公开(公告)号：EP0441809A1

公开(公告)日：1991-08-21

申请号：EP89911727.0

申请日：1989-09-25

Applicant: MOTOROLA, INC.

Inventor： MULLEN, William, Boone, III ,  HENDRICKS, Douglas, Wayne

IPC: B23K1 ,  G02B6 ,  H01L41 ,  H01R43 ,  H05K3

CPC classification number: G02B6/4442 ,  B23K1/20 ,  B23K2201/36 ,  B23K2201/40 ,  G02B6/4471 ,  H01L41/29 ,  H01R43/0221 ,  H05K3/3457 ,  H05K3/3494 ,  H05K3/363 ,  H05K2201/09709 ,  H05K2201/10666 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/107

Abstract: L'invention concerne un procédé permettant d'effectuer des interconnexions de soudure de haute densité entre un substrat (20) et au moins un film métallisé (10) présentant des trous traversants (14). De la soudure (24) est d'abord appliquée sur les parties métallisées (22) du substrat (20) puis la soudure est soumise à un procédé de fusion pour obtenir une soudure par fusion. Une pression est appliquée à la soudure (24) par fusion pendant un second processus de fusion pour obtenir une soudure précontrainte ou façonnée. Le film métallisé (10) est ensuite positionné avec au moins une partie métallisée (12) adjacente à la soudure façonnée (24). De la chaleur provenant d'un laser (26), par exemple, est envoyée au travers des trous traversants (14) dans le film (10) pour fondre la soudure (24) et former des interconnexions de soudure entre le substrat (20) et le film métallisé (10).

公开(公告)号：EP0074816B1

公开(公告)日：1988-01-27

申请号：EP82304775.8

申请日：1982-09-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Prokop, Jon S.

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H05K3/3442 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2924/00

公开(公告)号：EP0059337B1

公开(公告)日：1986-08-13

申请号：EP82100843.0

申请日：1982-02-05

Applicant: International Business Machines Corporation

Inventor： Ecker, Mario Enrique ,  Olson, Leonard Theodore

IPC: H01L23/50 ,  H01L21/60 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L21/486 ,  H01L23/4985 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10727 ,  H05K2201/10878 ,  H05K2201/2036 ,  H05K2203/043 ,  Y02P70/613

公开(公告)号：EP0074816A3

公开(公告)日：1985-01-30

申请号：EP82304775

申请日：1982-09-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Prokop, Jon S.

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H05K3/3442 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An integrated circuit (IC) device package 10 is disclosed suitable for accommodating large terminal count IC devices in a very small space. A first set of terminals 26 is located in notches around the periphery of the package. A second set of terminals 38 is located inboard of the package and are comprised of metallized annular rings on the top and bottom surfaces of the package around holes or apertures through the surfaces of the package with metallization coating the holes to connect the top and bottom annular rings. This second set of terminals may be arranged in rows parallel to the edges of the package 10 and may be connected to the IC device 18 through buried conductor traces 48 and bonding of wires 24. If necessary, additional rows of metallized holes can be utilized in a grid configuration, preferably at 0.050" centers.

公开(公告)号：EP0059337A3

公开(公告)日：1983-08-17

申请号：EP82100843

申请日：1982-02-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ECKER, MARIO ENRIQUE ,  OLSON, LEONARD THEODORE

IPC: H01L23/32 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L23/50 ,  H01L21/60

CPC classification number: H05K3/303 ,  H01L21/486 ,  H01L23/4985 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10727 ,  H05K2201/10878 ,  H05K2201/2036 ,  H05K2203/043 ,  Y02P70/613

公开(公告)号：EP2034807B1

公开(公告)日：2017-01-04

申请号：EP08105191.4

申请日：2008-09-01

Applicant: Continental Automotive GmbH

Inventor： Wolf, Peter

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/09627 ,  H05K2201/10666 ,  H05K2203/0455

公开(公告)号：EP1776001B1

公开(公告)日：2011-03-09

申请号：EP07100813.0

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： Ishida, Naoto c/o Ibiden Co., Ltd. ,  Asano, Kouji c/o Ibiden Co., Ltd.

IPC: H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP1724832A3

公开(公告)日：2010-09-01

申请号：EP06010226.6

申请日：2006-05-18

Applicant: Panasonic Corporation

Inventor： Kimura,Junichi c/o Matsushita Elec. Ind. Co.,Ltd ,  Honjo,Kazuhiko c/o Matsushita Elec. Ind. Co.,Ltd ,  Kawamoto, Eiji c/o Matsushita Elec. Ind. Co., Ltd. ,  Harada, Shinji c/o Matsushita Elec. Ind. Co., Ltd. ,  Kitagawa, Motoyoshi Matsushita Elec. Ind. Co.,Ltd.

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/10 ,  H01L25/065

CPC classification number: H05K1/144 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0237 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/10666 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A multilayer module which includes parts-containing module (32) whose circuit board (1) has been mounted at one surface with electronic component (2a) and the electronic component is covered with resin layer (39). Connection terminals (34a), (34b) have been provided either at resin layer (39) or at the other surface of circuit board (1), also through hole (46) has been provided for connection between the two surfaces of module (32). Also included is module (33), which has been provided with connection terminal (35a), (35b) at a place corresponding to connection terminal (34a), (34b), and through hole (47) for connection between the connection terminal (35a), (35b) and electronic component (2b). Disposed between conductor layer (34) and conductor layer (35) is insulation layer (36), which insulation layer having conductive bond (37) for connection between connection terminals (34a), (34b) and connection terminals (35a), (35b), respectively. In the above-described configuration, places of through hole (47) and electronic component (2b) in module (33) are not restricted by a location of through hole (46).

公开(公告)号：EP1738627A4

公开(公告)日：2010-05-05

申请号：EP05723085

申请日：2005-02-15

Applicant: MOTOROLA INC

Inventor： GALL THOMAS P ,  PFEIFER MICHAEL ,  POLAK ANTHONY ,  POMEROY MICHAEL J

IPC: H05K1/02 ,  H05K3/42 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K5/0047 ,  H05K1/0215 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/42 ,  H05K5/0213 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/0999 ,  H05K2201/10666 ,  H05K2203/0191 ,  H05K2203/1178 ,  H05K2203/1394

公开(公告)号：EP2084741A1

公开(公告)日：2009-08-05

申请号：EP07843658.1

申请日：2007-10-02

Applicant: Raytheon Company

Inventor： CHAHAL, Premjeet ,  ABLES, Billy, D. ,  RAJENDRAN, Sankerlingam ,  MORRIS, Francis, J.

IPC: H01L21/768

CPC classification number: H05K3/3457 ,  H01L21/486 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2201/2081 ,  H05K2203/0278 ,  H05K2203/043 ,  H01L2924/00

Abstract: According to one embodiment of the invention, a method for sealing one or more vias comprises providing a first substrate having vias, forming an adhesion layer on an inner surface of the vias, sandwiching a solder layer between the first substrate and a second substrate, and elevating of the first substrate, second substrate, and solder layer to a temperature above a eutectic point and below a melting point of the solder layer. The act of elevating the solder layer to a temperature above the eutectic point and below the melting point causes the solder layer to flow into the vias in a generally consistent manner.