Abstract:
A multi-layer wiring substrate for directly mounting chips or chip carriers obtained by using as adhesive layers and/or insulating layers a cured product of a special ether imide compound alone or together with at least one of aromatic cyanamide compounds, cyanurate compounds and cyanate compounds, is excellent in flexibility, solder heat resistance, high temperature fluidity and adhesiveness to copper conductors.
Abstract:
The invention provides a mixed circuit board comprising a heat-resistant insulating substrate (16) and at least one laminated sheet (10,20) bonded integrally to at least one side of the substrate (16), the laminated sheet (10,20) comprising a metal oxide dielectric film (13), a metal resistor film (12) formed on the dielectric film (13) and a pair of metal conductor layers (11,15) between which the dielectric film (13) and resistor (12) film are sandwiched. A method for fabricating the mixed circuit board is also described.
Abstract:
The invention features a method of constructing a high performance printed circuit board assembly utilizing a modular construction technique. Sub-assemblies (10) are first constructed, tested, and then subsequently incorporated into the final circuit board assembly (20) which has a triplate geometry. Lamination of the modular sub-assemblies minimizes dielectric core thickness.
Abstract:
The hollow multilayer printed wiring board is composed of plural print boards (1), (2), (3), (4) laminated with a predetermined spacing therebetween, each of which has a signal-conducting pattern (6) formed on at least one surface thereof and a land-conducting pattern (7) formed on at least one surface thereof. The board has through-holes (10) which are plated to connect with the land-conducting pattern and each of the through-holes and a plated through-hole in at least one board of the boards adjacent thereto are positioned on a straight line so as to provide a plated through-hole or an interstitial wire hole (12), (13). Formed on at least the upper- and lower- end surfaces of each through-hole (10) are low melting-point metal layers which function as conductors among the signal conducting patterns in 2 or more of the plural boards and as layer-bonding materials for the plural boards. The laminated boards, except at least one of the outer sides, is made of a heat-proof organic plastics-sheet or an insulated metal.
Abstract:
An impedance matching stripline transition for microwave signals which are conducted from a stripline circuit on one laminate (2) to another laminate (4) through a number of intermediate laminates (3). The connection between an incoming stripline circuit (21) on one laminate (2) to the outgoing stripline circuit (41) on the other laminate is performed as a short coaxial line. The outer conductor of the coaxial line is formed by a number of through-plated holes (12, 13, 23, 33, 43) in horseshoe form around a central conductor of through-plated holes (24, 34). The outer conductor is connected with the earth plane (31, 11, 45) of the laminates. They serve simultaneously as suppressor of not desired modes in the microwave signals which is supplied to the transition via the conductor (21).
Abstract:
Um ein Verfahren zum Verfüllen einer Durchkontaktierung durch eine erste Lage für eine mehrlagige Leiterplatte derart zu verbessern, dass das Verfahren kostengünstiger, qualitativ besser und schneller durchgeführt werden kann, wird vorgeschlagen, einen Stift in die Durchkontaktierung einzuführen, den Stift auf eine vorgegebene Stiftlänge zu kürzen und anschließend die Lage mit weiteren Lagen der mehrlagigen Leiterplatte zu verpressen.
Abstract:
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.