公开(公告)号：EP2026642A4

公开(公告)日：2009-08-26

申请号：EP07744477

申请日：2007-05-31

Applicant: MURATA MANUFACTURING CO

Inventor： SAKAMOTO SADAAKI

IPC: H05K3/46

CPC classification number: H05K3/4688 ,  B32B18/00 ,  C03C3/064 ,  C03C3/066 ,  C03C3/089 ,  C03C3/091 ,  C03C8/02 ,  C03C8/14 ,  C04B35/63 ,  C04B35/6342 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/96 ,  C04B2237/32 ,  C04B2237/343 ,  C04B2237/58 ,  C04B2237/582 ,  C04B2237/66 ,  C04B2237/704 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/068 ,  Y10T428/24926

Abstract: There is provided a multilayer ceramic substrate having high transverse strength and suppressed warpage, in which delamination does not easily occur. The multilayer ceramic substrate has a laminated structure including an inner layer portion (3) and surface layer portions (4 and 5), in which the thermal expansion coefficient of the surface layer portions (4 and 5) is lower than the thermal expansion coefficient of the inner layer portion (3), the difference in thermal expansion coefficient between the surface layer portions (4 and 5) and the inner layer portion (3) is 1.0 ppmK -1 or more, and the weight content of a component common to both a material constituting the surface layer portions (4 and 5) and a material constituting the inner layer portion (3) is 75o by weight or more.

Abstract translation: 提供了具有高横向强度和抑制翘曲的多层陶瓷基板，其中分层不容易发生。 多层陶瓷基板具有包括内层部（3）和表层部（4,5）的层叠结构，其中表层部（4和5）的热膨胀系数低于 内层部分（3），表面层部分（4和5）与内层部分（3）之间的热膨胀系数差为1.0ppmK -1以上，并且两者共同的成分的重量含量 构成表层部（4和5）的材料和构成内层部（3）的材料为75重量份以上。

公开(公告)号：EP1890524A4

公开(公告)日：2009-07-01

申请号：EP07740830

申请日：2007-04-02

Applicant: PANASONIC CORP

Inventor： ECHIGO FUMIO ,  HIRAI SHOGO ,  NAKAMURA TADASHI

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/4614 ,  H05K3/4632 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49124

Abstract: A multilayer printed wiring board is characterized in that a thermal expansion coefficient in the thickness direction of an interlayer connecting material formed in a via hole is lower than that in the thickness direction of an electric insulating base material composed of an insulating material, an interlayer connection forming temperature is higher than a use environment temperature and a dimension in the thickness direction of the interlayer connecting material at a room temperature is more than that of the interlayer connecting material in the same wiring layer. As a result, since a material thermal expansion difference is generated in the thickness direction of the printed wiring board under the use environment, internal stress due to compression constantly operates to the interlayer connecting section. Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.

公开(公告)号：EP2032632A2

公开(公告)日：2009-03-11

申请号：EP07868306.7

申请日：2007-06-14

Applicant: Sabic Innovative Plastics IP B.V.

Inventor： CHAN, Kwok Pong ,  HAGBERG, Erik ,  MULLEN, Tara J. ,  ODLE, Roy Ray

IPC: C08J5/18 ,  C08L79/08

CPC classification number: H05K1/0346 ,  C08G73/1007 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/068 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4'-oxydiphthalic dianhydride, 3,3'-oxydiphthalic dianhydride, 4,4'- oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4'-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 1900°C to 400°C; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/°C, a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

公开(公告)号：EP2019571A2

公开(公告)日：2009-01-28

申请号：EP08013361.4

申请日：2008-07-24

Applicant: TDK Corporation

Inventor： Kanemaru, Yoshikazu ,  Morita, Takaaki ,  Kawabata, Kenichi

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/2009 ,  H05K2203/0169 ,  Y10T29/49146 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1) :α1

公开(公告)号：EP1764206A4

公开(公告)日：2008-05-28

申请号：EP05741311

申请日：2005-05-12

Applicant: TEIJIN DUPONT FILMS JAPAN LTD

Inventor： HASHIMOTO KATSUYUKI ,  YOSHIDA TETSUO ,  TSUJI MAKOTO ,  TOGANO SHINYA

IPC: B29C55/02 ,  C08J5/18 ,  C08L67/02 ,  H05B33/02 ,  H05B33/14 ,  H05K1/00 ,  H05K1/03

CPC classification number: C08J5/18 ,  B29K2067/00 ,  C08J2367/02 ,  H05K1/0326 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/068 ,  Y10S428/91 ,  Y10T428/24355 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/31786

Abstract: Disclosed is an oriented polyester film having a certain thickness which is excellent in dimensional stability at high temperatures and dimensional stability against temperature changes within the temperature range of use. Specifically disclosed is an oriented polyester film stretched in at least one direction and having a film thickness of 12-250 μm, whose base layer is mainly composed of polyethylene-2,6-naphthalene dicarboxylate. The oriented polyester film is characterized in that (1) the temperature expansion coefficient (αt) at 30-100˚C is 0-15 ppm/˚C in both longitudinal and transverse directions; and (2) the thermal shrinkage rate at 100˚C in 10 minutes is not more than 0.5% in both longitudinal and transverse directions.

公开(公告)号：EP1809083A3

公开(公告)日：2007-07-25

申请号：EP07001746.2

申请日：2002-03-13

Applicant: Ibiden Co., Ltd.

Inventor： Toyoda, Yukihiko ,  Kawamura, Yoichiro ,  Ikeda, Tomoyuki

IPC: H05K3/46 ,  H05K1/11

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/116 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09745 ,  H01L2924/00

Abstract: A multilayered printed circuit board (200) comprising a substrate and, as serially built up thereon, a conductor circuit and an interlaminar resin insulating layer in an alternate fashion and in repetition, and a solder resist layer (114) formed further thereon as an outermost layer, with a connection of said conductor circuits through said interlaminar resin insulating layer being performed by a via-hole, wherein via-holes in different level layers among said via-holes (1072) are piled on one another, and among said piled via-holes, the via-hole (1071) in the uppermost level has a concave portion formed thereon.

Abstract translation: 一种多层印刷电路板（200），其包括基板和，为顺序建立在其上，导体电路和以交替的方式重复的层间树脂绝缘层和阻焊剂在其上形成进一步作为最外层（114） 层，用的连接通过所述层间树脂绝缘层的导体电路由一个通孔，其中通孔中在不同级别层中的所述通孔（1072）是在彼此堆积执行，并且经由所述堆积中 在最上层的通孔1071上形成有凹部。

公开(公告)号：EP1667502A3

公开(公告)日：2007-07-25

申请号：EP06003856.9

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru ,  Kobayashi, Hiroyuki ,  Chihara, Kenji ,  Minoura, Hitsashi ,  Tsukada, Kiyotaka ,  Kondo, Mitsuhiro

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/24

CPC classification number: H05K3/28 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: A manufacturing method of a printed wiring board, wherein a conductor circuit (106) is formed on the surface of an insulating substrate (107). A solder resist made of thermosetting resin is next printed on the surface of said insulating substrate (107). An insulating film (101) having a coefficient of thermal expansion equal to or smaller than 100 ppm/°C is next formed by thermally curing the solder resist. The conductor circuit (106) is next exposed by irradiating a laser beam to an opening portion forming portion in the insulating film (101) and burning-out the insulating film (101) of said opening portion forming portion and forming an opening portion (110).

Abstract translation: 一种印刷线路板的制造方法，其中在绝缘基板（107）的表面上形成导体电路（106）。 接下来，在所述绝缘基板（107）的表面上印刷由热固性树脂制成的阻焊剂。 接下来通过热固化阻焊剂形成热膨胀系数等于或小于100ppm /℃的绝缘膜（101）。 接下来，通过向绝缘膜（101）中的开口部分形成部分照射激光束并烧掉所述开口部分形成部分的绝缘膜（101）并形成开口部分（110），导体电路 ）。

公开(公告)号：EP1764206A1

公开(公告)日：2007-03-21

申请号：EP05741311.4

申请日：2005-05-12

Applicant: Teijin Dupont Films Japan Limited

Inventor： HASHIMOTO, Katsuyuki, Teijin DuPont FilmsJapan Ltd ,  YOSHIDA, Tetsuo, Teijin DuPont Films Japan Limited ,  TSUJI, Makoto, Teijin DuPont Films Japan Limited ,  TOGANO, Shinya, Teijin DuPont Films Japan Limited

IPC: B29C55/02 ,  C08J5/18 ,  H05B33/02 ,  H05B33/14 ,  B29K67/00 ,  C08L67/02

CPC classification number: C08J5/18 ,  B29K2067/00 ,  C08J2367/02 ,  H05K1/0326 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/068 ,  Y10S428/91 ,  Y10T428/24355 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/31786

Abstract: An object of the invention is to provide such an oriented polyester film that has a constant thickness, and is excellent in dimensional stability at a high temperature and dimensional stability to temperature change in a working temperature range.
The invention relates to an oriented polyester film containing as a major component of a substrate layer polyethylene-2,6-naphthalene dicarboxylate, being stretched at least in one direction, and having a film thickness of from 12 to 250 µm, wherein
(1) a coefficient of linear thermal expansion αt at a temperature of from 30 to 100°C is from 0 to 15 ppm/°C in both longitudinal and width directions of the film, and
(2) a thermal shrinkage rate at 100°C for 10 minutes is 0.5% or less in both longitudinal and width directions of the film.

Abstract translation: 本发明的目的是提供一种具有恒定厚度的定向聚酯膜，并且在高温下的尺寸稳定性优异，并且在工作温度范围内对温度变化的尺寸稳定性。 本发明涉及一种取向聚酯薄膜，该聚酯薄膜含有至少沿一个方向拉伸的层叠聚乙烯-2,6-萘二甲酸酯的主要成分，膜厚为12至250μm，其中（1） 在30至100℃的温度下，线性热膨胀系数±t在膜的纵向和宽度方向上为0至15ppm /℃，（2）在100℃下的热收缩率为 10分钟在膜的纵向和宽度方向上为0.5％或更小。

公开(公告)号：EP1014766B1

公开(公告)日：2007-03-21

申请号：EP99125418.6

申请日：1999-12-20

Applicant: Sony Chemical & Information Device Corporation

Inventor： Takahashi, Satoshi ,  Namiki, Hidetsugu

IPC: H05K1/03 ,  B32B15/08

CPC classification number: H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T428/31721

公开(公告)号：EP1734068A1

公开(公告)日：2006-12-20

申请号：EP05719312.0

申请日：2005-02-18

Applicant: POLYMATECH CO., LTD.

Inventor： TOBITA, Masayuki POLYMATECH CO., LTD. R & D Centr. ,  KIMURA, Toru POLYMATECH CO., LTD. R & D CENTR. ,  AOKI, Hisashi POLYMATECH CO., LTD. R & D CENTR. ,  SHIMOYAMA, Naoyuki POLYMATECH CO., LTD. R & Dcentr ,  ISHIGAKI, Tsukasa POLYMATECH CO., LTD. R & D centr ,  OCHI, Mitsukazu ,  HARADA, Miyuki

IPC: C08J5/24 ,  B32B15/08 ,  C08K7/02 ,  C08L63/00 ,  H05K1/03 ,  H05K3/00 ,  C08L101/00

CPC classification number: C08G59/28 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08K7/02 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/249924 ,  C08L63/00

Abstract: A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (α) of orientation in a range of 0. 5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5 × 10 -6 to 50 × 10 -6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30 × 10 -6 (/K) or less.

Abstract translation: 一种热塑性聚合物复合成型制品或由热塑性聚合物或热塑性聚合物和纤维形成的热塑性聚合物复合成型制品，其中纤维沿着第一平面布置，热塑性聚合物或热塑性聚合物的分子链定向在 方向与第一平面交叉，并且热塑性聚合物或热塑性聚合物的分子链具有在0.5以上且小于1.0的范围内的取向度（±）），并且其中所述成形制品的热膨胀系数 沿着第一平面的方向和与第一平面相交的方向分别为5×10 -6至50×10 -6（/ K），沿着第一平面的方向上的热膨胀系数与 与第一平面交叉的方向的热膨胀系数为30×10 -6（/ K）以下。