公开(公告)号：EP1771050B1

公开(公告)日：2011-06-15

申请号：EP06024023.1

申请日：2000-09-01

Applicant: IBIDEN CO., LTD.

Inventor： Inagaki, Yasushi ,  Asai, Motoo ,  Wang, Dongdong ,  Yabashi, Hideo ,  Shirai, Seiji

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

公开(公告)号：EP2178116A4

公开(公告)日：2011-05-04

申请号：EP08827123

申请日：2008-08-05

Applicant: IBIDEN CO LTD

Inventor： TANAKA HIRONORI ,  KAWANO SHUICHI

IPC: H01L23/12 ,  H01L23/14 ,  H01L23/15 ,  H01L23/32 ,  H05K3/46

CPC classification number: H01L23/49894 ,  H01L23/147 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/0029 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/063 ,  Y10T29/49165 ,  H01L2224/05599

公开(公告)号：EP2280594A1

公开(公告)日：2011-02-02

申请号：EP08874395.0

申请日：2008-12-22

Applicant: Ibiden Co., Ltd.

Inventor： TAKAHASHI, Michimasa

IPC: H05K3/46

CPC classification number: H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board has a first substrate (10) with multiple wiring layers, and a second substrate (20) with wiring layers whose conductor density is set higher than that of the first substrate (10). The first substrate (10) and the second substrate (20) are electrically connected through each wiring layer, and the second substrate (20) is embedded in an accommodation section (100a).

Abstract translation: 印刷线路板具有具有多个布线层的第一基板（10）和具有导体密度被设定为高于第一基板（10）的布线层的第二基板（20）。 第一基板（10）和第二基板（20）通过各布线层电连接，并且第二基板（20）嵌入容纳部（100a）中。

公开(公告)号：EP2265101A1

公开(公告)日：2010-12-22

申请号：EP10172106.6

申请日：2000-09-01

Applicant: IBIDEN CO., LTD.

Inventor： Inagaki, Yasushi ,  Asai, Motoo ,  Wang, Dongdong ,  Yabashi, Hideo ,  Shirai, Seiji

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

Abstract translation: 片状电容器20设置在印刷电路板10的芯基板30中。这使得可以缩短IC芯片90和芯片电容器20之间的距离并减小环路电感。 由于通过以多层方式设置第一树脂基板30a，第二树脂基板30b和第三树脂基板30c来构成芯基板30，所以能够获得足够的强度。

公开(公告)号：EP2259667A1

公开(公告)日：2010-12-08

申请号：EP08873646.7

申请日：2008-10-09

Applicant: Ibiden Co., Ltd.

Inventor： TAKAHASHI, Michimasa ,  AOYAMA, Masakazu

IPC: H05K3/46

CPC classification number: H05K3/4691 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49124

Abstract: In a flex-rigid wiring board (10) having rigid substrates (11, 12) and a flexible substrate (13) that connects the rigid substrates (11, 12) with each other, a folded section made up of bending portions (130a to 130h) is formed in the flexible substrate (13). Then, the flexible substrate (13), including its folded section, is accommodated in a space between the rigid substrates.

Abstract translation: 在具有刚性基板（11,12）的柔性刚性布线板（10）和连接刚性基板（11,12）的柔性基板（13）之间，由弯曲部分（130a〜 130h）形成在柔性基板（13）中。 然后，包括其折叠部分的柔性基板（13）容纳在刚性基板之间的空间中。

公开(公告)号：EP1777744A3

公开(公告)日：2010-05-12

申请号：EP06019852.0

申请日：2006-09-22

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Swaminathan, Madhavan ,  Wan, Lixi ,  Engin, Ege ,  Muthana, Prathap

IPC: H01L23/498 ,  H05K1/16 ,  H01L23/50 ,  H01L23/64

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09763 ,  Y10S257/904 ,  Y10S257/924 ,  H01L2924/00

Abstract: One embodiment of the present invention provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz comprising installing in said package an array of embedded discrete ceramic capacitors (1600), and optionally planar capacitor layers (1500). A further embodiment provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz comprising using an array of embedded discrete ceramic capacitors with different resonance frequencies, arranged in such a way that the capacitor array's impedance vs frequency curve in the critical mid-frequency range yields impedance values at or below a targeted impedance value.

公开(公告)号：EP2170028A1

公开(公告)日：2010-03-31

申请号：EP07790573.5

申请日：2007-07-10

Applicant: Ibiden Co., Ltd.

Inventor： TAKAHASHI, Michimasa

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096

Abstract: The present invention is to provide a wiring board where the risk of rupture in the connection between conductive patterns is minimized if electrical continuity inside the through-hole generates high temperatures. A wiring board 10 that has an insulation layer 161a formed with a base material of resin-impregnated inorganic fabric, a base substrate 121 supporting the insulation layer 161a, a via 114a electrically connecting a conductive pattern 117a formed on the insulation layer 161a and a conductive pattern 113a formed on the base substrate 121, and a through-hole 111 penetrating the base substrate. The hole-diameter of the through-hole 111 is in the range of 10 µm-150 µm.

Abstract translation: 本发明提供一种布线基板，其中，如果通孔内部的电连续性产生高温，则导电图案之间的连接断裂的风险最小化。 具有由树脂浸渍无机织物的基材形成的绝缘层161a，支撑绝缘层161a的基底基板121，电连接形成在绝缘层161a上的导电图案117a的导通板114a和导电 形成在基底基板121上的图案113a，以及穿透基底基板的通孔111。 通孔111的孔径在10μm〜150μm的范围内。

公开(公告)号：EP2086299A1

公开(公告)日：2009-08-05

申请号：EP09156837.8

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Wang, Dongdong ,  Mori, Takahiro

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A multi-layer printed circuit board comprising: a core substrate having through holes for connecting the upper and lower surfaces to each other and having a structure that interlayer resin insulating layers and conductor circuits are alternately laminated on said core substrate, wherein
through holes having different diameters are formed in said core substrate.

Abstract translation: 一种多层印刷电路板，包括：具有通孔的上表面和下表面连接到海誓山盟和具有结构做了层间树脂绝缘层和导体电路交替层叠在所述核心基板，worin通过具有不同的孔的核心基板 直径在形成在所述核心基板。

公开(公告)号：EP2081419A2

公开(公告)日：2009-07-22

申请号：EP09156903.8

申请日：2000-09-01

Applicant: Ibiden Co., Ltd.

Inventor： Inagaki, Yasushi c/o Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Asai, Motoo c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Wang, Dongdong c/o Ogaki-kita-kojou, Ibiden Co., Ltd., ,  Yabashi, Hideo c/o Ogaki-kita-kojou Ibiden Co., Ltd., ,  Shirai, Seiji c/o Ogaki-kita-kojou, Ibiden Co., Ltd.,

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

Abstract translation: 芯片电容器（20）设置在印刷电路板（10）的芯基板（30）中。 这使得可以缩短IC芯片（90）和芯片电容器（20）之间的距离并减小环路电感。 由于通过以多层方式设置第一树脂基板（30a），第二树脂基板（30b）和第三树脂基板（30c）构成芯基板（30），所以芯基板（30）能够获得足够的强度。

公开(公告)号：EP2077703A1

公开(公告)日：2009-07-08

申请号：EP09156862.6

申请日：2000-09-01

Applicant: IBIDEN CO., LTD.

Inventor： Inagaki, Yasushi ,  Asai, Motoo ,  Wang, Dongdong ,  Yabashi, Hideo ,  Shirai, Seiji

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.