH

Inventor： MATTMANN, Erich

IPC: G01F23/38 ,  H01C10/32 ,  H01H36/02

CPC classification number: H05K3/246 ,  B60K2015/03217 ,  G01D5/165 ,  G01F23/363 ,  G01F23/38 ,  H01C10/32 ,  H01H1/023 ,  H01H36/02 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/4061 ,  H05K2201/0338 ,  H05K2201/0347

Abstract: The invention relates to a tank sensor circuit board for a fill level sensor in a vehicle tank, comprising a support element (1), on which contact surfaces (18, 24) containing silver are applied using thick layer technology. The contact surfaces (18, 24) are made up of a silver layer (2, 5) and a top layer (7, 8) containing nickel, palladium and gold, completely or partly covering the silver layer (2, 5).

公开(公告)号：EP1435658B1

公开(公告)日：2010-05-26

申请号：EP02779905.5

申请日：2002-10-07

Applicant: Tokuyama Corporation

Inventor： YAMAMOTO, Reo ,  KAMIYAMA, Yoshihide

IPC: H01L23/12 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/114 ,  H05K3/0008 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/246 ,  H05K3/4061 ,  H05K2201/0317 ,  H05K2201/0347 ,  H05K2201/10674 ,  H05K2203/167 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

公开(公告)号：EP2163146A2

公开(公告)日：2010-03-17

申请号：EP08759776.1

申请日：2008-05-20

Applicant: BASF SE

Inventor： LOCHTMAN, Rene ,  KACZUN, Jürgen ,  WAGNER, Norbert ,  PFISTER, Jürgen ,  HENTSCHEL, Dieter

IPC: H05K3/02 ,  B32B37/02 ,  B05D1/00 ,  B05D1/38 ,  B05D3/10 ,  B05D5/12 ,  B05D7/00

CPC classification number: B05D1/286 ,  B05D1/00 ,  B05D3/101 ,  B05D5/12 ,  B05D7/577 ,  B05D2350/33 ,  B32B38/0012 ,  B32B38/10 ,  B32B2037/243 ,  B32B2038/0092 ,  B32B2310/0843 ,  H05K1/095 ,  H05K3/025 ,  H05K2201/0347 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/0723 ,  Y10T156/10

Abstract: The invention relates to a method for producing polymer-coated metal foils, comprising the following steps: (a) a base layer (7) is applied to a carrier foil (3) by means of a dispersion (5) containing particles that can be electroless-plated or electroplated in a matrix material; (b) the matrix material is at least partially dried and/or at least partially hardened; (c) a metal layer (19) is formed on the base layer (7) by subjecting the base layer (7) containing the particles that can be electroless-plated or electroplated to an electroless plating or electroplating process; (d) a polymer (23) is applied to the metal layer (19). The invention further relates to a use of the polymer-coated metal foil produced according to the invention for manufacturing printed circuit boards.

公开(公告)号：EP2159805A1

公开(公告)日：2010-03-03

申请号：EP09173628.0

申请日：2006-08-31

Applicant: BASF SE

Inventor： Schneider, Norbert ,  Lippert, Gerald ,  Lochtman, Rene ,  Maas, Heiko ,  Pfister, Jürgen ,  Sobotka, Bettina ,  Wagner, Norbert

IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: Die vorliegende Erfindung betrifft eine Dispersion zum Aufbringen einer Metallschicht auf einem elektrisch nicht leitfähigen Substrat enthaltend eine organischen Bindemittelkomponente, eine Metallkomponente mit unterschiedlichen Metallen und/oder Metallteilchenformen sowie einer Lösemittelkomponente. Weiterhin betrifft die Erfindung Verfahren zur Herstellung der Dispersion, Verfahren zur Herstellung einer gegebenenfalls strukturierten Metallschicht mit Hilfe der Dispersion sowie die erhaltenen Substratoberflächen und deren Verwendung.

Abstract translation: 分散体在上电等非导电基底包括有机粘合剂成分的施加金属层（0.01-30重量％）; （0.01-99.99％（重量）），其包含第一金属具有第一金属粒子和具有第二金属粒子的第二金属的金属组分（30-89.99重量％。）（99.99-0.01重量％）; 和溶剂组分（10-69.99重量％。）; 其中，所述第一金属和 - 粒子和第二金属和 - 粒子是从海誓山盟不同。 独立权利要求中包括了：（1）用于制备分散体，包括有机粘合剂成分的混合的方法中，金属成分包含具有第一金属粒子和具有第二金属粒子的第二金属，溶剂组分的第一种金属，分散剂 ，填料组分和另外的组分，和所获得的混合物分散; （2）金属层的制备上的至少一个电其他非导电基底包括将所述分散体在基板上的一部分，干燥在基材上和该分散体中的应用层OPTIONALLY去激励和/或电气上的干燥的分离金属 分散层; 和（3）的表面的衬底，其包含至少一个部分导电金属层。

公开(公告)号：EP2143310A1

公开(公告)日：2010-01-13

申请号：EP08736296.8

申请日：2008-04-17

Applicant: CeramTec AG

Inventor： KLUGE, Claus Peter

IPC: H05K3/00

CPC classification number: H05K3/0097 ,  H05K1/0284 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2203/1147 ,  H05K2203/1536

Abstract: The invention relates to a method for the selective surface treatment of a first workpiece (1) on at least one of the metalized areas (3) of its upper (4) and/or underside (5), the first workpiece (1) being releasably joined to at least one additional workpiece (2) on one of its faces (4, 5) so as to be sealed from the exterior in at least one partial area and the selective surface treatment of the areas not covered by the joined section being carried out in a treatment phase. In order to make cooling and distribution of the metalized areas easier, the at least first workpiece (1) is not configured as a flat structure and is provided on at least one face with identically or differently metalized or non-metalized areas (3) or cavities or combinations thereof either across the whole surface or part of the surface and at least one additional metallic protective layer or an additional metallic coating is applied during the selective surface treatment.

公开(公告)号：EP1926784B1

公开(公告)日：2010-01-13

申请号：EP06793112.1

申请日：2006-08-31

Applicant: BASF SE

Inventor： SCHNEIDER, Norbert ,  LIPPERT, Gerald ,  LOCHTMAN, Rene ,  MAAS, Heiko ,  PFISTER, Jürgen ,  SOBOTKA, Bettina ,  WAGNER, Norbert

IPC: C09D5/24

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof.

公开(公告)号：EP1581032A4

公开(公告)日：2009-10-21

申请号：EP04819794

申请日：2004-11-29

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  HIRAI SHOGO

IPC: H05K1/16 ,  H05K3/24 ,  H05K3/28

CPC classification number: H05K3/246 ,  H05K1/092 ,  H05K1/165 ,  H05K3/24 ,  H05K3/28 ,  H05K2201/0347 ,  H05K2203/0315 ,  Y10T428/24917 ,  Y10T428/24926

公开(公告)号：EP2104408A1

公开(公告)日：2009-09-23

申请号：EP07860057.4

申请日：2007-12-25

Applicant: JTEKT Corporation

Inventor： NAKAI, Motoo ,  NAGASE, Shigeki

IPC: H05K3/46 ,  B62D5/04

CPC classification number: H05K1/0206 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K3/0061 ,  H05K3/244 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/0959 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Conducting layers 11 and resin-made insulating layers 12 are alternately laminated to form a laminated circuit portion 13, and a metal substrate 14 is installed so as to be in contact with an insulating layer 12, which is the lowermost layer. The conducting layers 11, the insulating layers 12, and the metal substrate 14 are thermal compression bonded. In order to connect the uppermost conducting layer 11 on which electronic component 31 is placed with the lowermost insulating layer 12, a conducting layer 22 is formed on the inner surface by copper plating to install a heat dissipating via 21 into which a resin 23 is filled. A conducting layer 11, which is the uppermost layer, is subjected to gold plating 15, with nickel plating undercoated. An electronic component for driving a motor 31 is placed on the uppermost conducting layer 11, by which the metal substrate 14 can be used as a motor drive circuit substrate for an electric power steering system.

Abstract translation: 导电层11和树脂制绝缘层12交替层叠以形成层叠电路部分13，并且金属基板14被安装成与作为最下层的绝缘层12接触。 导电层11，绝缘层12和金属基板14被热压接。 为了将其上放置有电子部件31的最上层的导电层11与最下层的绝缘层12连接，通过镀铜在内表面上形成导电层22，以安装填充有树脂23的散热通孔21 。 作为最上层的导电层11进行镀金15，镀镍底涂层。 用于驱动电动机31的电子部件被放置在最上面的导电层11上，金属基板14可以用作电动助力转向系统的电机驱动电路基板。

公开(公告)号：EP2099068A1

公开(公告)日：2009-09-09

申请号：EP07851092.2

申请日：2007-12-21

Applicant: Tokuyama Corporation

Inventor： YAMAMOTO, Yasuyuki ,  MAEDA, Masakatsu ,  YATABE, Osamu

IPC: H01L23/12 ,  C04B35/581 ,  H01B5/14 ,  H01L23/15

CPC classification number: H05K3/38 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01L21/4867 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/0347 ,  H05K2201/035 ,  Y10T428/12576 ,  C04B35/581 ,  C04B41/4517 ,  C04B41/4539 ,  C04B41/5133 ,  C04B41/4541 ,  C04B41/5144 ,  C04B41/5127 ,  C04B41/522 ,  C04B41/5116 ,  H01L2924/00

Abstract: The present invention provides a method for manufacturing metallized aluminum nitride substrate, the method comprising: Step A for forming a high-melting point metal layer over a sintered aluminum nitride substrate; Step B for forming over the high-melting point metal layer an intermediate metal layer of at least one selected from the group consisting of: nickel, copper, copper-silver, copper-tin, and gold by plate processing; and Step C for forming a surface metal layer containing silver as a main component over the intermediate metal layer by coating a silver paste whose glass component content is 1 mass % or less and firing under nonoxidizing atmosphere. By this method, it is capable of forming a glass component-free silver layer which is adhered at a high degree of adhesion strength onto the high-melting point metal layer formed over the aluminum nitride substrate as a top face by thick-film method using a silver paste which makes thick-membrane forming easier.

Abstract translation: 本发明提供一种金属化氮化铝基板的制造方法，其特征在于，包括：在氮化铝烧结体基板上形成高熔点金属层的工序A， 步骤B，通过板加工在高熔点金属层上形成选自镍，铜，铜 - 银，铜 - 锡和金中的至少一种的中间金属层; 以及步骤C，通过涂覆玻璃成分含量为1质量％以下的银膏，在非氧化性气氛下进行烧成，在中间金属层上形成含有银为主要成分的表面金属层。 通过该方法，能够通过厚膜法以高膜方式形成粘合强度高的氮化铝基板上形成的高熔点金属层上的无玻璃成分的银层， 使厚膜形成更容易的银糊。

公开(公告)号：EP1923488A3

公开(公告)日：2009-05-27

申请号：EP08152453.0

申请日：1999-09-14

Applicant: Ibiden Co., Ltd.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A process for manufacturing a multilayer printed circuit board comprises a step for providing openings in an interlayer insulating layer (4002), and a step for filling up the openings with a plating metal to construct via holes (4007) and, at the same time, build up an upper-layer conductor layer (4005). The electroplating is performed using an aqueous solution containing a metal ion and 0.1 to 1.5 mmol/L of at least one additive selected from the group consisting of thioureas, cyanides and polyalkylene oxides as a plating solution.

Abstract translation: 用于制造多层印刷电路板的工艺包括在层间绝缘层（4002）中提供开口的步骤以及用电镀金属填充开口以构建通孔（4007）的步骤，并且同时， 建立上层导体层（4005）。 电镀使用含有金属离子和0.1至1.5mmol / L的至少一种选自硫脲，氰化物和聚亚烷基氧化物的添加剂的水溶液作为电镀液来进行。