公开(公告)号：EP0333237A3

公开(公告)日：1990-03-21

申请号：EP89109818.8

申请日：1985-05-16

Applicant: BRITISH TELECOMMUNICATIONS public limited company

Inventor： Whitehead, Graham Keith ,  Taylor, Kenneth

IPC: H01L23/50 ,  H01L23/12

CPC classification number: H05K3/3442 ,  H01L23/057 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3677 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/244 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09709 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2203/0723 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A chip carrier produced by injection moulding from an aromatic thermoplastic polymer has a relief pattern in a die attachment site (8). The relief pattern isolates an attached die from the thermally induced strains when the carrier is attached to a circuit board. In further features, the chip carrier includes a body (1) having a central region and sidewalls (3) connected to the central region by an elastically deformable region (33), in order to further reduce thermal strains. Also for the same reason a heat sink (41) may be attached underneath the carrier below the carrier's die attachment site (8) and thermally conductive material (40, 42) may connect them together. The heat sink may be used for mechanical anchorage.

Abstract translation: 通过从芳香族热塑性聚合物注塑制造的芯片载体在芯片附着部位（8）具有浮雕图案。 当载体附接到电路板时，浮雕图案将附着的模具与热诱导应变隔离。 在另外的特征中，芯片载体包括具有中心区域的主体（1）和通过可弹性变形区域（33）连接到中心区域的侧壁（3），以便进一步减少热应变。 同样的原因，散热器（41）可以在载体下方的载体的芯片附接位置（8）下方附接，并且导热材料（40,42）可以将它们连接在一起。 散热器可用于机械锚固。

公开(公告)号：EP0297511A2

公开(公告)日：1989-01-04

申请号：EP88110305.5

申请日：1988-06-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LIMITED

Inventor： Sasame, Akira c/o Itami Works of Sumitomo ,  Sakanoue, Hitoyuki c/o Itami works of Sumitomo ,  Tekeuchi, Hisao c/o Itami works of Sumitomo ,  Miyake, Masaya c/o Itami works of Sumitomo ,  Yamakawa, Akira c/o Itami works of Sumitomo ,  Yushio, Yasuhisa c/o Itami works of Sumitomo ,  Akazawa, Hitoshi c/o Itami works of Sumitomo

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/14 ,  H01L23/08 ,  H01L23/10

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/1034 ,  H05K2201/10909 ,  H05K2201/10916 ,  Y10T428/12576 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A connection structure between lead frames (3) and a base plate (1) of aluminum nitride, to be applied as a connection structure between components of a semiconductor apparatus, comprises the base plate formed of a sintered body of aluminum nitride on which a semiconductor device is to be mounted, the lead frames including, as a main material, iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and silver solder (9) for joining the base plate and the lead frames. A surface of the lead frame to be joined to the base plate is formed of oxygen-free copper of a high plastic deformativity to relieve, by plastic deformation of itself, a thermal stress caused by a difference between a thermal expansion coefficient of the base plate and that of the lead frame in a cooling process at the time of soldering. Preferably, only a portion of each lead frame (3) to be joined to the base plate comprises an inner layer portion of iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and an outer layer portion of oxygen-free copper.

Abstract translation: 引线框架（3）和氮化铝的基板（1）之间的连接结构将被用作半导体装置的部件之间的连接结构，包括由氮化铝烧结体形成的基板，其上形成半导体 要安装的装置，引线框架包括作为主要材料的含有29重量％的镍和17重量％的钴的铁合金和用于连接基板和引线框架的银焊料（9）。 要连接到基板的引线框架的表面由具有高塑性变形性的无氧铜形成，以通过其自身的塑性变形来释放由基板的热膨胀系数之间的差异引起的热应力 以及在焊接时的冷却过程中的引线框架。 优选地，仅接合到基板的每个引线框架（3）的一部分包括含有29重量％的镍和17重量％的钴的铁合金的内层部分， 免费铜。

公开(公告)号：EP2166623B1

公开(公告)日：2018-09-05

申请号：EP09011795.3

申请日：2009-09-16

Applicant: Kitagawa Industries Co., Ltd.

Inventor： Yumi, Hideo

IPC: H01R13/03 ,  H01R13/24

CPC classification number: H01R13/03 ,  H01R13/2442 ,  H05K1/0233 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/086 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: A surface mount contact interposes between a mounted conductor and a pressing conductive member to make the mounted conductor conductive to the pressing conductive member when the mounted conductor and the pressing conductive member are proximate to each other. The surface mount contact includes: a base portion solderable to the mounted conductor; a movable portion elastically deformable according to a distance between the mounted conductor and the pressing conductive member, at least a part of the movable portion being closer to the base portion when the movable portion elastically deforms; and an insulating coating film provided in a region where the movable portion is closer to the base portion and inhibiting electric contact between the movable portion and the base portion.

公开(公告)号：EP2609604B1

公开(公告)日：2018-04-25

申请号：EP11773019.2

申请日：2011-08-23

Applicant: Safran Electrical & Power

Inventor： LHOMMEAU, Tony

IPC: H01G4/228 ,  H01G2/06 ,  H05K3/34 ,  H01G4/12

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H05K3/3426 ,  H05K2201/10909 ,  Y02P70/613

公开(公告)号：EP3207774A1

公开(公告)日：2017-08-23

申请号：EP15756896.5

申请日：2015-08-27

Applicant: Robert Bosch GmbH

Inventor： PEUSER, Thomas

IPC: H05K3/34 ,  H05K1/02 ,  H01G2/08 ,  H01G4/228 ,  H01L23/495

CPC classification number: H01G4/228 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/258 ,  H01G4/30 ,  H01L23/3735 ,  H01L23/49555 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/06 ,  H01L29/861 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0516 ,  H01L2224/06181 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10757 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.

Abstract translation: 电子部件本发明涉及一种 电子部件2具有电气组件3，电气组件3具有两个电连接件4,5，每个电连接件都形成在组件的相对面上。 对于每个连接4,5，该部件具有至少一个导电连接元件9,10，该导电连接元件9,10具有用于连接到电路载体22的安装脚14,15。根据本发明，连接元件8,9具有至少两个 金属层10,11,12,13至少在一个部分上，其中金属层各自由不同的金属形成并且彼此整体连接。 优选地，来自金属层的一个金属层12,13具有比另一个金属层10,11更大的导热率。

公开(公告)号：EP2434859B1

公开(公告)日：2016-04-06

申请号：EP10777921.7

申请日：2010-05-17

Applicant: Doo Sung Industrial Co., Ltd.

Inventor： KIM, Seon Tae ,  LEE, Hyung Chun ,  LEE, Sang Won

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H05K3/3421 ,  H01R13/03 ,  H01R13/2414 ,  H05K2201/10909 ,  Y02P70/613

公开(公告)号：EP2596157B1

公开(公告)日：2014-11-19

申请号：EP12717606.3

申请日：2012-04-21

Applicant: Enayati GmbH&Co. Kg Oberflächen- Und Anlagentechnik

Inventor： DREIßIGACKER, Uwe

IPC: C25D3/60 ,  C25D5/08 ,  C25D7/00 ,  H05K3/30 ,  H01R12/58 ,  H01R4/58 ,  H01R13/03 ,  H01R13/17 ,  H01R12/70

CPC classification number: C25D3/60 ,  C25D5/08 ,  C25D7/00 ,  H01R12/585 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10909

公开(公告)号：EP2596157A1

公开(公告)日：2013-05-29

申请号：EP12717606.3

申请日：2012-04-21

Applicant: Enayati GmbH&Co. Kg Oberflächen- Und Anlagentechnik

Inventor： DREIßIGACKER, Uwe

IPC: C25D3/60 ,  C25D5/08 ,  C25D7/00 ,  H05K3/30 ,  H01R12/58 ,  H01R4/58 ,  H01R13/03 ,  H01R13/17 ,  H01R12/70

CPC classification number: C25D3/60 ,  C25D5/08 ,  C25D7/00 ,  H01R12/585 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10909

Abstract: The invention relates to a press-in pin (10) having a main body and a coating which covers the main body at least in some sections. In order to provide a press-in pin with a lead-free coating which avoids or substantially minimises whisker growth, 30 to 72 % by mass of the coating consists of silver and/or copper and/or bismuth (alloy metals), the rest being tin and impurities.

公开(公告)号：EP2166623A1

公开(公告)日：2010-03-24

申请号：EP09011795.3

申请日：2009-09-16

Applicant: Kitagawa Industries Co., Ltd.

Inventor： Yumi, Hideo

IPC: H01R13/03 ,  H01R13/24

CPC classification number: H01R13/03 ,  H01R13/2442 ,  H05K1/0233 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/086 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: A surface mount contact interposes between a mounted conductor and a pressing conductive member to make the mounted conductor conductive to the pressing conductive member when the mounted conductor and the pressing conductive member are proximate to each other. The surface mount contact includes: a base portion solderable to the mounted conductor; a movable portion elastically deformable according to a distance between the mounted conductor and the pressing conductive member, at least a part of the movable portion being closer to the base portion when the movable portion elastically deforms; and an insulating coating film provided in a region where the movable portion is closer to the base portion and inhibiting electric contact between the movable portion and the base portion.

Abstract translation: 当安装的导体和按压导电构件彼此靠近时，表面安装接触件插入安装的导体和按压导电构件之间，以使得安装的导体导电到按压导电构件。 表面安装触点包括：可焊接到安装的导体的基部; 可移动部分，根据所安装的导体和按压导电构件之间的距离可弹性变形，当可动部分弹性变形时，可移动部分的至少一部分更接近基部; 以及设置在所述可动部靠近所述基部的区域中并且抑制所述可动部和所述基部之间的电接触的绝缘性涂膜。

公开(公告)号：EP1681131B1

公开(公告)日：2010-02-17

申请号：EP06005992.0

申请日：1998-12-09

Applicant: Renesas Technology Corp.

Inventor： Shimokawa, Hanae c/o Hitachi, Ltd., I.P. Group ,  Soga, Tasao c/o Hitachi, Ltd., I.P. Group ,  Okudaira, Hiroaki c/o Hitachi, Ltd., I.P. Group ,  Ishida, Toshiharu c/o Hitachi, Ltd., I.P. Group ,  Nakatsuka, Tetsuya c/o Hitachi, Ltd., I.P. Group ,  Inaba, Yoshiharu c/o Hitachi, Ltd., I.P. Group ,  Nishimura, Asao c/o Hitachi, Ltd., I.P. Group

IPC: B23K35/26 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00