公开(公告)号：EP1589570A1

公开(公告)日：2005-10-26

申请号：EP04702046.6

申请日：2004-01-14

Applicant: SONY CORPORATION

Inventor： SENDA, Ayumi

IPC: H01L21/60 ,  H05K3/34

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/10165 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/303 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2203/167 ,  Y02P70/613

Abstract: When a semiconductor chip is mounted on a mount substrate by bonding bumps, bonding failure is caused by misalignment between the bumps.
Before a semiconductor chip having a plurality of bumps is mounted on a mount substrate (3) having a plurality of bumps (4) by flip chip bonding, a resist layer (5) having a thickness larger than that of the bumps (4) is formed on the mount substrate (3) with the bumps. By patterning the resist layer (5), projecting guides (5A) of semicircular cross section are formed on the mount substrate (3) so as to protrude near the bumps (4) and from a surface on which the bumps (4) are provided, and to have guide faces (curved faces) pointing toward the bumps (4).

Abstract translation: 当通过接合凸块将半导体芯片安装在安装基板上时，由于凸点之间的未对准而引起接合失败。 在具有多个凸块的半导体芯片通过倒装芯片接合安装在具有多个凸块（4）的安装基板（3）之前，具有比凸块大的厚度的抗蚀剂层（5） （4）用凸块形成在安装基板（3）上。 通过图案化抗蚀剂层（5），在安装基板（3）上形成半凸形突起（5A），以便在凸块（4）附近突出并且从设置有凸块（4）的表面 并且具有指向凸块（4）的引导面（曲面）。

公开(公告)号：EP1545173A1

公开(公告)日：2005-06-22

申请号：EP04029687.3

申请日：2004-12-15

Applicant: NITTO DENKO CORPORATION

Inventor： Nishi, Kensuke, Nitto Denko Corporation ,  Ishimaru, Yasuto, Nitto Denko Corporation

IPC: H05K3/34 ,  H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/323 ,  H05K3/3452 ,  H05K2201/09709 ,  H05K2201/09909 ,  H05K2201/10674 ,  H01L2924/00

Abstract: At least a particular part of a strip conductor 2 of a wiring circuit board for mounting, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component, is covered with a solder resist 3. The particular part is one section in the longitudinal direction of a strip conductor having a long end, which section includes an area overlapping an electrode which is connected to a short end and transferred in parallel in the strip width direction up to the position on the strip conductor having a long end. As a result, a structure capable of suppressing a short circuit between an electrode and a wiring pattern can be afforded to a wiring circuit board, even to an electronic component having an electrode formed in high-density and in a zigzag arrangement pattern., which comprises an area overlapping an electrode.

Abstract translation: 用于安装的布线电路板的带状导体2的至少一个特定部分，其中带状导体暴露以形成条纹图案，使得单独的导体可以连接到电子部件的电极E，用焊料覆盖 抗蚀剂3.特定部分是具有长端的带状导体的纵向方向上的一个部分，该部分包括与连接短端的电极交叠并且在带宽度方向上平行移动直到位置 在具有长端的带状导体上。 结果，即使对于具有以高密度且以锯齿形排列图案形成的电极的电子部件，也能够为布线电路板提供能够抑制电极和布线图案之间的短路的结构，其中 包括与电极重叠的区域。

公开(公告)号：EP0952761A4

公开(公告)日：2005-06-22

申请号：EP97924293

申请日：1997-05-30

Applicant: ROHM CO LTD

Inventor： NAKAMURA SATOSHI

IPC: H05K3/00 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H01R12/52 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/083 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09909 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0545 ,  H05K2203/104 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A method for mounting terminal on circuit board includes an applying process for applying solder paste (3) to a circuit board (1), a laying process for laying the connecting ends (4a) of terminals (4) having the connecting ends (4a) and non-connecting ends (4b) on the parts coated with the paste (3), and a heating process for melting paste (3) for soldering the connecting ends (4a) to the board (1). The method also includes a process for applying an adhesive (6) to the board (1). In the laying process, the connecting ends (4a) are brought into contact with the parts coated with the adhesive (6). In the heating process, the paste (3) is melted by heating in a state where the connecting ends (4a) are stuck to the board (1) with the adhesive (6).

Abstract translation: 本发明提供在电路板上涂布焊膏（3）的涂布工序（1），对于一个终端的叠加的连接端（4a）的一个重叠工序（4），因此具有在非连接端（4b）的 为了焊接的连接端（4a）的在电路板上涂上焊膏（3），和用于加热的加热工序和熔化焊料膏（3）区域（1）。 用于在电路板（1）涂覆胶粘材料（6）的另一步骤被提供，并且在上述叠加步骤中，将连接端（4a）的被带入与涂有粘接材料的区域（6）接触。 在上述加热步骤中，焊膏（3）被加热以熔化并引起而连接端（4a）的通过粘接材料的装置处于接合状态相对于所述电路板（1）（6）。

公开(公告)号：EP1352548A1

公开(公告)日：2003-10-15

申请号：EP01270087.8

申请日：2001-12-10

Applicant: Xaar Technology Limited

Inventor： BAKER-SMITH, Hugh ,  KINGS, Donald ,  TATUM, John

IPC: H05K3/00 ,  H05K3/10

CPC classification number: H05K3/46 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1173

Abstract: A method of forming a printed circuit board using an ink jet print head by printing a three dimensional groove using a curable, non-conductive deposition liquid and depositing a liquid that dries to form a conductive track. The walls on either side of the groove impede the liquid from spreading and consequently larger quantities of the conductive deposition liquid can be deposited without causing a short circuit. A multi layer printed circuit board can be produced by depositing further layers of curable non-conductive deposition liquid over the conductive track, a further conductive track in an upper layer being in contact with a conductive track in a lower layer along a slope formed from the non-conductive deposition liquid.

Abstract translation: 使用喷墨打印头通过使用可固化的非导电沉积液印刷三维凹槽并沉积干燥形成导电轨迹的液体来形成印刷电路板的方法。 槽的任一侧的壁阻碍液体的扩散，因此可以沉积大量的导电沉积液体而不引起短路。 多层印刷电路板可以通过在导电轨道上沉积可再循环的非导电沉积液体的另外的层来制造，上层中的另一个导电轨道沿着沿着形成的斜面形成的斜面与下层中的导电轨道接触 非导电沉积液。

公开(公告)号：EP1055557A3

公开(公告)日：2003-05-02

申请号：EP00111207.7

申请日：2000-05-24

Applicant: ICHIKOH INDUSTRIES, LTD.

Inventor： Okubo, Katsuhiko, c/o Ichikoh Industries, Ltd.

IPC: B60Q1/26 ,  F21S8/10 ,  H05K3/30

CPC classification number: H05K3/306 ,  B60Q1/2696 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09072 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2203/1178

Abstract: There is provided a vehicle lighting device employing a plurality of light-emitting diodes (1) as light sources. Mount pads are provided on a light-emitting diode mount surface (21) of a circuit board (2). On the circuit board (2), the mount pads (40) are provided on both sides of a plurality of pairs of through-holes (20). When two leads (12,13) of the light-emitting diode (1) are inserted into the pair of two through-holes (20), respectively, and the light-emitting diode (1) is mounted to the mount pads (40) on the both sides, an air vent space is formed which is defined by the light-emitting diode (1), the circuit board (2), and the mount pads (40) on the both sides. Accordingly, air comes out smoothly of the through-holes (20) via the space (42) when solder (3) is entered the through-holes (20) in an automated soldering process. This allows the light-emitting diodes (1) to be disposed in place relative to the circuit board (2). Furthermore, it is ensured that the leads (12,13) of the light-emitting diodes (1) and conductive traces of the circuit board (2) are connected to each other via solder (3).

公开(公告)号：EP1073322A1

公开(公告)日：2001-01-31

申请号：EP00202328.1

申请日：2000-07-03

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Manesh K.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/303 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09909 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of improving the life expectancy of surface mount components (10) in electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a predetermined distance defined as the stand-off height (16). The relationship between the stand-off height (16) and the life expectancy of the component is directly proportional. A larger stand-off height (16) translates into a longer life expectancy. The stand-off height (16) is limited only by manufacturing constraints, such as process limitations and cost concerns. The stand-off height (16) is set to a predetermined dimension by way of a spacer (28) positioned between the surface mount component (10) and the printed circuit board (12).

Abstract translation: 一种改善电子组件中的表面安装部件（10）的预期寿命的方法，其中印刷电路板和表面安装部件之间的距离被保持为限定为支座高度（16）的预定距离。 间隔高度（16）与部件的预期寿命之间的关系是直接成正比的。 更大的间隔高度（16）转化为更长的预期寿命。 对立高度（16）仅受制造限制，例如过程限制和成本问题的限制。 通过位于表面安装部件（10）和印刷电路板（12）之间的间隔件（28）将间隔高度（16）设定为预定尺寸。

公开(公告)号：EP0908943A2

公开(公告)日：1999-04-14

申请号：EP98308096.1

申请日：1998-10-05

Applicant: Ford Motor Company

Inventor： Meyer, Bernard Allen ,  McMillan II, Richard Keith ,  Glovatsky, Andrew Z. ,  Trublowski, John

IPC: H01L21/60

CPC classification number: H01L23/4334 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0206 ,  H05K3/341 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0112 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/107 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

Abstract translation: 这里公开了一种电子部件10，其具有专门设计用于辅助将散热器激光焊接到衬底20上的焊盘22的整体散热器16。组件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大致垂直于顶表面和底表面之间。 部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端子14的一部分。散热器16限定电子部件10的底表面32的至少一部分，并且至少 电子部件10的至少一个周边外表面34的一部分。

公开(公告)号：EP0587382B1

公开(公告)日：1998-03-11

申请号：EP93306988.2

申请日：1993-09-03

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Horiuchi, Michio, c/o Shinko Elec. Ind. Co. Ltd. ,  Hayashi, Koichiro, c/o Shinko Elec. Ind. Co. Ltd. ,  Harayama, Yoichi, c/o Shinko Elec. Ind. Co. Ltd.

IPC: H05K3/46 ,  H01L21/48

CPC classification number: H01L21/4857 ,  H01L21/4867 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/115 ,  H05K3/245 ,  H05K3/388 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0317 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2203/025 ,  H05K2203/1383

公开(公告)号：EP0817550A1

公开(公告)日：1998-01-07

申请号：EP97109791.0

申请日：1997-06-16

Applicant: NGK Spark Plug Co. Ltd.

Inventor： Murata, Haruhiko ,  Kimura, Yukihiro

IPC: H05K3/30

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/13111 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

Abstract: A circuit board capable of positioning and bonding thereto a flip chip or the like with ease and accuracy, is provided. The circuit board includes a plurality of projections for controlling the position of an external side surface of a mounted board to be mounted on the substrate and thereby positioning the mounted board in a predetermined place on the substrate. A method of making such a circuit board is also provided.

Abstract translation: 提供了能够容易且精确地定位和结合倒装芯片等的电路板。 电路板包括多个突起，用于控制安装在基板上的安装板的外侧表面的位置，从而将安装的板定位在基板上的预定位置。 还提供了制造这种电路板的方法。

公开(公告)号：EP0797910A1

公开(公告)日：1997-10-01

申请号：EP96931205.0

申请日：1996-10-04

Applicant: PHILIPS ELECTRONICS N.V.

Inventor： FRIEND, Stephen, D., E., J. ,  ROBERTS, John, W., J., W.

IPC: H05K3

CPC classification number: H05K3/428 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/09909 ,  H05K2203/0571 ,  H05K2203/058 ,  H05K2203/072

Abstract: Through holes (18) of a printed circuit board (10, 12) are plated by electroless metal deposition. A plating mask (22) has openings (24) which are larger than the conductive areas (19) around the through holes. Shielding portions (28), which may be of a solder resist material, prevent undesired deposition of metal on the substrate (10) and can be accurately positioned by screen printing.