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公开(公告)号：KR101562705B1
公开(公告)日：2015-10-22
申请号：KR1020130111750
申请日：2013-09-17
IPC分类号： H01L23/48
CPC分类号： H01L24/02 , H01L21/4853 , H01L21/76885 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/02125 , H01L2224/02141 , H01L2224/02145 , H01L2224/0215 , H01L2224/0401 , H01L2224/05114 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/10125 , H01L2224/11013 , H01L2224/11019 , H01L2224/1112 , H01L2224/11462 , H01L2224/11472 , H01L2224/13012 , H01L2224/13015 , H01L2224/13017 , H01L2224/13023 , H01L2224/13026 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13551 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13582 , H01L2224/136 , H01L2224/13686 , H01L2224/1369 , H01L2224/14051 , H01L2224/16148 , H01L2224/16227 , H01L2224/16238 , H01L2224/16503 , H01L2224/81007 , H01L2224/81143 , H01L2224/81191 , H01L2224/81203 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/8181 , H01L2224/81895 , H01L2224/8192 , H01L2224/81948 , H01L2225/06513 , H01L2924/04941 , H01L2924/07025 , H01L2924/181 , H01L2924/301 , H01L2924/35 , Y10T29/49144 , H01L2924/00014 , H01L2924/014 , H01L2924/05432 , H01L2924/053 , H01L2924/00 , H01L2924/00012
摘要： 예시적인범프구조는기판상에형성된접촉엘리먼트; 기판위에놓이는패시베이션층 - 상기패시베이션층은접촉엘리먼트를노출하는패시베이션개구를가짐 - ; 패시베이션층 위에놓이는폴리이미드층 - 상기폴리이미드층은접촉엘리먼트를노출하는폴리이미드개구를가짐 - ; 접촉엘리먼트에전기적으로연결되는 UBM(under bump metallurgy) 피처상기 UBM 피처는 UBM 폭을가짐 - ; 및 UBM 피처상의구리필러를포함하고, 구리필러의말단(distal end)은필러폭을갖고, UBM 폭은상기필러폭보다더 크다.
摘要翻译： 凸块结构包括形成在衬底上的接触元件和覆盖衬底的钝化层。 钝化层包括暴露接触元件的钝化开口。 凸块结构还包括覆盖钝化层的聚酰亚胺层和电耦合到接触元件的凸块下冶金（UBM）特征。 聚酰亚胺层具有暴露接触元件的聚酰亚胺开口，凸起下的金属特征具有UBM宽度。 凸起结构还包括在凸起下金属冶金特征上的铜柱。 铜柱的前端具有柱宽，UBM宽度大于柱宽。
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公开(公告)号：KR20150103648A
公开(公告)日：2015-09-11
申请号：KR20150120038
申请日：2015-08-26
发明人： YU CHEN HUA , LIN SHIH TING , LIN JING CHENG , HOU SHANG YUN , LU SZU WEI
IPC分类号： H01L23/14 , H01L23/12 , H01L23/28 , H01L23/498 , H01L23/538
CPC分类号： H01L21/561 , H01L21/56 , H01L21/563 , H01L23/4985 , H01L23/5387 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05609 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05794 , H01L2224/058 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13294 , H01L2224/133 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/81007 , H01L2224/81192 , H01L2224/81193 , H01L2224/81409 , H01L2224/81411 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/83007 , H01L2224/831 , H01L2224/92125 , H01L2924/01322 , H01L2924/3511 , H01L2924/014 , H01L2924/01029 , H01L2924/01032 , H01L2924/00014 , H01L2924/00
摘要： 제 1 측 및 제 2 측을 구비한 플렉시블 기판이 제공될 수 있다. 하나 이상의 전기 접속부를 통하여 플렉시블 기판의 제 1 측에 디바이스가 전기적으로 연결될 수 있다. 휨(warpage) 제어 디바이스는 상기 플렉시블 기판의 제 2 측에 부착될 수 있다. 휨 제어 디바이스는 접착층 및 리지드(rigid)층을 포함할 수 있다. 휨 제어 디바이스는 플렉시블 기판의 제 1 측 상의 하나 이상의 전기 접속부에 대향할 수 있는 플렉시블 기판의 제 2 측의 영역 내에 형성될 수 있다.
摘要翻译： 可以提供具有第一侧和第二侧的柔性基板。 器件可以通过一个或多个电连接与柔性衬底的第一侧电连接。 翘曲控制装置可以附接到柔性基板的第二侧。 翘曲控制装置可以包括粘合剂层和刚性层。 翘曲控制装置可以形成在柔性基板的可以面对柔性基板的第一侧上的电连接的第二侧的区域中。
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公开(公告)号：KR1020140139104A
公开(公告)日：2014-12-04
申请号：KR1020147030165
申请日：2013-03-21
申请人： 다나카 기킨조쿠 고교 가부시키가이샤
CPC分类号： H01L24/83 , B22F1/0074 , B22F1/025 , B23K1/203 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/226 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/322 , B23K2201/40 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L2224/0401 , H01L2224/04026 , H01L2224/05082 , H01L2224/05166 , H01L2224/05169 , H01L2224/05644 , H01L2224/11312 , H01L2224/11318 , H01L2224/1132 , H01L2224/11416 , H01L2224/13294 , H01L2224/13339 , H01L2224/13347 , H01L2224/13364 , H01L2224/13444 , H01L2224/16227 , H01L2224/27312 , H01L2224/27318 , H01L2224/2732 , H01L2224/27416 , H01L2224/29294 , H01L2224/29339 , H01L2224/29347 , H01L2224/29364 , H01L2224/29444 , H01L2224/32225 , H01L2224/81192 , H01L2224/81203 , H01L2224/81444 , H01L2224/8184 , H01L2224/83192 , H01L2224/83203 , H01L2224/83444 , H01L2224/8384 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01203 , H01L2924/014 , H01L2924/10253 , H01L2924/15747 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： 본 발명은, 금속 분말과 유기 용제를 포함하는 다이본드용의 도전성 페이스트이며, 상기 금속 분말은, 순도 99.9질량％ 이상, 평균 입경 0.01㎛ 내지 1.0㎛인 은분, 팔라듐분, 구리분으로부터 선택되는 1종 이상의 금속 입자와, 상기 금속 입자의 적어도 일부를 덮는 금을 포함하는 피복층을 포함하는 도전성 페이스트이다. 본 발명에 관한 도전성 페이스트에 의하면, 반도체 소자 등을 기판으로 다이본드 할 때에, 접합부에 있어서의 보이드 등의 결함 발생을 억제할 수 있다.
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公开(公告)号：KR101421907B1
公开(公告)日：2014-07-22
申请号：KR1020137003745
申请日：2011-09-22
申请人： 파나소닉 주식회사
CPC分类号： H05K7/06 , H01L21/4853 , H01L21/563 , H01L23/36 , H01L23/3677 , H01L23/49838 , H01L23/544 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2223/5442 , H01L2223/54426 , H01L2224/023 , H01L2224/02372 , H01L2224/02377 , H01L2224/02379 , H01L2224/0401 , H01L2224/05569 , H01L2224/05624 , H01L2224/11442 , H01L2224/11464 , H01L2224/1182 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13155 , H01L2224/136 , H01L2224/1403 , H01L2224/14131 , H01L2224/14136 , H01L2224/14179 , H01L2224/14515 , H01L2224/16225 , H01L2224/16227 , H01L2224/17051 , H01L2224/73104 , H01L2224/73204 , H01L2224/81007 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81411 , H01L2224/81444 , H01L2224/81815 , H01L2224/831 , H01L2224/83862 , H01L2224/92125 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , H01L2924/381 , H01L2924/3841 , H05K1/02 , H01L2924/01014 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01083 , H01L2224/05552
摘要： 본 발명의 전자 부품 실장체는, 복수의 부품측 전극 단자(3a, 3b)를 구비하는 전자 부품(1)이, 복수의 부품측 전극 단자(3a, 3b)에 대응하는 복수의 기판측 전극 단자(7a, 7b)를 구비하는 기판(6) 상에 실장된 전자 부품 실장체로서, 전자 부품(1)의 복수의 부품측 전극 단자(3a, 3b) 상에 각각 형성되고, 전자 부품(1)과 기판(6)을 전기적으로 접속하는 복수의 돌기형상 전극(5a, 5b)과, 전자 부품(1) 상에 형성되고, 복수의 부품측 전극 단자(3a, 3b) 중 소정 위치의 부품측 전극 단자(3a)에 전기적으로 접속하는 더미 전극(3c)을 구비하고, 더미 전극(3c)에 전기적으로 접속하는 소정 위치의 부품측 전극 단자(3a) 상의 돌기형상 전극(5a)이, 상기 소정 위치와는 상이한 위치의 부품측 전극 단자(3b) 상의 돌기형상 전극(5b)보다도 높은 것을 특징으로 한다.
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公开(公告)号：KR1020140063388A
公开(公告)日：2014-05-27
申请号：KR1020130090812
申请日：2013-07-31
CPC分类号： H01L21/561 , H01L21/56 , H01L21/563 , H01L23/4985 , H01L23/5387 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05609 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05794 , H01L2224/058 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13294 , H01L2224/133 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2224/81007 , H01L2224/81192 , H01L2224/81193 , H01L2224/81409 , H01L2224/81411 , H01L2224/81424 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/83007 , H01L2224/831 , H01L2224/92125 , H01L2924/01322 , H01L2924/3511 , H01L2924/014 , H01L2924/01029 , H01L2924/01032 , H01L2924/00014 , H01L2924/00
摘要： A flexible substrate having a first side and a second side is provided. A device is electrically connected to the first side of the flexible substrate through one or more electric connection parts. A warpage control device can be attached to the second side of the flexible substrate. The warpage control device may include an adhesive layer and a rigid layer. The warpage control device may be formed in the second side of the flexible substrate which can face one or more electrical connection parts on the first side of the flexible substrate.
摘要翻译： 提供了具有第一侧和第二侧的柔性基板。 器件通过一个或多个电连接部分电连接到柔性基板的第一侧。 翘曲控制装置可以附接到柔性基板的第二侧。 翘曲控制装置可以包括粘合剂层和刚性层。 翘曲控制装置可以形成在柔性基板的可以面对柔性基板的第一侧上的一个或多个电连接部分的第二侧。
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公开(公告)号：KR1020140036987A
公开(公告)日：2014-03-26
申请号：KR1020130111750
申请日：2013-09-17
IPC分类号： H01L23/48
CPC分类号： H01L24/02 , H01L21/4853 , H01L21/76885 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/02125 , H01L2224/02141 , H01L2224/02145 , H01L2224/0215 , H01L2224/0401 , H01L2224/05114 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/10125 , H01L2224/11013 , H01L2224/11019 , H01L2224/1112 , H01L2224/11462 , H01L2224/11472 , H01L2224/13012 , H01L2224/13015 , H01L2224/13017 , H01L2224/13023 , H01L2224/13026 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13551 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13582 , H01L2224/136 , H01L2224/13686 , H01L2224/1369 , H01L2224/14051 , H01L2224/16148 , H01L2224/16227 , H01L2224/16238 , H01L2224/16503 , H01L2224/81007 , H01L2224/81143 , H01L2224/81191 , H01L2224/81203 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/8181 , H01L2224/81895 , H01L2224/8192 , H01L2224/81948 , H01L2225/06513 , H01L2924/04941 , H01L2924/07025 , H01L2924/181 , H01L2924/301 , H01L2924/35 , Y10T29/49144 , H01L2924/00014 , H01L2924/014 , H01L2924/05432 , H01L2924/053 , H01L2924/00 , H01L2924/00012
摘要： A bump structure according to the embodiment of the present invention includes a contact alignment formed on a substrate; a passivation layer placed on the substrate - the passivation layer has a passivation opening part which exposes the contact alignment - ; a polyimide layer place on the passivation layer - the polyimide layer has a polyimide opening part which exposes the contact alignment - ; an under bump metallurgy (UBM) feature electrically connected to the contact alignment - the UBM feature has an UBM width - ; and a copper filter on the UBM feature. The distal end of the cooper filter has a filer width and the width of the UBM is greater than that of the filer.
摘要翻译： 根据本发明的实施例的凸块结构包括在基板上形成的接触对准; 钝化层，放置在衬底上 - 钝化层具有暴露接触对准的钝化开口部分; 聚酰亚胺层位于钝化层上 - 聚酰亚胺层具有暴露接触对准的聚酰亚胺开口部分; UBM功能电气连接到接触对准 - UBM功能具有UBM宽度; 和UBM功能上的铜滤波器。 铜合金过滤器的末端具有滤波器宽度，UBM的宽度大于滤波器的宽度。
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公开(公告)号：KR1020140036939A
公开(公告)日：2014-03-26
申请号：KR1020130025435
申请日：2013-03-11
IPC分类号： H01L21/60
CPC分类号： H01L24/02 , H01L21/4853 , H01L21/76885 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/02125 , H01L2224/02141 , H01L2224/02145 , H01L2224/0215 , H01L2224/0401 , H01L2224/05114 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/10125 , H01L2224/11013 , H01L2224/11019 , H01L2224/1112 , H01L2224/11462 , H01L2224/11472 , H01L2224/13012 , H01L2224/13015 , H01L2224/13017 , H01L2224/13023 , H01L2224/13026 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13551 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13582 , H01L2224/136 , H01L2224/13686 , H01L2224/1369 , H01L2224/14051 , H01L2224/16148 , H01L2224/16227 , H01L2224/16238 , H01L2224/16503 , H01L2224/81007 , H01L2224/81143 , H01L2224/81191 , H01L2224/81203 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/8181 , H01L2224/81895 , H01L2224/8192 , H01L2224/81948 , H01L2225/06513 , H01L2924/04941 , H01L2924/07025 , H01L2924/181 , H01L2924/301 , H01L2924/35 , Y10T29/49144 , H01L2924/00014 , H01L2924/014 , H01L2924/05432 , H01L2924/053 , H01L2924/00 , H01L2924/00012
摘要： A bump on trace (BOT) structure of the embodiment includes a contact alignment supported by an IC; an under bump metallurgy (UBM) feature which is electrically connected to the contact alignment; a metal bump on the UBM feature; and a substrate trace on a substrate. The substrate trace is connected to a metal bump through an intermetal composite and a solder joint. The ration of the first cross section of the intermetal composite to the second cross section of the solder joint is greater than 40% or more. [Reference numerals] (16) Metal bump; (20) Substrate; (26) Chip
摘要翻译： 实施例的跟踪（BOT）结构包括由IC支持的接触对准; 电触点焊接（UBM）特征，其电连接到接触对准; UBM功能上的金属凸块; 和衬底上的衬底迹线。 衬底迹线通过金属间复合材料和焊点连接到金属凸块。 金属间复合材料的第一截面与焊点的第二截面的比例大于40％以上。 （16）金属凸块; （20）基材; （26）芯片
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公开(公告)号：KR1020130120457A
公开(公告)日：2013-11-04
申请号：KR1020137008719
申请日：2011-09-12
申请人： 데쿠세리아루즈 가부시키가이샤
CPC分类号： H01L24/29 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/304 , B32B27/32 , B32B27/36 , B32B2307/306 , B32B2307/416 , B32B2307/536 , B32B2457/00 , C08L27/06 , C08L67/00 , C08L79/08 , C08L83/04 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L25/0753 , H01L33/005 , H01L33/48 , H01L33/60 , H01L33/62 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29387 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/7598 , H01L2224/75985 , H01L2224/81001 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83907 , H01L2224/9205 , H01L2224/9211 , H01L2224/92143 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2933/0033 , H01L2933/0066 , Y10T156/10 , Y10T428/24967 , Y10T428/31544 , Y10T428/31663 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： 멀티칩 실장시에 얼라인먼트 어긋남을 발생시키지 않고, 양호한 접속 신뢰성을 확보할 수 있는 멀티칩 실장용 완충 필름은, 80ppm/℃ 이하의 선팽창 계수를 갖는 내열성 수지층과, JIS-K6253에 의한 쇼어 A 경도가 10 내지 80인 수지 재료로 형성된 유연성 수지층이 적층된 구조를 갖는다. 멀티칩 모듈은 복수의 칩 소자를 접착제를 통하여 기판에 얼라인먼트하여 임시 부착한 후, 칩 소자와 본딩 헤드의 사이에 멀티칩 실장용 완충 필름을 그 내열성 수지층이 칩 소자측이 되도록 배치하고, 복수의 칩 소자를 본딩 헤드로 기판에 대하여 가열 가압하여 접속함으로써 제조할 수 있다.
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公开(公告)号：KR1020130118175A
公开(公告)日：2013-10-29
申请号：KR1020120041167
申请日：2012-04-19
申请人： 삼성전자주식회사
CPC分类号： H01L23/49811 , H01L23/3128 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04026 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/0568 , H01L2224/131 , H01L2224/13294 , H01L2224/133 , H01L2224/16225 , H01L2224/29294 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81815 , H01L2224/83851 , H01L2224/92225 , H01L2224/97 , H01L2225/0651 , H01L2225/06548 , H01L2225/06562 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/83 , H01L2224/81
摘要： PURPOSE: A semiconductor package and a manufacturing method thereof are provided to prevent the degradation of structural stability due to the loads of semiconductor chips which are offset and laminated on a circuit board by forming a supporting structure. CONSTITUTION: A circuit board (100) includes a first signal pad and a second signal pad. A first semiconductor chip (200A) is mounted on one surface of the circuit board. A second semiconductor chip (200B) is offset and laminated on the first semiconductor chip. A supporting structure (300) is located between the second signal pad and a second input and output pad and includes a bottom pad (330), a top pad (310), an insulating body (320), and a conductive pillar (340). The conductive pillar passes through the insulating body and electrically connects the bottom pad to the top pad.
摘要翻译： 目的：提供半导体封装及其制造方法，以防止由于通过形成支撑结构而偏移并层压在电路板上的半导体芯片的负载导致的结构稳定性的劣化。 构成：电路板（100）包括第一信号焊盘和第二信号焊盘。 第一半导体芯片（200A）安装在电路板的一个表面上。 第二半导体芯片（200B）被偏置并层压在第一半导体芯片上。 支撑结构（300）位于第二信号焊盘和第二输入和输出焊盘之间，并且包括底焊盘（330），顶焊盘（310），绝缘体（320）和导电柱（340） 。 导电柱通过绝缘体并将底垫电连接到顶垫。
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公开(公告)号：KR1020130045205A
公开(公告)日：2013-05-03
申请号：KR1020120118301
申请日：2012-10-24
申请人： 니혼도꾸슈도교 가부시키가이샤
CPC分类号： H01L21/4853 , H01L23/49811 , H01L23/49822 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/16225 , H01L2224/17051 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81385 , H01L2224/81444 , H01L2224/81815 , H01L2924/01322 , H01L2924/12042 , H01L2924/1461 , H01L2924/15311 , H05K1/118 , H05K1/119 , H05K3/34 , H05K2201/09545 , Y10T29/49147 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PURPOSE: A wiring substrate and a manufacturing method thereof improve reliability by comprising a protrusion electrode appropriate for connection with a component. CONSTITUTION: A wiring substrate(101) arranges a plurality of protrusion electrodes(11) in an electrode forming area(133) on a main surface(102). At least one of the plurality of protrusion electrodes has a concave part(13) on a top surface(12), and forms a section inverse-trapezoidal shape by setting an external diameter(A1) larger than an external diameter(A2) on the top surface. The whole inner surface of the concave part forms a curved shape, and a deepest part of the concave part is located on a central axis(C1) of a deformed protrusion electrode.
摘要翻译： 目的：一种布线基板及其制造方法，其通过包括适于与部件连接的突起电极来提高可靠性。 构成：布线基板（101）将多个突起电极（11）布置在主表面（102）上的电极形成区域（133）中。 所述多个突起电极中的至少一个在顶面（12）上具有凹部（13），并且通过将大于外径（A2）的外径（A1）设定为大于所述外径 顶面。 凹部的整个内表面形成弯曲形状，并且凹部的最深部分位于变形的突起电极的中心轴线（C1）上。
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