公开(公告)号：EP1276357A2

公开(公告)日：2003-01-15

申请号：EP02015752.5

申请日：2002-07-13

Applicant: Behr-Hella Thermocontrol GmbH

Inventor： Röhling, Hans-Dieter

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10416

Abstract: Die Leiterplatte für elektrische Schaltungen ist mit einer Trägerplatte (12) versehen, die eine Ober- und eine Unterseite (14,16) aufweist, wobei sich in mindestens einer dieser Seiten (14,16) der Trägerplatte (12) eine von einem Rand begrenzte Ausnehmung (22) befindet. Ferner ist die Leiterplatte mit einem ein elektrisch leitendes Material aufweisenden Wärmeleitelement (24) versehen, das in die mindestens eine Ausnehmung (22) eingepasst und im wesentlichen mit der betreffenden Seite (14,16) der Trägerplatte (12) fluchtend angeordnet ist. Auf mindestens der mit der mindestens einen Ausnehmung (22) versehenen Seite (14,16) der Trägerplatte (12) verlaufen Leiterbahnen (32) aus elektrisch leitendem Material. Das Wärmeleitelement (24) ist von dem elektrisch leitenden Material der Leiterbahnen (32) überdeckt und diese Überdeckung (34) erstreckt sich zumindest bereichsweise bis über den Rand der Ausnehmung (22).

Abstract translation: 电路板具有在其主表面（14,16）的至少一个中设置有凹部（22）的承载板（12），其接纳导电材料的导热元件（24），其与 承载板的表面并且由电导体路径（32）覆盖。

公开(公告)号：EP0852897B1

公开(公告)日：2001-09-05

申请号：EP96933992.8

申请日：1996-09-30

Applicant: INTEL CORPORATION

Inventor： WATSON, Jeff, R. ,  GOETSCH, Michael, N. ,  NOVAL, Jim, V. ,  ASPANDIAR, Raiyo, F.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K3/341 ,  H01L21/4882 ,  H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: A low cost method for attaching a heat slug (40) to a printed circuit board (30) using surface-mount technology. In one embodiment a metal coating (36) is deposited about the periphery of an opening of a printed circuit board. Solder paste is then applied over the metal coating. The heat slug is then installed into the opening of the printed circuit board using a standard pick-and-place surface-mount machine. When installed, the ledge of the heat slug rests atop the previously deposited solder. The connection between the printed circuit board and heat slug is made by running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the PCB and onto the heat slug.

公开(公告)号：EP0751562B1

公开(公告)日：2001-07-18

申请号：EP96106943.2

申请日：1996-05-03

Applicant: Braun GmbH

Inventor： Hiller, Hans-Martin ,  Stratmann, Martin ,  Werhahn, Friedrich ,  Debus, Wolfram ,  Oppermann, Günter

IPC: H01L23/367

CPC classification number: H01L23/3672 ,  H01L23/3677 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10416 ,  Y10T29/49142 ,  Y10T29/49144 ,  H01L2924/00

公开(公告)号：EP1018146A1

公开(公告)日：2000-07-12

申请号：EP99925964.1

申请日：1999-05-27

Applicant: Rompower Inc.

Inventor： JITARU, Ionel

IPC: H01L21/00

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

公开(公告)号：EP0956746A1

公开(公告)日：1999-11-17

申请号：EP97909792.0

申请日：1997-10-10

Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (publ)

Inventor： BERGSTEDT, Leif, Roland

IPC: H01L23 ,  H05K1 ,  H05K3

CPC classification number: H01L23/3735 ,  H01L23/367 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a method and means for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated mean is totally or partly recessed in a carrier in the printed board. The chip is placed over the temperature-compensated mean. The temperature-compensated mean includes a piece of metal recessed in the carrier under the chip. A layer of copper is fixed against the upper side of the carrier and the upper side of the metal piece. The thickness of the copper layer and the thickness of the metal piece are dimensioned so that the resulting coefficient of linear expansion at the upper side of the copper layer is equally big as or a bit bigger than the coefficient of linear expansion of the chip. The temperature-compensated mean can as an alternative to the above include a module recessed in the carrier under the chip. A thin layer of dielectric is fixed against the carrier, so that the coefficient of linear expansion of the dielectric layer do not appreciably affect the resulting coefficient of linear expansion of the temperature-compensated mean.

Abstract translation: 本发明涉及一种用于制造印刷电路板上芯片的温度补偿垫层的方法和装置，其中温度补偿装置在印刷电路板中完全或部分地凹进载体中。 芯片放置在温度补偿的平均值上。 温度补偿装置包括在芯片下面的载体中嵌入的一块金属。 一层铜固定在载体的上侧和金属片的上侧。 确定铜层的厚度和金属片的厚度，使得在铜层上侧的最终线性膨胀系数与芯片的线性膨胀系数相同或稍大。 作为上述替代的温度补偿装置可以包括在芯片下面的载体中凹进的模块。 薄层电介质固定在载体上，使得电介质层的线性膨胀系数不明显地影响温度补偿平均值的所得线性膨胀系数。

公开(公告)号：EP0913861A2

公开(公告)日：1999-05-06

申请号：EP98307725.6

申请日：1998-09-23

Applicant: Hewlett-Packard Company

Inventor： Rubens, Paul A. ,  Gilson, Charlie W. ,  Spreadbury, Brian G. ,  Irmscher, Horst F. ,  Jondrow, Tim J.

IPC: H01L21/48

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2924/14 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2203/0191 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A heat conductive substrate (50) is mounted within a through-opening (60) of a printed circuit board (52). An integrated circuit (42) then is mounted to one side of the heat conductive substrate, while a heat sink (90) is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions (71) of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap (75) occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery (67) of the substrate.

Abstract translation: 导热基板（50）安装内的通孔的印刷电路板（52）的（60）。 一种集成电路（42），然后被安装到导热基片的一侧，而一个热沉（90）被固定在热接触于基板的另一侧。 有IC和PCB板之间没有直接的热接触。 导热基板，通过施加受控的压力到衬底的多个部分（71）的正常表面安装到印刷电路板上。 搜索压力减小厚度和扩展被按压部锁定基板到PC板的面积。 的空气间隙（75）的基片与PC板间的发生到处除了基板的按压区域。 搜索被按压区域沿所述基板的周缘（67）好发。

公开(公告)号：EP0836227A3

公开(公告)日：1999-03-10

申请号：EP97307122.8

申请日：1997-09-15

Applicant: Hewlett-Packard Company

Inventor： Esterberg, Dennis R. ,  Smith, Mark A. ,  Rubens, Paul A. ,  Lang, Tracy A.

IPC: H01L23/367

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K2201/09054 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10681 ,  H05K2203/0191 ,  H01L2924/00

Abstract: A heat conductive substrate (50) is mounted within a through-opening (60) of a printed circuit board (52). An integrated circuit (42) then is mounted to one side (64) of the heat conductive substrate, while a heat sink (90) is fixed in thermal contact to the other side (66) of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface (70) of the PC board and concentrically spaced from the PC board within the opening (60). An air gap (80) occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.

Abstract translation: 导热基板（50）安装在印刷电路板（52）的通孔（60）内。 然后，将集成电路（42）安装到导热基板的一侧（64），同时散热器（90）固定成与基板的另一侧（66）热接触。 IC和PC板之间没有直接的热接触。 基板被安装到PC板的下表面（70）并且与开口（60）内的PC板同心地间隔开。 在开口内的衬底和PC板之间发生气隙（80），以大大降低PC板的导热性。

公开(公告)号：EP0852897A1

公开(公告)日：1998-07-15

申请号：EP96933992.0

申请日：1996-09-30

Applicant: INTEL CORPORATION

Inventor： WATSON, Jeff, R. ,  GOETSCH, Michael, N. ,  NOVAL, Jim, V. ,  ASPANDIAR, Raiyo, F.

IPC: H01L21 ,  H01L23 ,  H05K1 ,  H05K3 ,  H05K7

CPC classification number: H05K3/341 ,  H01L21/4882 ,  H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: A low cost method for attaching a heat slug (40) to a printed circuit board (30) using surface-mount technology. In one embodiment a metal coating (36) is deposited about the periphery of an opening of a printed circuit board. Solder paste is then applied over the metal coating. The heat slug is then installed into the opening of the printed circuit board using a standard pick-and-place surface-mount machine. When installed, the ledge of the heat slug rests atop the previously deposited solder. The connection between the printed circuit board and heat slug is made by running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the PCB and onto the heat slug.

公开(公告)号：EP0849981A1

公开(公告)日：1998-06-24

申请号：EP97250381.7

申请日：1997-12-22

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  PPC Electronic AG

Inventor： Richter, Dietrich ,  Berchtold, Dieter ,  Lancki, Marian ,  Wissmeier, Hans-Georg ,  Straub, Peter ,  Diehm, Peter

IPC: H05K1/02 ,  H01L23/36 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H05K1/0206 ,  H05K3/341 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/1581 ,  Y02P70/613 ,  Y10S428/901

Abstract: Die Erfindung bezieht sich auf eine beidseitig kupferkaschierte Leiterplatte mit einer Blei-Zinn-Schicht auf der Kupferkaschierung und mit einem plattenförmigen Kühlkörper.
Um von einer derartigen Leiterplatte durch auf ihr befindliche elektronische Bauelemente erzeugte Wärme gut ableiten zu können, ist der mit einer kupfernen Oberfläche und darauf aufgebrachter Silberschicht (8) versehene Kühlkörper (6) auf eine Seite der Leiterplatte (1) aufgelötet.
Bei einem Verfahren zur Herstellung einer derartigen Leiterplatte ist ein eine kupferne Oberfläche aufweisender Kühlkörper (6) mit einer Silberschicht (8) versehen und wird mit seiner die Silberschicht (8) tragenden Seite (7) auf die Leiterplatte (1) aufgelegt. Der Kühlkörper (6) wird mit der Leiterplatte (1) verpreßt, wobei an dem Kühlkörper (6)eine beheizte Andruckplatte (20) anliegt.

Abstract translation: 的双面或多层覆铜电路板（1），具有一个Pb-Sn层（4,5）上的铜覆层，具有已经涂覆其与银层与铜表面的冷却板（6）（ 8）焊接到电路板（1）的一侧上之前。 优选地，冷却板（6）是一个铜板或银包覆覆铜塑料板与散热孔哪个可以是铜或镀金属填充有导热膏。 这样一种被用于通过提供一种冷却板（6）的铜表面与银层（8），在电路板上将所述银层侧的冷却板（6）的制备上述电路板的方法（1） 和加压冷却板（6）安装到利用加热的压力板（20）的板，优选同时冷却该板的相对侧。

公开(公告)号：EP0836227A2

公开(公告)日：1998-04-15

申请号：EP97307122.8

申请日：1997-09-15

Applicant: Hewlett-Packard Company

Inventor： Esterberg, Dennis R. ,  Smith, Mark A. ,  Rubens, Paul A. ,  Lang, Tracy A.

IPC: H01L23/367

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K2201/09054 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10681 ,  H05K2203/0191 ,  H01L2924/00

Abstract: A heat conductive substrate (50) is mounted within a through-opening (60) of a printed circuit board (52). An integrated circuit (42) then is mounted to one side (64) of the heat conductive substrate, while a heat sink (90) is fixed in thermal contact to the other side (66) of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface (70) of the PC board and concentrically spaced from the PC board within the opening (60). An air gap (80) occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.