公开(公告)号：EP0801884B1

公开(公告)日：1999-05-12

申请号：EP96924758.4

申请日：1996-07-20

Applicant: ROBERT BOSCH GMBH

Inventor： ROOZENBEEK, Herman ,  TEPASS, Bernd

IPC: H05K9/00

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09972 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10689 ,  Y02P70/611

Abstract: The invention concerns a module mounting rack for an electronic control unit with signal-processing analogue and/or digital components, rapid-operation digital components and components with both signal-processing functional parts and rapid-operation digital functional parts and power components which are disposed on a multilayer printed circuit board and are connected in an electrically conductive manner to a common earth layer. The signal-processing components of each module are jointly connected to the common earth layer. The noise radiation of the control unit, caused by high-frequency interference current, can be reduced and impairment of signal processing by high current densities in the earth layer and resultant potential shifts can be prevented by combining the signal-processing components to form signal-processing modules having at least one common function, and guiding the earth connections of all the components of each such functional module via line connections to a common connection point which is conductively connected in the shortest possible way to the common earth layer. The rapid-operation digital and power components are directly connected to the common earth layer. By introducing an additional power supply layer, the noise radiation of the control unit can be reduced even further.

公开(公告)号：EP0197393B1

公开(公告)日：1989-01-25

申请号：EP86103849.5

申请日：1986-03-21

Applicant: International Business Machines Corporation

Inventor： Dick, Carroll John ,  Linsker, Ralph ,  Rutter, Roger Sherman ,  Thomas, David Lynn

IPC: H05K1/00

CPC classification number: H05K1/0228 ,  H05K2201/09236 ,  H05K2201/09254

公开(公告)号：EP3389347A1

公开(公告)日：2018-10-17

申请号：EP18166917.7

申请日：2018-04-12

Applicant: Pegatron Corporation

Inventor： YANG, Ching Ou ,  CHU, Cheng-Hui

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0263 ,  H05K1/0265 ,  H05K1/114 ,  H05K1/116 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09463 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09709 ,  H05K2201/0979

Abstract: A power signal transmission structure and a design method are provided. The power supply signal transmission structure is adapted for a circuit board having a first surface and a second surface opposite to the first surface, and the power signal transmission structure includes a first power electrode, a second power electrode, and a plurality of vias. The first power electrode is disposed on the first surface and has a plurality of power pad regions for receiving a power signal. The second power electrode is disposed on the second surface. The vias penetrate the circuit board to electrically connect the first power electrode and the second power electrode. The vias are arranged in accordance with the current direction of the power signal to balance the current received by the vias.

公开(公告)号：EP3379905A1

公开(公告)日：2018-09-26

申请号：EP18162164.0

申请日：2018-03-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SHIOZAKI, Ryosuke ,  SUZUKI, Yuto ,  IWAKI, Hideki

IPC: H05K1/02 ,  H01Q21/00 ,  H01Q21/06 ,  H01P1/203 ,  H01P5/02

CPC classification number: H05K1/0251 ,  H01P3/08 ,  H01P5/028 ,  H01Q1/38 ,  H01Q21/0075 ,  H01Q21/065 ,  H05K1/0242 ,  H05K1/0243 ,  H05K1/0248 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/09327 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10098

Abstract: A circuit board includes: a substrate; a first power feed line disposed so as to be close to a plurality of radiating elements provided on a surface of the substrate and to extend in a first direction; a first connection conductor (17) extending in a second direction orthogonal to the first direction, one end of the first connection conductor being connected to the first power feed line substantially at its central portion in the first direction; and a second power feed line (19, 51) that has a first line part (191) extending in a third direction orthogonal to the second direction, the first line part joining to another end of the first connection conductor (17), and also has a second line part (193) branching from the first line part (191), the second line part joining to the other end from a third direction side.

公开(公告)号：EP3264872A1

公开(公告)日：2018-01-03

申请号：EP16305824.1

申请日：2016-06-30

Applicant: Thomson Licensing

Inventor： LO HINE TONG, Dominique ,  AUBIN, Anthony ,  LE FOULGOC, Jean-Marc

IPC: H05K3/36 ,  H05K1/02 ,  H03H7/01 ,  H01P1/203

CPC classification number: H05K3/366 ,  H01P1/203 ,  H01P1/2039 ,  H05K1/0233 ,  H05K1/0237 ,  H05K2201/09254 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A radio frequency interconnection device, comprising; a first part of said radio frequency interconnection device being disposed on a first circuit board; and a second part of said radio frequency interconnection device disposed on a second circuit board wherein the radio frequency interconnection device is a radio frequency wideband bandpass filter comprising:
- an input port (915,1115,P1) on said first circuit board (1105) and an output port (1215,P2) on said second circuit board (1205), wherein said first and second circuit board (1105,1205) are arranged at an angle to one another,
- a first transmission line (925,1130,TL1) on said first circuit board (1105) to connect said input port (915,1115,P1) with an intermediate terminating pad (1120) on said first circuit board (1105),
- a second transmission line (935,TL2) on said first circuit board (1105) connected to said first transmission line (925,1130,TL1) and terminated by a ground hole (910) on said first circuit board (1105),
- a first ground pad (1125,PG1) formed on said first circuit board (1105) being spaced apart from said intermediate terminating pad (1120),
- a third transmission line (925,1220,TL3) on said second circuit board (1205) to connect an intersection point (C) with a second ground pad (1225,PG2) on said second circuit board (1205), wherein said output port (1215,P2) is connected to said third transmission line (925,1220,TL3) at said intersection point (C), said intersection point (C) is located above said intermediate terminating pad (1120) and said second ground pad (1225,PG2) is located above said first ground pad (1125,PG1)
- a first baseplate located being between said first grounding pad (1125) and said second grounding pad (1225,PG2) and a second baseplate being between said intersection point (C) and said intermediate terminating pad (1120), said baseplates providing an air gap between said first circuit board (1105) and said second circuit board (1205), both said first circuit board (1105) and said second circuit board (1205) having a ground plane (1110,1210).

Abstract translation: 一种射频互连装置，包括： 所述射频互连装置的第一部分设置在第一电路板上; 所述射频互连装置的第二部分设置在第二电路板上，其中所述射频互连装置是射频宽带带通滤波器，包括： - 所述第一电路板（1105）上的输入端口（915,1115，P1） 和所述第二电路板（1205）上的输出端口（1215，P2），其中所述第一和第二电路板（1105,1205）彼此成角度地布置， - 第一传输线（925,1130，TL1 ）连接到所述第一电路板（1105）上，以将所述输入端口（915,1115，P1）与所述第一电路板（1105）上的中间端接焊盘（1120）连接; - 所述第二传输线（935，TL2） 第一电路板（1105），其连接到所述第一传输线（925,1130，TL1）并且由所述第一电路板（1105）上的接地孔（910）终止;第一接地焊盘（1125，PG1），其形成在所述第一电路板 第一电路板（1105）与所述中间端接焊盘（1120）间隔开， - 第三透射 （1205）上的离子线（925,1220，TL3）以在所述第二电路板（1205）上连接交点（C）与第二接地焊盘（1225，PG2），其中所述输出端口（1215 ，所述交点（C）位于所述中间端接焊盘（1120）的上方，并且所述第二接地焊盘（1225，PG2）与所述第三传输线（925,1220，TL3） ）位于所述第一接地垫（1125，PG1）上方 - 位于所述第一接地垫（1125）和所述第二接地垫（1225，PG2）之间的第一底板和位于所述交叉点（C）和第二底板 所述中间终端垫（1120），所述基板在所述第一电路板（1105）和所述第二电路板（1205）之间提供气隙，所述第一电路板（1105）和所述第二电路板（1205）都具有接地 平面（1110,1210）。

公开(公告)号：EP2898446A4

公开(公告)日：2016-04-27

申请号：EP13838256

申请日：2013-09-23

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA

IPC: G06K7/08 ,  A61J1/03 ,  A61J7/04 ,  B65D75/36 ,  G06K19/07 ,  H04B5/02 ,  H05K3/10

CPC classification number: H01L23/66 ,  A61J1/035 ,  A61J2200/30 ,  A61J2205/60 ,  B65D25/00 ,  B65D2203/10 ,  H01L23/4985 ,  H01L23/564 ,  H01L23/585 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0239 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0292 ,  H05K1/111 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

公开(公告)号：EP2973625A1

公开(公告)日：2016-01-20

申请号：EP14774544.2

申请日：2014-03-13

Applicant: Hiq Solar, Inc.

Inventor： WILLIS, Andre P.

IPC: H01G2/06 ,  H01G4/12 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.

公开(公告)号：EP2907367A1

公开(公告)日：2015-08-19

申请号：EP13774421.5

申请日：2013-10-09

Applicant: Zumtobel Lighting GmbH

Inventor： MARTIN, Kenneth ,  GAJDOS, David ,  BLOCK, Steffen ,  DANIEL, Christian

IPC: H05K1/02 ,  H01L25/075 ,  H05K3/22

CPC classification number: F21V21/00 ,  F21V23/06 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K3/222 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/173 ,  H01L2924/00

Abstract: The invention relates to a printed circuit board (10) for populating with illumination bodies, in particular LEDs (25), said board having population regions (20) with connection options for the illumination bodies. A number of the population regions (20) are connected in series by means of conductor tracks (21) to form a group. The printed circuit board is further provided with additional connection options (22) for electrical connection elements, in particular for 0-ohm resistors, via which at least some of the groups can be connected either in parallel or in series.

公开(公告)号：EP2686958A4

公开(公告)日：2015-02-18

申请号：EP12761258

申请日：2012-03-16

Applicant: CISCO TECH INC

Inventor： SHASTRI KALPENDU ,  DAMA BIPIN ,  WEBSTER MARK ,  PIEDE DAVID

IPC: G02F1/03 ,  G02F1/225 ,  H03K19/0175 ,  H05K1/02

CPC classification number: H01P3/00 ,  G02F1/011 ,  G02F1/0121 ,  G02F1/0327 ,  G02F1/225 ,  G02F1/2255 ,  G02F2201/124 ,  G02F2201/126 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/10121

Abstract: A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

公开(公告)号：EP2648309A2

公开(公告)日：2013-10-09

申请号：EP12180715.0

申请日：2012-08-16

Applicant: LITE-ON IT Corporation

Inventor： Scholz, Frank ,  Graf, Stefan ,  Waldschmidt, Andre ,  Lindenstruth, Lars ,  Jung, Marco

IPC: H02J7/00 ,  H02J7/02

CPC classification number: H02J50/10 ,  H01F27/362 ,  H02J7/0027 ,  H02J7/0042 ,  H02J7/025 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/0227 ,  H05K2201/09254

Abstract: A comb-structured shielding layer and a wireless charging transmitter thereof are provided. The wireless charging module is connected to a power source, has at least one wireless charging coil and at least one comb-structured shielding layer, and is configured to convert alternative current power from the power source to H-field electromagnetic radiations, and wirelessly charges an electronic device. The comb-structured shielding layer is disposed between the wireless charging module and the target electronic device and configured to allow the H-field electromagnetic radiations pass through. The comb-structured shielding layer includes a first area and a second area. The first area is electrically connected to a reference electric potential. The second area is electrically connected to the reference electric potential through the first area, and is configured to shield the E-field electromagnetic radiations but allow the H-field electromagnetic radiations pass through the comb-structured shielding layer.

Abstract translation: 提供梳状结构的屏蔽层及其无线充电发射器。 无线充电模块连接到电源，具有至少一个无线充电线圈和至少一个梳状屏蔽层，并被配置为将来自电源的替代电流功率转换为H场电磁辐射，并且将无线充电模块无线充电 电子设备。 梳状结构的屏蔽层设置在无线充电模块和目标电子设备之间，并且被配置为允许H场电磁辐射通过。 梳状结构的屏蔽层包括第一区域和第二区域。 第一区域电连接到参考电位。 第二区域通过第一区域电连接到参考电位，并且被配置为屏蔽E场电磁辐射，但是允许H场电磁辐射通过梳结构屏蔽层。