公开(公告)号：US10147694B2

公开(公告)日：2018-12-04

申请号：US14986925

申请日：2016-01-04

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/02 ,  H01L23/00 ,  C25D5/02 ,  C25D7/12 ,  H05K3/34

Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

公开(公告)号：US09343420B2

公开(公告)日：2016-05-17

申请号：US14181616

申请日：2014-02-14

Applicant: GLOBALFOUNDRIES INC.

Inventor： Brian M. Erwin ,  Eric D. Perfecto ,  Nicholas A. Polomoff ,  Jae-Woong Nah

IPC: H01L23/16 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L24/17 ,  H01L21/561 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13005 ,  H01L2224/13147 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27515 ,  H01L2224/27632 ,  H01L2224/2784 ,  H01L2224/29023 ,  H01L2224/29028 ,  H01L2224/29076 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/32147 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83885 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/206 ,  H01L2924/0665 ,  H01L2224/81805 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/27

Abstract: Electronic devices including solder bumps embedded in a pre-applied coating of underfill material and/or solder resist are fabricated, thereby improving chip-package interaction reliability. Underfill can be directly applied to a wafer, enabling increased filler loadings. Passages formed in the underfill and/or solder resist coating expose electrically conductive pads or metal pillars. Such passages can be filled with molten solder to form the solder bumps.

Abstract translation: 制造包括嵌入在预填充材料和/或阻焊剂的预涂层中的焊料凸块的电子器件，从而提高芯片封装相互作用的可靠性。 底部填充物可以直接施加到晶片上，从而增加填料的填充量。 在底部填充和/或阻焊涂层中形成的通道暴露导电垫或金属柱。 可以用熔融焊料填充这样的通道以形成焊料凸块。

公开(公告)号：US09295166B2

公开(公告)日：2016-03-22

申请号：US14663754

申请日：2015-03-20

Applicant: GLOBALFOUNDRIES INC.

Inventor： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/00 ,  H05K3/34 ,  H01L21/48 ,  B23K1/00 ,  B23K3/06 ,  H01L23/498 ,  H01L21/56 ,  H05K13/04 ,  H01L23/00

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  B23K3/0638 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81065 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/14 ,  H01L2924/20104 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/35 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.

公开(公告)号：US09633925B1

公开(公告)日：2017-04-25

申请号：US15081403

申请日：2016-03-25

Applicant: GLOBALFOUNDRIES INC.

Inventor： Katsuyuki Sakuma ,  Mukta G. Farooq ,  Jae-Woong Nah

IPC: H01L23/544 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L23/29

CPC classification number: H01L21/76864 ,  H01L21/563 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473

Abstract: Structures and methods for improving the visualization of alignment marks on an underfill-covered chip. A feature is formed on a chip, and an underfill material is applied to the chip at a wafer level so that the feature is covered the feature. The feature includes a first structural element comprised of a first material and a second structural element comprised of a second material that is electrochemically dissimilar from the first material to provide a galvanic cell effect. Filler particles in the underfill material are caused by the galvanic cell effect to distribute with a first density in a first region over the first structural element and a second region of a second density over the second structural element. The first density in the first region is less than the second density in the second region such that the first region has a lower opacity than the second region.

公开(公告)号：US20160118358A1

公开(公告)日：2016-04-28

申请号：US14986925

申请日：2016-01-04

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L23/00

CPC classification number: H01L24/11 ,  C25D5/022 ,  C25D7/123 ,  H01L21/02107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11001 ,  H01L2224/11002 ,  H01L2224/11312 ,  H01L2224/1141 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1162 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01026 ,  H01L2924/00

Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

Abstract translation: 通过使用注射成型焊料在圆形晶片上提供焊料凸块。 在图案化掩模层的通道内的I / O焊盘上形成铜柱或极限极限冶金。 焊料注入柱子或BLM，填充通道。 可以使用容纳预先经过掩模层沉积和图案化的晶片的载体组件将熔融的焊料注入到圆形晶片形成的空腔中而不发生泄漏。 一个这样的载体组件包括具有圆形凹部的弹性体主体部分，凹部的壁与圆形晶片形成紧密密封。 其他载体组件使用施加在晶片的周边边缘周围的粘合剂，以确保载体组件和晶片之间的密封。

公开(公告)号：US09321245B2

公开(公告)日：2016-04-26

申请号：US13925050

申请日：2013-06-24

Applicant: GLOBALFOUNDRIES INC.

Inventor： Michael A. Gaynes ,  Eric P. Lewandowski ,  Jae-Woong Nah ,  Robert J. Polastre

IPC: B05D5/12 ,  B32B9/00 ,  H05K5/06 ,  B05D3/04 ,  B32B37/10 ,  H01L23/00 ,  H05K3/24 ,  H05K3/34

CPC classification number: B32B9/00 ,  B05D3/0406 ,  B32B37/1018 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K3/24 ,  H05K3/341 ,  H05K5/065 ,  H01L2924/00

Abstract: A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.

Abstract translation: 提供了一种在粘合的一对基板之间提供具有各向异性填料颗粒的均匀分布的基质材料的方法。 官能化的各向异性填料颗粒与基体材料均匀混合以形成均匀的混合物。 将第一基板和具有电互连结构阵列的第二基板的接合组件放置在真空环境内。 基体材料和各向异性填料颗粒的均匀混合物分布在电互连结构阵列周围。 气体突然引入真空环境以引起均匀混合物的内爆。 内爆使均匀混合物填充第一和第二基底之间的空腔，而不会引起各向异性填料颗粒的团聚。 填充第一和第二基板之间的空间的混合物具有各向异性填料颗粒的均匀分布。