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    ELECTRICAL TRANSMISSION ARRANGEMENT
    11.
    发明授权
    ELECTRICAL TRANSMISSION ARRANGEMENT 有权
    电气传动配置

    公开(公告)号：EP1198860B1

    公开(公告)日：2008-06-11

    申请号：EP00946591.5

    申请日：2000-06-16

    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ)

    Inventor： HARJU, Thomas ,  ALBINSSON, Björn

    IPC: H01P3/08 ,  H05K1/00

    CPC classification number: H01P3/081 ,  H01P1/047 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/09845

    Abstract: The invention relates to an electrical transmission arrangement (700, 800) comprising a first (710; 810) section of a conductor with a main extension in a first (x) and a second (y) plane, and a first (740; 840) section of a ground plane which extends essentially in parallel with the first conductor section on a first side thereof, at a certain first distance (d3) therefrom and has a main extension in the same two planes (x, y) as the first conductor section, which first conductor section and first ground plane section together are included in a microstrip arrangement, and a second (720; 820) section of the same conductor, a second (750; 850) and a third (770; 870) ground plane section, where the second and third ground plane sections extend essentially in parallel with the second conductor section on a first and, respectively, second side thereof at a second (d3) and, respectively, third distance (d3) therefrom, where the second conductor section and the second and third ground plane sections are included in a strip-line arrangement, in which transmission arrangement (700, 800) the conductor sections are separated from adjacent ground plane sections by a dielectric medium. The first (710, 810) and the second (720, 820) conductor sections are displaced in parallel with respect to one another along a third plane (z) and exhibit an electrical connection (705, 805) to one another, and the ground plane sections (740, 750, 770) are displaced in parallel with respect to one another along the same plane (z) as the displacements of the conductor sections.

    Printed wiring board and manufacturing method thereof
    13.
    发明公开
    Printed wiring board and manufacturing method thereof 失效
    Mehrschichtige gedruckte Schaltungsplatte

    公开(公告)号：EP1677582A2

    公开(公告)日：2006-07-05

    申请号：EP05027867.0

    申请日：1996-12-19

    Applicant: IBIDEN CO., LTD.

    Inventor： Mori, Yoji Ibiden Co., Ltd. ,  Kawamura, Yoichiro Ibiden Co., Ltd.

    IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11

    CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T428/24917

    Abstract: A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.

    Abstract translation: 印刷电路板，其中存在于作为光电二极管的焊盘周围的开口布置成使其不与焊盘重叠，存在于焊盘周围的开口的面积和另一个开口的面积相等，树脂的量 填充在每个开口中或在整个印刷线路板上均匀化，并且设置从每个开口溢出的树脂量或当树脂在每个开口中填充或均匀时。 根据这样的印刷电路板，当通过布置开口来连接设置在形成在印刷线路板上的层间绝缘板上的电路图案和导体焊盘时，可以实现其中安全连接不会导致断开的可靠的印刷线路板 存在于导体焊盘周围，使得其不与导体焊盘重叠，并且基本上均匀地填充在导体焊盘周围的开口中的树脂的量和填充在另一个开口中的树脂的量。

    SELECTIVE REFERENCE PLANE BRIDGE(S) ON FOLDED PACKAGE
    14.
    发明公开
    SELECTIVE REFERENCE PLANE BRIDGE(S) ON FOLDED PACKAGE 有权
    折叠衬底，基地有什么特殊形成，及其制造方法

    公开(公告)号：EP1629534A2

    公开(公告)日：2006-03-01

    申请号：EP04752929.2

    申请日：2004-05-21

    Applicant: INTEL CORPORATION

    Inventor： REID, Geoffery ,  JAECK, Edward

    IPC: H01L23/538

    CPC classification number: H05K1/028 ,  H01L23/5387 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K2201/093 ,  H05K2201/09727 ,  H01L2224/0401

    Abstract: An apparatus including a substrate having dimensions suitable as a support circuit for at least one integrated circuit, the substrate comprising a laterally extending plication region defining first and second longitudinal portions; a plurality of conductive traces distributed in a first distribution plane of the substrate and extending transversely through the plication region; a first and second layers of conductive material in a second distribution plane of the first portion and second portion, respectively, of the substrate; at least one conductive bridge extending transversely through less than the entire plication region in the second distribution plane and coupled to the first continuous layer and to the second continuous layer; and at least one externally accessible contact point coupled to at least one of the first and second layers. A method of forming a support circuit and a system including a package.

    ELECTRICAL TRANSMISSION ARRANGEMENT
    19.
    发明公开
    ELECTRICAL TRANSMISSION ARRANGEMENT 审中-公开
    电气传动配置

    公开(公告)号：EP1194978A1

    公开(公告)日：2002-04-10

    申请号：EP00944531.3

    申请日：2000-06-16

    Applicant: Telefonaktiebolaget L M Ericsson (Publ)

    Inventor： HARJU, Thomas ,  ALBINSSON, Björn

    IPC: H01P3/08 ,  H05K1/00

    CPC classification number: H01P1/047 ,  H01P3/081 ,  H01P3/088 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/09845

    Abstract: The invention relates to an electrical transmission arrangement (700) comprising a first strip-line conductor which has its main extension in a first direction (A) in a first plane in the transmission arrangement and comprises a conductor (720), an upper (710) ground plane which is situated at an upper distance from the conductor and a lower (730) ground plane which is situated at a lower distance from the conductor, and a second strip-line conductor which has its main extension in a second direction (B) in a second plane in the transmission arrangement and comprises a conductor (750), an upper (760) ground plane which is situated at an upper distance from the conductor and a lower (740) ground plane which is situated at a lower distance from the conductor, where the ground planes are separated from their respective conductors and from one another by a dielectric material, in which transmission arrangement (700, 900) the lower ground plane (730) of the first strip-line conductors coincides with the upper ground plane (760) of the second strip-line conductors at at least one point. At the point, where the lower ground plane (730) of the first strip-line conductor coincides with the upper ground plane (760) of the second strip-line conductor, the main direction of extension (A) of the first strip-line conductor crosses the main direction of extension (B) of the second strip-line conductor, and the second strip-line conductor extends in a third plane in the transmission arrangement at this crossing point, whereby the second strip-line conductors exhibit electrical connections (740', 750', 760') between adjacent planes, which connections (740', 750', 760') connect the conductors (750, 751) of the second strip-line conductor, upper ground planes (760, 761) and lower ground planes (740, 741) to corresponding components in adjacent planes.

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