公开(公告)号：EP1989930A2

公开(公告)日：2008-11-12

申请号：EP07751245.7

申请日：2007-02-22

申请人： Edwards Lifesciences Corporation

发明人： CURRY, Kenneth, M.

IPC分类号： H05K1/11

CPC分类号： H05K3/247 ,  A61B5/1486 ,  A61B2562/125 ,  A61N1/05 ,  G01N27/3271 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2203/0574 ,  Y10T29/4916 ,  H01L2924/00

摘要： A method of creating an active electrode (10) that includes providing a flex circuit (100) having an electrode (120) made of a first material and providin a first mask (200) over the flex circuit, the first mask having an offset region (305) and an opening (220) that exposes the electrode. The method also includes depositing a second material (300) over the offset region and the opening, the second material being different from the first material an providing a second mask (400) over the second material, the second mask havin a opening (405) over a portion of the second material that is over the offset region.

公开(公告)号：EP1952315A2

公开(公告)日：2008-08-06

申请号：EP06849032.5

申请日：2006-11-01

申请人： CHECKPOINT SYSTEMS, INC.

发明人： COTE, Andre ,  DUSCHEK, Detlef

IPC分类号： G06K19/077 ,  H01L21/60 ,  H01L23/498

CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/0775 ,  G08B13/244 ,  H01L21/56 ,  H01L21/67132 ,  H01L24/86 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/7965 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T428/14 ,  H01L2924/00

摘要： A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

公开(公告)号：EP1060647A4

公开(公告)日：2005-06-29

申请号：EP99906891

申请日：1999-02-11

申请人： MERRIMAC IND INC

发明人： LOGOTHETIS JAMES J ,  MCANDREWS JOSEPH

IPC分类号： H01L23/14 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K1/186 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49805 ,  H01L23/49894 ,  H01L23/5389 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/034 ,  H05K1/167 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/015 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T156/1057 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24562 ,  Y10T428/24661 ,  Y10T428/24802 ,  Y10T428/3154 ,  H01L2924/00

摘要： A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates (1-10) into a multilayer structure (200) using fusion bonding. The bonded multilayers (1-10), with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module (200). Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

公开(公告)号：EP1339524A1

公开(公告)日：2003-09-03

申请号：EP01273400.0

申请日：2001-12-13

申请人： Henkel Loctite Corporation

发明人： KONARSKI, Mark, M. ,  KRUG, John, P.

IPC分类号： B23K35/36 ,  H01L21/56 ,  H01L23/29

CPC分类号： H01L21/563 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49171 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays ('LGAs'), flip chip assemblies ('FCs') and the like, each of which having a semiconductor chip, such as large scale integration ('LSI'), or semiconductor chips themselves and a circuit board to which the devices or chips, repsectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

公开(公告)号：EP1060647A1

公开(公告)日：2000-12-20

申请号：EP99906891.9

申请日：1999-02-11

申请人： Merrimac Industries, Inc.

发明人： LOGOTHETIS, James, J. ,  McANDREWS, Joseph

IPC分类号： H05K1/18

CPC分类号： H05K1/186 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49805 ,  H01L23/49894 ,  H01L23/5389 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/034 ,  H05K1/167 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/015 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T156/1057 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24562 ,  Y10T428/24661 ,  Y10T428/24802 ,  Y10T428/3154 ,  H01L2924/00

摘要： A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates (1-10) into a multilayer structure (200) using fusion bonding. The bonded multilayers (1-10), with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module (200). Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

公开(公告)号：EP0969707A2

公开(公告)日：2000-01-05

申请号：EP99201699.8

申请日：1999-05-28

申请人： Matsushita Electric Works, Ltd.

发明人： Yoshioka, Hirokazu ,  Yoshida, Norio ,  Tanaka, Kenichiro

IPC分类号： H05K3/46 ,  H05K3/00

CPC分类号： H05K3/4652 ,  H05K1/116 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/0055 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/098 ,  H05K2201/09863 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165

摘要： A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 µm in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.

摘要翻译： 多层印刷线路板由多个导体层整体层叠而形成，绝缘层介于其间，设置在绝缘层中的非贯通通孔，所述绝缘层由于暴露的导体层而有底，设置在通孔内用于 所述导体层之间的电连接在所述通孔的内周到底面的连续区处沿所述轴向剖视图形成为具有在20至100μm范围内的半径的凹曲面， 在电镀镀层时发生的等势表面沿着连续区域弯曲，以统一电流密度，以使电镀层在厚​​度上均匀，而不在连续区域变薄。

公开(公告)号：EP0656982A1

公开(公告)日：1995-06-14

申请号：EP93914644.0

申请日：1993-07-02

申请人： V. KANN RASMUSSEN INDUSTRI A/S

发明人： BRADE, Claus, Börge ,  BARTHOLIN, Niels

IPC分类号： B60S1 ,  E05F15 ,  G01N27 ,  G01W1

CPC分类号： G01W1/14 ,  E05F15/71 ,  E05Y2900/154 ,  G01N27/048 ,  Y10T29/49007 ,  Y10T29/4916

摘要： An electrical rain sensor to be mounted on the outside of the main frame of an openable window, particularly a skylight, comprising a sensing element with two electrodes mounted opposite one another in an insulating holder, the distance between the electrodes being less than the size of a raindrop. To the electrodes an electric circuit is connected which by detection of a change in an electrical quantity caused by the presence of raindrops, activates a maneuvering device which closes the window. The holder (8) is produced by moulding of an electrically insulating thermoplastic, wherein the supply lines to the electrodes (15, 16) as well as a heating element for the drying of the sensor is produced as inserts in the holder by moulding of an electrically conductive thermoplastic polymer into excavated recesses and/or grooves in the holder (8). The electrodes can be designed as coatings of a weather resistant conducting material, particularly material containing graphite, the conducting material being applied to most of the surface of the sensor.

公开(公告)号：EP0329973B1

公开(公告)日：1995-05-17

申请号：EP89101420.1

申请日：1989-01-27

申请人： W.R. Grace & Co.-Conn.

发明人： Enloe, Jack Harrison ,  Lau, John Wing-Keung ,  Lundsager, Christian Bent ,  Rice, Roy Warren

IPC分类号： C04B35/64 ,  H01L21/48

CPC分类号： C04B35/63408 ,  C04B35/111 ,  C04B35/581 ,  C04B35/634 ,  C04B35/638 ,  C04B35/645 ,  H01L21/4807 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  H01L2924/00

公开(公告)号：EP0416518A3

公开(公告)日：1993-01-27

申请号：EP90116931.8

申请日：1990-09-04

申请人： IDEMITSU KOSAN COMPANY LIMITED

发明人： Nakano, Akikazu

IPC分类号： H05K1/03

CPC分类号： H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10T29/4916

摘要： A process for producing a printed circuit board is disclosed, in which the following steps are sequentially conducted:
(1) a step for dispersing in at least one of the mediums of water and an organic solvent
(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l, (2) a sedimentation step of the dispersed solids in said slurry, (3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue, (4) a step for melting with heating and pressure forming the molded product, and (5) a step for providing a metal layer on the molded article. The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.

公开(公告)号：EP0236404B1

公开(公告)日：1992-12-23

申请号：EP86905344.7

申请日：1986-09-03

申请人： UFE, Incorporated

发明人： ATKINSON, Anthony ,  GRAY, Richard ,  DENES, Oscar L.

IPC分类号： H05K3/20

CPC分类号： H05K1/00 ,  B29C45/0053 ,  B29C45/0055 ,  B29C45/1418 ,  B29C45/14639 ,  B29C45/14778 ,  B29C45/14827 ,  B29C51/082 ,  B29C51/10 ,  B29C51/14 ,  B29C70/78 ,  B29C2045/14237 ,  B29C2791/006 ,  B29K2067/00 ,  B29K2995/0005 ,  B29L2009/008 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/207 ,  H05K2201/0376 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/1327 ,  Y10T29/4916

摘要： A method of providing an electrical circuit on a surface of a three-dimensionally shaped substrate of insulating plastics material comprising providing a carrier film (33) of insulating plastics material with a circuit pattern (31) of electro-conductive or electro-resistive, heat-resistant synthetic resin applied to at least one face (32); supporting a face of the carrier; forming a carrier into a given three-dimensional shape; and, moulding, by the application of heat and pressure in a mould cavity (38), a substrate (34) of insulating plastics material against the unsupported face of the carrier; so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.

摘要翻译： PCT No.PCT / GB86 / 00523 Sec。 371日期1987年7月1日 102（e）日期1987年7月1日PCT提交1986年9月3日PCT公布。 第WO87 / 01557号公报 日期：1987年3月12日。一种提供电路的方法，其中将作为其上具有电路图案的绝缘塑料材料的膜的载体支撑在模具中，并且通过施加热和压力将模塑材料施加到 提供基板，使得电路嵌入在模制基板的三维表面中或内。