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    Electronic component module and circuit board thereof
    41.
    发明专利
    Electronic component module and circuit board thereof 审中-公开
    电子元件模块和电路板

    公开(公告)号：JP2009111287A

    公开(公告)日：2009-05-21

    申请号：JP2007284330

    申请日：2007-10-31

    Applicant: Fujitsu Media Device Kk ,  富士通メディアデバイス株式会社

    Inventor： OGASAWARA KOJI

    IPC: H05K1/02 ,  H05K3/46

    CPC classification number: H05K1/141 ,  H05K1/0224 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/09136 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/0969

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component module comprising a circuit board (in particular, a high-frequency board) in which the shielding effect of a ground plane is not impaired and in which warpage and twist on account of reflow soldering are suppressed, and to provide a circuit board thereof.
    SOLUTION: The electronic component module includes: the circuit board having an insulating layer, a plurality of conductive layers formed on respective surfaces of the insulating layer, a ground plane comprising one of the conductive layers and covering the greater part of the surface, and wiring formed on another of the surfaces and comprising the conductive layer; and an electronic component mounted on the circuit board and connected by the wiring, wherein a plurality of slits, formed by removing the conductive layer, are provided in the ground plane.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种电子部件模块，其包括不损害接地层的屏蔽效应的电路板（特别是高频板），并且由于回流而产生翘曲和扭曲 焊接被抑制，并且提供其电路板。 电子部件模块包括：电路板，其具有绝缘层，形成在绝缘层的各个表面上的多个导电层，包括一个导电层并覆盖该表面的大部分的接地平面 以及在另一个表面上形成并包括导电层的布线; 以及安装在电路板上并通过布线连接的电子部件，其中通过去除导电层形成的多个狭缝设置在接地平面中。 版权所有（C）2009，JPO＆INPIT

    Electromagnetic bandgap structure and printed circuit board
    43.
    发明专利
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带结构和印刷电路板

    公开(公告)号：JP2009004791A

    公开(公告)日：2009-01-08

    申请号：JP2008162569

    申请日：2008-06-20

    Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

    Inventor： KIM HAN ,  YANAGI SAIKO

    IPC: H05K3/46

    CPC classification number: H01P1/2005 ,  H01Q15/006 ,  H01Q15/008 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

    Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem between an analog circuit and a digital circuit, the electromagnetic bandgap structure having a low bandgap frequency although having a small size.
    SOLUTION: The electromagnetic bandgap structure includes a mushroom type structure 360 comprising a first metal plate 350 and a via 340 of which one end is connected to the first metal plate 350; a second metal plate 330a connected to the other end of the via 340; a first metal layer 330b being connected to the second metal layer 330a through a metal line 333; a first dielectric layer 320a stacked between the first metal layer 330b and the first metal plate 350; a second dielectric layer 320b stacked on the first metal plate 350 and the first dielectric layer 320a; and a second metal layer 310 stacked on the second dielectric layer 320b.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板，尽管具有小尺寸，但是电隙带隙结构具有低带隙频率。 解决方案：电磁带隙结构包括蘑菇型结构360，其包括第一金属板350和通孔340，其一端连接到第一金属板350; 连接到通孔340的另一端的第二金属板330a; 第一金属层330b通过金属线333连接到第二金属层330a; 层叠在第一金属层330b和第一金属板350之间的第一电介质层320a; 层叠在第一金属板350和第一电介质层320a上的第二电介质层320b; 以及层叠在第二电介质层320b上的第二金属层310。 版权所有（C）2009，JPO＆INPIT

    Electronic apparatus
    46.
    发明专利
    Electronic apparatus 有权
    电子设备

    公开(公告)号：JP2007234674A

    公开(公告)日：2007-09-13

    申请号：JP2006051181

    申请日：2006-02-27

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： ITO ATSUSHI ,  HONDA TAKAYOSHI

    IPC: H05K1/18

    CPC classification number: H05K1/111 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/114 ,  H05K3/341 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09709 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic apparatus whose mounting efficiency of a printed circuit board can be improved. SOLUTION: A plurality of terminals 324 exposed from a main body 326 having an IC chip 323 in QFN320a inside are electrically connected to a plurality of lands 311 corresponding to the terminals arranged on the printed board 310. A reinforcing part 321 exposed from a face confronted with the printed board in the main body 326 is mechanically connected to a reinforcing land 312 installed on the printed board. Thus, QFN320a is surface-mounted on the printed board 310 in the electronic apparatus 100. The printed board 310 has a plurality of wirings 317 corresponding to a plurality of lands 311. A plurality of wirings 317 comprise wiring 317 arranged in a region confronted with at least the main body 326. The reinforcing land 312 has a shape corresponding to wiring 317 installed in the region confronted with the main body 326. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够提高印刷电路板的安装效率的电子设备。 解决方案：从内部具有QFN320a的IC芯片323的主体326露出的多个端子324电连接到与布置在印刷电路板310上的端子对应的多个焊盘311。 在主体326中面对印刷电路板的面机械地连接到安装在印刷电路板上的加强台面312。 因此，QFN320a被表面安装在电子设备100中的印刷电路板310上。印刷板310具有对应于多个焊盘311的多个布线317.多个布线317包括布线317，布线317布置在面对 至少主体326.加强平台312具有与安装在与主体326相对的区域中的布线317对应的形状。版权所有（C）2007，JPO＆INPIT

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