公开(公告)号：EP0341629A3

公开(公告)日：1990-12-27

申请号：EP89108245.5

申请日：1989-05-08

Applicant: HITACHI, LTD.

Inventor： Maeno, Yutaka ,  Hashiguchi, Seiji ,  Hasegawa, Keiichi ,  Hachiya, Masaaki ,  Ueyama, Shingo

IPC: H05K13/04 ,  H05K13/08

CPC classification number: H05K1/111 ,  H05K1/0268 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3452 ,  H05K13/04 ,  H05K13/0465 ,  H05K13/08 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A printed circuit board is provided on its surface with position detecting patterns (5) at specific positions with respect to conductor patterns (4) for connecting leads of an integrated circuit (1). The position of the lead connecting conductor patterns (4) is obtained in indirect manner through the calculation from positional information on the position detecting patterns (5).

公开(公告)号：EP0248566A2

公开(公告)日：1987-12-09

申请号：EP87304510.8

申请日：1987-05-21

Applicant: AT&T Corp.

Inventor： LoVasco, Francis ,  Oien, Michael Ackman

IPC: H01L21/58 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/81024 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/0379 ,  H05K2201/09909 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate (31, 32). The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other (34, 35). The assembly is reflowed and the final separation between package and substrate at which the resulting solder joint solidifies is mechanically controlled in order to control a geometry of the resultant solidified joint (36, 37). The solder volume deposits may assume various forms including spherical bumps and solder paste deposits.

Abstract translation: 焊料接头组件技术适用焊料的受控体积为两者封装的焊盘和基片（31，32）。 这两个单元被定位成机械性地保持在登记海誓山盟（34，35）的焊盘和焊料沉积相邻海誓山盟。 该组件被软熔和封装基板之间和将所得的焊点固化是为了控制所得的几何机械控制的最终分离凝固接头（36，37）。 焊料体积沉积物可以采取各种形式，包括球形凸块和焊锡膏沉积。

公开(公告)号：EP2717338B1

公开(公告)日：2018-08-01

申请号：EP12792316.7

申请日：2012-03-22

Applicant: Sharp Kabushiki Kaisha

Inventor： HATA, Toshio ,  AGATANI, Makoto ,  UEMURA, Toyonori ,  ISHIZAKI, Shinya ,  MATSUSHITA, Hitoshi

IPC: H05K1/02 ,  H05K1/11 ,  F21K9/232 ,  H01L25/075 ,  F21V3/00 ,  H05K3/28 ,  F21Y115/10 ,  H01L33/50

CPC classification number: F21V3/02 ,  F21K9/232 ,  F21K9/235 ,  F21K9/237 ,  F21K9/60 ,  F21K9/64 ,  F21K9/68 ,  F21V3/00 ,  F21V23/001 ,  F21V29/77 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/508 ,  H01L2224/48137 ,  H01L2924/3025 ,  H05B33/0845 ,  H05B33/0857 ,  H05B37/0272 ,  H05K1/0274 ,  H05K1/11 ,  H05K3/28 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00

Abstract: The light-emitting device (100) includes a substrate (101) and a plurality of light-emitting sections. A first light-emitting section is made up of LED chips (102) and a first fluorescent-substance-containing resin layer (107), and a second light-emitting section is made up of LED chips (102) and a second fluorescent-substance-containing resin layer (108). The first fluorescent-substance-containing resin layer (107) and the second fluorescent-substance-containing resin layer (108) are provided in a plurality of locations such that the fluorescent-substance-containing resin layers for the different light-emitting sections are adjacently arranged.

公开(公告)号：EP3328168A1

公开(公告)日：2018-05-30

申请号：EP16382556.5

申请日：2016-11-24

Applicant: VALEO ILUMINACION

Inventor： TEBA, Daniel ,  GUZMAN, Alfonso-Manuel ,  MARTINEZ, Francisco

IPC: H05K3/14

CPC classification number: H05K3/14 ,  F21S41/147 ,  F21S41/192 ,  F21Y2115/10 ,  H05K3/0014 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3442 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/09909 ,  H05K2203/1344 ,  Y02P70/613

Abstract: The invention provides for a method for creating an electronic assembly (1). The method comprises the steps of: providing a plastics substrate (2), providing a semiconductor light source (5), depositing a conductive track (3) by direct deposition on the plastics substrate (2), depositing a conductive welding material (4) on the conductive track (3) or on the light source (5), placing the light source (5) on the conductive track (3) in such a way that the conductive welding material (4) is in direct contact with both the conductive track (3) and the light source (5), and finally addressing a heat source on the conductive welding material, so that an electric contact between the light source and the conductive track is achieved by means of the conductive welding material (4), thereby obtaining the electronic assembly. The invention also includes an electronic assembly and a lighting device.

公开(公告)号：EP3031308A1

公开(公告)日：2016-06-15

申请号：EP14747950.5

申请日：2014-08-07

Applicant: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg

Inventor： EHRMANN, Steffen ,  ZICK, Stefan

IPC: H05K1/11

CPC classification number: H05K1/181 ,  H03K17/567 ,  H03K17/687 ,  H05K1/021 ,  H05K1/111 ,  H05K1/119 ,  H05K3/202 ,  H05K3/3452 ,  H05K2201/066 ,  H05K2201/09118 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/611

Abstract: The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically separated from the first, and which furthermore has a separator arranged between the solder regions and rising out from the solder regions, having a power semiconductor component which has a housing having an output connection side, from which at least one control connection and a plurality of output connections protrude, which are arranged substantially adjacent to each other on the output connection side, wherein the control connection is electrically and mechanically connected to the first solder region and the output connections are electrically and mechanically connected to the second solder region and the control connection is separated from the output connections via the raised separator. The present invention furthermore relates to a control device for a cooler fan module of a motor vehicle and to a method for assembling a power semiconductor component on a circuit board.

公开(公告)号：EP2981156A1

公开(公告)日：2016-02-03

申请号：EP15178724.9

申请日：2015-07-28

Applicant: BUBENDORFF ,  Commissariat à l'Energie Atomique et aux Energies Alternatives

Inventor： GROSJEAN, Stéphane ,  PILAT, Eric

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H01L31/02 ,  H01L31/048 ,  H01L31/05 ,  H01L31/18

CPC classification number: H01L31/048 ,  H01L31/02008 ,  H01L31/05 ,  H01L31/188 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/09909 ,  H05K2201/10143 ,  H05K2203/0588 ,  Y02E10/50 ,  Y02P70/611 ,  Y02P70/613

Abstract: Selon l'invention, le procédé de fabrication de panneau photovoltaïque (1) est caractérisé en ce qu'il consiste en des étapes suivantes :
- On dépose un motif métallique (4) sur une carte de circuit imprimé (2) ;
- On applique au moins une couche de vernis épargne (6) sur la ladite carte (2) en laissant au moins une zone libre de vernis (7, 11) ;
- On applique sur tout ou partie de cette dite couche de vernis épargne (6) un premier masque (12) constitué d'un film polymère pour former un appui au moins à une cellule photovoltaïque (5) ;
- On applique sur tout ou partie de ce dit premier masque (12) un second masque (14) également constitué d'un film polymère délimitant au moins tout ou partie un cadre d'implantation (15) d'une cellule photovoltaïque (5) ;
- On dépose au moins une cellule photovoltaïque (5) dans ledit cadre d'implantation (15) en faisant concorder au moins une zone de raccordement (8, 8a) définie sous ladite cellule photovoltaïque (5) avec au moins une zone de raccordement (8, 8a) sur ledit circuit métallique (4) ;
- On effectue une opération de liage.

公开(公告)号：EP2975452A1

公开(公告)日：2016-01-20

申请号：EP15175546.9

申请日：2015-07-06

Applicant: Lee, Cheng-Tao

Inventor： Lee, Cheng-Tao

IPC: G02F1/1335 ,  H01L27/15 ,  H05K1/02 ,  H05K7/20 ,  F21V29/10

CPC classification number: G02B6/0088 ,  G02B6/00 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133524 ,  G02F1/1336 ,  G02F1/133603 ,  G02F1/133608 ,  G02F1/133615 ,  G02F2001/133612 ,  G02F2001/133628 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/62 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/05 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2054 ,  H05K2203/302 ,  H01L2924/00

Abstract: A backlight device includes a backboard (1) having a first portion (11) and a second portion (12). The second portion (12) is mounted to an outer periphery of the first portion (11). The first portion (11) and the second portion (12) together define a light mixing chamber (S). An insulating layer (13) is formed on a surface of the first portion (11) in the light mixing chamber (S) or a surface of the second portion (12) in the light mixing chamber (S). A lighting module (2) includes at least one conductive circuit (21) and at least one light-emitting diode (22) electrically connected to the at least one conductive circuit (21). The at least one conductive circuit (21) is formed on the insulating layer (13). An optical module (3) is mounted to the backboard (1) and is located in a top of the light mixing chamber (S).

Abstract translation: 背光装置包括具有第一部分（11）和第二部分（12）的背板（1）。 第二部分（12）安装到第一部分（11）的外周。 第一部分（11）和第二部分（12）共同限定了光混合室（S）。 在光混合室（S）的第一部分（11）的表面或光混合室（S）中的第二部分（12）的表面上形成绝缘层（13）。 照明模块（2）包括至少一个导电电路（21）和至少一个电连接到所述至少一个导电电路（21）的发光二极管（22）。 至少一个导电电路（21）形成在绝缘层（13）上。 光学组件（3）安装在背板（1）上并位于光混合室（S）的顶部。

公开(公告)号：EP2953432A1

公开(公告)日：2015-12-09

申请号：EP14305979.8

申请日：2014-06-23

Applicant: Alcatel Lucent

Inventor： Gadeyne, Koen ,  Hooghe, Koen ,  Kozicki, Bartlomiej

IPC: H05K1/02 ,  H01P1/02 ,  H01P3/02

CPC classification number: H05K1/0248 ,  H01P1/02 ,  H01P5/028 ,  H05K1/024 ,  H05K1/0245 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09272 ,  H05K2201/0989 ,  H05K2201/09909

Abstract: An apparatus (10) includes a printed circuit board. The printed circuit board includes a group of metal traces (12) located along a surface or interface of the printed circuit board and a dielectric layer (20). The metal traces of the group are parallel in a sequence common straight zones (16) and are bent in a common direction in a local common bend zone (18) located between two of the common straight zones. In and next to the local common bend zone, said same dielectric layer is in contact with a longer segment of one of the metal traces than of another of the metal traces of the group.

Abstract translation: 一种装置（10）包括印刷电路板。 印刷电路板包括沿着印刷电路板的表面或界面定位的一组金属迹线（12）和介电层（20）。 该组的金属迹线在一系列共同的直线区域（16）中平行，并且在位于两个公共直线区域之间的局部公共弯曲区域（18）中沿共同的方向弯曲。 在局部共用弯曲区域和旁边，所述相同的介电层与一组金属迹线中的一条金属迹线的较长的部分接触。

公开(公告)号：EP2772123A4

公开(公告)日：2015-08-19

申请号：EP12844004

申请日：2012-09-06

Applicant: NOKIA TECHNOLOGIES OY

Inventor： HIRALAL PRITESH

IPC: H05K1/16 ,  H01G11/08 ,  H01G11/14 ,  H01G11/84 ,  H01M10/04 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46

CPC classification number: H01G11/84 ,  H01G11/08 ,  H01G11/14 ,  H01M10/04 ,  H05K1/145 ,  H05K1/162 ,  H05K3/0097 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/09909 ,  H05K2201/10037 ,  H05K2203/1147 ,  Y02E60/13 ,  Y10T29/49126

Abstract: An apparatus comprising: first and second circuit boards with respective electrodes thereon, the first and second circuit boards in a bonded configuration; One or more first layers positioned to be proximal to the one or more of the electrodes; electrolyte proximal to the respective electrodes; one or more second layers configured to provide for the bonded configuration in which the first and second circuit boards are bonded together, under curing, such that the respective one or more first layers are positioned between the one or more second layers and the electrodes, the bonding defining a chamber therebetween with the electrodes therein and facing one another, the chamber comprising the electrolyte; and wherein the one or more first layers are configured to inhibit interaction of the electrolyte with the one or more second layers during curing.

公开(公告)号：EP2749152A1

公开(公告)日：2014-07-02

申请号：EP12790724.4

申请日：2012-10-26

Applicant: Apple Inc.

Inventor： The designation of the inventor has not yet been filed

IPC: H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.