公开(公告)号：EP3016485A2

公开(公告)日：2016-05-04

申请号：EP15183432.2

申请日：2015-09-02

Applicant: ROBERT BOSCH GMBH

Inventor： Gerhaeusser, Martin

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/36

CPC classification number: H05K1/147 ,  H05K1/189 ,  H05K3/281 ,  H05K3/363 ,  H05K5/0082 ,  H05K2201/09481 ,  H05K2203/1311

Abstract: Die Erfindung betrifft ein elektrisches Gerät 1 für den Einsatz in einem kontaminierenden Medium, mit einem Leiterbahnsubstrat 2, das auf wenigstens einer Oberfläche 21 des Leiterbahnsubstrats 2 wenigstens eine elektrische Kontaktfläche 22 aufweist, und mit einer Schutzfolie 3, welche an dem Gerät 1 derart angeordnet ist, dass die wenigstens eine elektrische Kontaktfläche 22 zwischen der Schutzfolie 3 und dem Leiterbahnsubstrat 2 vor dem kontaminierenden Medium geschützt angeordnet ist. Es wird vorgeschlagen, dass die Schutzfolie 3 durch eine flexible Leiterbahnfolie 30 gebildet wird, die wenigstens eine dem Leiterbahnsubstrat 2 zuweisende elektrische Anschlussfläche 36 aufweist, die mit der wenigstens einen elektrischen Kontaktfläche 22 elektrisch leitend verbunden ist. Ferner betrifft die Erfindung ein Verfahren zur Herstellung eines solchen Gerätes.

Abstract translation: 本发明涉及在电气装置1用于在污染介质的用途。包括布线基板2，导体衬底的表面21上具有至少一个2的至少一个电接触面22，并用一个保护膜3，所有这些是 在寻求一种方式布置在设备1上并设置在至少一个电接触面22的保护膜3和布线基板2之间所保护的污染介质之前。 所以建议没有保护膜3是通过柔性印刷电路膜30，一个在布线基板2具有至少归因电连接垫36，所有这些都被电连接到所述至少一个电接触面22日进一步，本发明形成 涉及一种用于制造一个装置搜索的方法。

公开(公告)号：EP2608641A1

公开(公告)日：2013-06-26

申请号：EP12198713.5

申请日：2012-12-20

Applicant: COMPAGNIE INDUSTRIELLE ET FINANCIERE D'INGENIERIE (INGENICO)

Inventor： Mayer, Laurent ,  Nguyen, Frédéric ,  Sulpice, Pascal ,  Coquelet, Didier ,  Robert, Franck ,  Wolff, Caroline

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K5/0217 ,  G06F21/71 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/147 ,  H05K2201/09481

Abstract: L'invention concerne un dispositif de protection d'un circuit imprimé électronique, au moins une zone de contact conductrice (110,120) entre ledit circuit imprimé (10) et un élément de sécurisation (30,40) dudit circuit imprimé.
Selon l'invention, ledit dispositif comprend en outre au moins un plot de surélévation (50) de ladite au moins une zone de contact conductrice (110,120), ledit élément de sécurisation (30, 40) entrant en contact avec ladite zone de contact conductrice (110) par l'intermédiaire d'une zone de contact conductrice dudit plot de surélévation (50).

Abstract translation: 该装置在电子印刷电路（10）和固定元件（300）之间具有开关区（110），例如。 导电机器元件，用于固定印刷电路。 印刷电路包括提升开关区域的升降螺柱（50）。 元件通过螺柱的导电接触区与开关区域接触。 螺柱包括在螺柱的下表面上的一组固定单元，其中固定单元的位置相对于下表面的边缘是中心的。

公开(公告)号：EP2353179A4

公开(公告)日：2012-10-03

申请号：EP09821348

申请日：2009-10-16

Applicant: OCCAM PORTFOLIO LLC

Inventor： FJELSTAD JOSEPH C

IPC: H01L21/60

CPC classification number: H05K1/189 ,  H01L21/568 ,  H01L24/31 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09481 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y10T156/10 ,  Y10T156/1057 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2146557B1

公开(公告)日：2012-05-16

申请号：EP09164411.2

申请日：2009-07-02

Applicant: Thales Holdings UK Plc

Inventor： Lawson, Graham ,  Loiselet, Emmanuel

IPC: H05K1/02

CPC classification number: H05K1/0222 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09536 ,  H05K2201/09609 ,  H05K2201/09618 ,  H01L2924/00014

Abstract: An hermetically sealed integrated microwave circuit comprising a coplanar waveguide on a PCB (3, 4) electrically connected on one major surface to an IC, and thermally and electrically connected to a BGA (5) on its opposite major surface, in which the PCB has at least first and second printed layers, a microwave signal path extends from a ball of the BGA through a through-hole in both printed layers to the coplanar wave guide, and plural ground paths extend from balls (51) of the BGA (5) through first through-holes in the first printed layer of the PCB and through second through-holes of the second printed layer of the PCB, the first and second through-holes being non-coincident, to allow for an hermetic seal across the PCB whilst introducing a predetermined impedance in the PCB between the signal and ground paths.

公开(公告)号：EP2408278A1

公开(公告)日：2012-01-18

申请号：EP11173555.1

申请日：2011-07-12

Applicant: JTEKT CORPORATION

Inventor： Wakita, Yasuyuki

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  B62D5/0406 ,  H05K1/113 ,  H05K3/0061 ,  H05K2201/09481 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A circuit board unit (61) of an ECU (12) has an upper surface (61a) on which semiconductor elements (77) are installed, a lower surface (61b) that is on the opposite side of the circuit board unit (61) from the upper surface (61a), and a cutout portion (91) that is formed below the upper surface (61a). A power module (62) includes a conductive protruding piece (101) and an electrically insulating main portion (65) that holds the protruding piece (101). The conductive protruding piece (101) is inserted in the cutout portion (91) to support the circuit board unit (61), and is electrically connected to the semiconductor elements (77).

Abstract translation: ECU（12）的电路板单元（61）具有安装半导体元件（77）的上表面（61a），位于电路板单元（61）的相对侧上的下表面（61b） 从上表面61a和形成在上表面61a下方的切口部91。 功率模块（62）具备导电性突片（101）和保持该突片（101）的电绝缘性主体部（65）。 导电性突出片101插入到切口部91中，支撑电路基板单元61，并与半导体元件77电连接。

公开(公告)号：EP2012569A4

公开(公告)日：2010-06-02

申请号：EP07742024

申请日：2007-04-20

Applicant: IBIDEN CO LTD

Inventor： KAWAMURA YOICHIRO ,  TANNO KATSUHIKO

IPC: H05K3/34 ,  B23K3/06

CPC classification number: B23K3/0623 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2924/00014 ,  H05K3/3478 ,  H05K3/4644 ,  H05K2201/09481 ,  H05K2203/0195 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/53204 ,  Y10T29/53209 ,  Y10T29/53213 ,  H01L2224/05599

公开(公告)号：EP1536672A4

公开(公告)日：2008-11-12

申请号：EP03760945

申请日：2003-06-24

Applicant: NEC CORP

Inventor： HASHIMOTO YOSHIYUKI ,  SATO JUNYA

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K3/368 ,  H05K3/305 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/09481 ,  H05K2201/10393 ,  Y10T29/49126

Abstract: A board connection structure that enables removal of a board while thinning an electronic apparatus in which circuit boards are mounted and by saving space. This structure comprises a first board (1) with a matrix arrangement of electrode terminals (10) on the surface layer, a second board (2) with a matrix arrangement of electrode terminals (20), opposed to the electrode terminals (10), on the surface layer, and an anisotropic conductive member (3) arranged between the first and second boards (1, 2) in the position facing the electrode terminals (10, 20). The first and second boards (1, 2) and the anisotropic conductive layer (3) are pressed with a pressing component (4) to electrically connect the electrode terminals (10, 20) via the anisotropic conductive member (3).

公开(公告)号：EP1978558A1

公开(公告)日：2008-10-08

申请号：EP08154036.1

申请日：2008-04-03

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Shiraishi, Akinori ,  Murayama, Kei ,  Sunohara, Masahiro ,  Koizumi, Naoyuki ,  Higashi, Mitsutoshi

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1147 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate (101) includes a storage portion (101C) which is defined by a base for mounting a light emitting element (102) and a wall portion standing up on and from the base. A package (100) is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion (101C) is connected to a cover (103) to thereby seal a light emitting element. A seal structure (130; 330; 430) is composed of an uneven portion (140; 340) formed on the lower surface side surface of the base (101A), a close contact layer (150) formed on the surface of the uneven portion (140; 340), a power supply layer (160) formed on the close contact layer (150), and an electrode layer (170) formed on the surface of the power supply layer (160). The uneven portion(140; 340) includes a first recessed portion (180) formed at a position spaced in the radial direction from the outer periphery of a through electrode (107) or from the inner wall of a through hole (120), and a second recessed portion (190) formed at a position spaced further outwardly from the first recessed portion (180).

Abstract translation: 基板（101）包括由用于安装发光元件（102）的底座和从底座上站立的壁部分限定的存储部分（101C）。 包装体（100）被构造为使得形成为围绕存储部（101C）的周边的壁部的上端连接到盖（103），从而密封发光元件。 密封结构（130; 330; 430）由形成在基座（101A）的下表面侧表面上的不平坦部分（140; 340），形成在不平坦部分的表面上的紧密接触层 （140; 340），形成在紧密接触层（150）上的电源层（160）和形成在电源层（160）的表面上的电极层（170）。 不平坦部分（140,340）包括形成在与穿通电极（107）的外周沿径向间隔开的位置或从通孔（120）的内壁隔开的位置的第一凹部（180），以及 形成在与所述第一凹部（180）进一步向外间隔开的位置的第二凹部（190）。

公开(公告)号：EP1844636A2

公开(公告)日：2007-10-17

申请号：EP06733836.8

申请日：2006-01-24

Applicant: 3M Innovative Properties Company

Inventor： SATOH, Kazuo ,  YAMAZAKI, Hideo

IPC: H05K3/36

CPC classification number: H05K3/361 ,  H05K3/28 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1189

Abstract: To provide a PCB that does not generate a short-circuit problem even at a very- small pitch and has high connection reliability a method is provided for connecting a PCB (10) having a connection portion (3) to a second PCB (20) having a connection portion (33) wherein the connection portion of one or both of the PCBs has at least one conductive bump (4) , and comprising: positioning the connection portion of the PCB opposite the connection portion of the second circuit board with a thermosetting adhesive film (30) between the connection portions of the PCB and second circuit board, and applying heat and pressure to the connection portions and the thermosetting adhesive film such that the adhesive film is displaced sufficiently to allow electrical contact between the at least one bump and the connection portion of the opposing circuit board and such that the heat is sufficient to cause the adhesive to set. Also provided is an article comprising a PCB having a connection portion with at least one conductive bump, and a thermosetting adhesive film on the surface of the connection portion.

公开(公告)号：EP1173051B1

公开(公告)日：2007-05-23

申请号：EP00900913.5

申请日：2000-01-25

Applicant: Sony Chemical & Information Device Corporation

Inventor： Kurita, Hideyuki ,  Taniguchi, Masato

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/361 ,  H05K3/305 ,  H05K3/323 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0154 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/0759

Abstract: A flexible printed wiring board (10) in which a metallic bump (1a) of a first flexible printed wiring part (1) is connected to a connection pad (2a) of a second flexible wiring part (2), wherein the first flexible printed wiring part (1) is composed of a conductive layer (4) and an insulating layer (5) adjacent to the conductive layer (4), a hole (A) reaching the conductive layer is made in the insulating layer (5), a metallic plug (6) is formed in the hole (A) by electroplating, and the end of the metallic plug (6) projecting from the insulating layer (5) serves as a metallic bump (1a). As many flexible printed wiring boards as possible are produced from a laminated sheet for a flexible printed wiring having a predetermined size.