公开(公告)号：EP2485332A4

公开(公告)日：2013-05-29

申请号：EP10820534

申请日：2010-09-28

Applicant: YAZAKI CORP

Inventor： FUJIKAWA RYO

IPC: H01R12/71 ,  H01R12/57 ,  H01R12/72

CPC classification number: H01R12/722 ,  H01R12/57 ,  H01R12/721 ,  H05K1/11 ,  H05K2201/0397

公开(公告)号：EP2548421A1

公开(公告)日：2013-01-23

申请号：EP11709694.1

申请日：2011-03-16

Applicant: Robert Bosch GmbH

Inventor： HEIM, Michael ,  BRAUN, Sigmund

IPC: H05K3/32

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

Abstract: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).

公开(公告)号：EP2543551A1

公开(公告)日：2013-01-09

申请号：EP12187341.8

申请日：2007-02-03

Applicant: Tyco Electronics AMP GmbH

Inventor： Chritz, Gunther

IPC: B60R16/023 ,  H05K7/02 ,  H05K1/00

CPC classification number: H05K1/0263 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2201/10553

Abstract: The invention relates to an electrical punched grid (100) for supplying current to a printed circuit board (200) of an electrical power distribution unit (1), having a current infeed (110) which comprises a plurality of tongues (111, 112; 113), wherein at least one tongue (111, 112; 113) is bent out of a plane of the punched grid (100) in such a way that two tongues (111, 112; 113) lie against each other and form a portion (115) which is electrically contactable by an electrical plug connector, in particular a tab.

Abstract translation: 本发明涉及一种用于向电力分配单元（1）的印刷电路板（200）提供电流的电击格栅（100），其具有包括多个舌片（111,112; 112）的电流进料（110） 113），其中至少一个舌部（111,112; 113）以两个舌片（111,112; 113）彼此相对的方式从所述穿孔网格（100）的平面弯曲出来，并形成一部分 （115），其可由电插头连接器，特别是凸片电接触。

公开(公告)号：EP1952680A4

公开(公告)日：2013-01-09

申请号：EP06836893

申请日：2006-11-03

Applicant: NEOCONIX INC

Inventor： WILLIAMS JOHN D

IPC: H05K1/00 ,  H01R12/52 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/118 ,  H01R12/526 ,  H01R13/2407 ,  H05K3/202 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10378 ,  H05K2203/1572 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

公开(公告)号：EP1849186A4

公开(公告)日：2011-03-23

申请号：EP06735419

申请日：2006-02-14

Applicant: APROLASE DEV CO LLC

Inventor： MICHAELS DANIEL ,  BOYD WILLIAM E

IPC: H05K7/06 ,  H01L25/10

CPC classification number: H05K1/147 ,  H01L25/105 ,  H01L2225/0652 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/0397 ,  H05K2201/09181 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

公开(公告)号：EP2232219A1

公开(公告)日：2010-09-29

申请号：EP08869495.5

申请日：2008-12-19

Applicant: KNORR-BREMSE Systeme für Nutzfahrzeuge GmbH

Inventor： RÖTHER, Friedbert ,  UHLAND, Thomas ,  ERB, Christine

IPC: G01L19/00

CPC classification number: G01L19/0069 ,  G01L19/00 ,  G01L19/147 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10151 ,  H05K2201/10446 ,  Y10T29/4921

Abstract: The invention relates to a conductor track carrier (10), particularly a pressed screen that is preferably insert-molded with plastic or a rigid/flexible circuit carrier, comprising one or more conductor tracks (12), which are received and held at least partially by a conductor track carrier component (14) designed in one piece. According to the invention, the conductor track carrier component is designed in such a way that it receives and holds furthermore at least one component of one or more sensors (16). Furthermore, the invention relates to a method for the production of such a conductor track carrier (10).

公开(公告)号：EP1463391B1

公开(公告)日：2010-06-16

申请号：EP04290721.2

申请日：2004-03-16

Applicant: VALEO VISION

Inventor： Gasquet, Jean-Claude ,  Tanghe, Alcina

IPC: H05K3/34 ,  H05K1/02 ,  F21V19/00 ,  F21S8/10 ,  H01L33/00 ,  B60Q1/26

CPC classification number: F21V29/713 ,  F21S43/14 ,  F21S43/19 ,  F21S45/47 ,  H01L33/64 ,  H05K1/0203 ,  H05K3/301 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10553 ,  H05K2201/10969 ,  H05K2203/107 ,  Y02P70/613 ,  Y10S362/80

公开(公告)号：EP1524893B1

公开(公告)日：2010-04-21

申请号：EP04023145.8

申请日：2004-09-29

Applicant: C.R.F. Società Consortile per Azioni

Inventor： Faggioli, Eugenio ,  Groppo, Riccardo

IPC: H05K7/20 ,  H05K3/36 ,  H01L25/16

CPC classification number: H05K7/20472 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/0397 ,  H05K2201/10393 ,  H01L2924/00014

公开(公告)号：EP1439397A3

公开(公告)日：2009-09-02

申请号：EP04005888.5

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R31/28

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: A method of burning-in semiconductor devices, comprising permanently mounting a plurality of resilient contact structures on a plurality of unsingulated semiconductor devices on a semiconductor wafer; powering up at least a portion of the unsingulated semiconductor devices by making pressure connections to the resilient contact structures on the portion of the unsingulated semiconductor devices; and heating the semiconductor devices to a temperature of at least 150° C for less than 60 minutes.

公开(公告)号：EP1665914B1

公开(公告)日：2007-10-31

申请号：EP04765410.8

申请日：2004-09-20

Applicant: Endress + Hauser GmbH + Co. KG

Inventor： BIRGEL, Dietmar ,  BURGER, Paul ,  HAUPTVOGEL, Karl-Peter

IPC: H05K3/30 ,  H05K1/11 ,  H05K1/18 ,  H05K13/04

CPC classification number: H05K13/0465 ,  H05K1/036 ,  H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10575 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: The aim of the invention is to securely fasten wired components having a great mass or an unequal mass distribution to a printed circuit board (60) without gluing the components to the printed board or retaining the same on the printed board by means of snap-in fixtures, as is commonly done. Said aim is achieved by integrating a holding device (65) for retaining a connecting wire or pin (111) of an electronic component (110) in a connecting bore (11) used for accommodating said connecting wire or pin (111). The holding device (65) represents a constriction in the connecting bore (11) to a diameter that is smaller than the diameter of the connecting wire or pin (111). The holding device (65) can be formed by a connecting bore (11) that is configured as a one-sided bore (16) which does not entirely penetrate the printed board (60), for example. In this case, one edge remains in place as a constriction (65) which clamps the connecting pin (111) of the respective component (110) and retains said component on the printed board.