公开(公告)号：EP0028657A4

公开(公告)日：1982-11-08

申请号：EP80900951

申请日：1980-12-01

Applicant: FUJITSU LTD

Inventor： KUROSAWA KEIJI ,  YAMAMOTO KENJI ,  YAMASHITA MITSUO ,  MITSUI HISAMI ,  MIYABARA AYAKO ,  MIYAGAWA KIYOTAKA ,  IMURA TAKAYOSHI

IPC: B32B15/08 ,  H05K1/05 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K1/0272 ,  H05K1/053 ,  H05K3/426 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0315 ,  Y10T29/49126

Abstract: The hollow multilayer printed wiring board is composed of plural print boards (1), (2), (3), (4) laminated with a predetermined spacing therebetween, each of which has a signal-conducting pattern (6) formed on at least one surface thereof and a land-conducting pattern (7) formed on at least one surface thereof. The board has through-holes (10) which are plated to connect with the land-conducting pattern and each of the through-holes and a plated through-hole in at least one board of the boards adjacent thereto are positioned on a straight line so as to provide a plated through-hole or an interstitial wire hole (12), (13). Formed on at least the upper- and lower- end surfaces of each through-hole (10) are low melting-point metal layers which function as conductors among the signal conducting patterns in 2 or more of the plural boards and as layer-bonding materials for the plural boards. The laminated boards, except at least one of the outer sides, is made of a heat-proof organic plastics-sheet or an insulated metal.

公开(公告)号：EP0028657A1

公开(公告)日：1981-05-20

申请号：EP80900951.7

申请日：1980-05-23

Applicant: FUJITSU LIMITED

Inventor： KUROSAWA, Keiji ,  YAMAMOTO, Kenji ,  YAMASHITA, Mitsuo ,  MITSUI, Hisami ,  MIYABARA, Ayako ,  MIYAGAWA, Kiyotaka ,  IMURA, Takayoshi

IPC: H05K3/46

CPC classification number: H05K3/462 ,  H05K1/0272 ,  H05K1/053 ,  H05K3/426 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0315 ,  Y10T29/49126

Abstract: The hollow multilayer printed wiring board is composed of plural print boards (1), (2), (3), (4) laminated with a predetermined spacing therebetween, each of which has a signal-conducting pattern (6) formed on at least one surface thereof and a land-conducting pattern (7) formed on at least one surface thereof. The board has through-holes (10) which are plated to connect with the land-conducting pattern and each ofthe through-holes and a plated through-hole in at least one board of the boards adjacent thereto are positioned on a straight line so as to provide a plated through-hole or an interstitial wire hole (12), (13). Formed on at least the upper-and lower- end surfaces of each through-hole (10) are low melting-point metal layers which function as conductors among the signalconducting patterns in 2 or more of the plural boards and as layer-bonding materials for the plural boards. The laminated boards, except at least one of the boards on the outer sides, is made of a heat-proof organic plastics-sheet or an insulated metal.

公开(公告)号：EP3407960A1

公开(公告)日：2018-12-05

申请号：EP17704581.2

申请日：2017-01-16

Applicant: Microsoft Technology Licensing, LLC

Inventor： HOLBERY, James David ,  FASSLER, Andrew L.

IPC: A61N1/00

CPC classification number: H01H36/00 ,  A61N1/00 ,  G06F3/045 ,  H01H1/029 ,  H01H11/04 ,  H01H11/048 ,  H01H35/245 ,  H01H2300/036 ,  H05K2201/0379 ,  H05K2201/10053 ,  H05K2203/104

Abstract: Examples are disclosed that relate to magnetically aligned switching circuits. One disclosed example provides an electronic component comprising a first terminal, a second terminal, and a deformable host material arranged between the first terminal and the second terminal. Aligned magnetically within the host material is an ensemble of particles each comprising a ferromagnetic material, each particle having greater electrical conductivity than the host material. The ensemble of particles is configured to form at least one complete conduction path from the first terminal to the second terminal.

公开(公告)号：EP2916363A1

公开(公告)日：2015-09-09

申请号：EP15157129.6

申请日：2015-03-02

Applicant: Kabushiki Kaisha Toshiba

Inventor： Naito, Katsuyuki ,  Yoshinaga, Norihiro ,  Yang, Tianyi ,  Akasaka, Yoshihiro

IPC: H01L33/52 ,  H01L33/62

CPC classification number: H05K1/0274 ,  H01L33/42 ,  H01L33/486 ,  H01L33/62 ,  H05K1/144 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2201/0379

Abstract: According to one embodiment, a transparent conductor (10) includes a transparent substrate (11); a metal nanowire layer (12) disposed on the transparent substrate (11) and including a plurality of metal nanowires (12a); a graphene oxide layer (13) covering the metal nanowire layer (12); and an electrical insulating resin layer (14) disposed in contact with the graphene oxide layer (13).

Abstract translation: 根据一个实施例，透明导体（10）包括透明基板（11）; 设置在所述透明基板（11）上并且包括多个金属纳米线（12a）的金属纳米线层（12）; 覆盖金属纳米线层（12）的石墨烯氧化物层（13）; 和与石墨烯氧化物层（13）接触设置的电绝缘树脂层（14）。

公开(公告)号：EP2426626A1

公开(公告)日：2012-03-07

申请号：EP10769518.1

申请日：2010-04-28

Applicant: Toppan Printing Co., Ltd.

Inventor： GOTOU, Hiroyoshi

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A method for manufacturing an antenna sheet, includes: a pressing step in which an overlapped portion of an antenna coil and/or a connection pattern formed from a metal material and provided on one surface of a substrate formed from a thermoplastic resin, and a conductive member formed from a metal material and provided on the other surface of the substrate is pressed using a pressing unit at least from the surface of one side of the substrate; and a welding steps in which the overlapped portion of the antenna coil and/or the connection pattern and the conductive member is welded.

Abstract translation: 一种用于制造天线片的方法，包括：在其中一个压制步骤，以重叠的天线线圈和/或由金属材料形成，并且设置在由热塑性树脂形成的基片的一个表面上的连接图案和导电的部分 由金属材料形成的部件，并提供了一种使用至少一个按压单元从所述基片的一侧的表面被压在基板的另一表面上; 和焊接步骤，其中所述天线线圈和/或所述连接图案和所述导电部件的重叠部分被焊接。

公开(公告)号：EP2308274A1

公开(公告)日：2011-04-13

申请号：EP09780632.7

申请日：2009-07-15

Applicant: Robert Bosch GmbH

Inventor： KUGLER, Andreas ,  VOIGTLAENDER, Klaus ,  KIMMICH, Peter

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/185 ,  H01L23/427 ,  H01L23/473 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/96 ,  H01L25/071 ,  H01L25/072 ,  H01L25/074 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/0272 ,  H05K1/162 ,  H05K1/189 ,  H05K3/4614 ,  H05K3/4644 ,  H05K2201/0379 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/1469

Abstract: The invention relates to a printed circuit board (1) with a sheet-like board substrate (2) and with at least one electronic component (3), wherein it is provided that the component (3) is arranged within the board substrate (2).  The invention also relates to a corresponding method for producing the printed circuit board.

公开(公告)号：EP2163145B1

公开(公告)日：2010-09-01

申请号：EP08760692.7

申请日：2008-06-06

Applicant: Robert Bosch GmbH

Inventor： KIMMICH, Peter ,  NGUYEN, Quoc-Dat

IPC: H05K1/14 ,  H05K3/36 ,  H01L25/065 ,  H01L23/31

CPC classification number: H05K1/144 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49551 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49213 ,  H01L2924/00

Abstract: The invention relates to an electronic module (26) comprising a first substrate (13), provided with at least one electronic component (4), and a housing (25) that is embedded in the substrate (13) and that is embodied as an injection-moulded housing or injection-transfer housing. Said electronic module also comprises electric connections (6) that protrude from the housing (25), that are connected to the first substrate (13) and that are embodied as a pressed grid (3). According to the invention, at least one additional second substrate (13) is embedded in the housing (25) and comprises second electric connections (15). The second connections (15) are embodied as a second pressed grid (14) and both of the pressed grids (3,14) are connected together directly on at least one point (19). The invention also relates to a method for producing a corresponding electronic module.

公开(公告)号：EP1454973B1

公开(公告)日：2006-03-22

申请号：EP04013449.6

申请日：1998-08-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Watanabe, Itsuo ,  Takemura, Kenzo ,  Nagai, Akira ,  ISAKA, Kazuhiro c/o Goshomiya Works ,  WATANABE, Osamu c/o Goshomiya Works ,  Kojima, Kazuyoshi, c/o Goshomiya Works

IPC: C09J9/00 ,  C09J7/00

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/00 ,  C09J11/04 ,  C09J2201/36 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2201/068 ,  H01L2924/00

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

公开(公告)号：EP1120449B1

公开(公告)日：2005-06-15

申请号：EP98937808.8

申请日：1998-08-13

Applicant: Hitachi Chemical Company, Ltd.

Inventor： WATANABE, Itsuo ,  TAKEMURA, Kenzo ,  NAGAI, Akira, B306 Hitachi Kasei ,  ISAKA, Kazuhiro ,  WATANABE, Osamu ,  KOJIMA, Kazuyoshi

IPC: C09J9/00 ,  C09J7/00

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler; a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.

公开(公告)号：EP1041616A4

公开(公告)日：2005-05-11

申请号：EP98953052

申请日：1998-11-13

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： TAKEZAWA HIROAKI ,  TSUKAMOTO MASAHIDE ,  ITAGAKI MINEHIRO ,  BESSHO YOSHIHIRO ,  HATANAKA HIDEO ,  FUKUMURA YASUSHI ,  EDA KAZUO ,  ISHIDA TORU

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/32 ,  H01L23/498 ,  H05K1/02 ,  H05K3/10 ,  H05K3/32 ,  H05K3/34 ,  H01L21/768

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

Abstract: A stress relaxation electronic part to be mounted on a wiring board and having a conductive stress relaxing mechanism body on the side where the part is connected to the wiring board.