公开(公告)号：US20100008056A1

公开(公告)日：2010-01-14

申请号：US12562444

申请日：2009-09-18

申请人： Masahiro ONO ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

发明人： Masahiro ONO ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

IPC分类号： H05K1/11

CPC分类号： H05K1/183 ,  H01L23/5385 ,  H01L25/0652 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/09701 ,  H01L2924/15156 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00012

摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

公开(公告)号：US07613010B2

公开(公告)日：2009-11-03

申请号：US10985325

申请日：2004-11-10

申请人： Masahiro Ono ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

发明人： Masahiro Ono ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

IPC分类号： H05K1/11

CPC分类号： H05K1/183 ,  H01L23/5385 ,  H01L25/0652 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/09701 ,  H01L2924/15156 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00012

摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

公开(公告)号：US20050168961A1

公开(公告)日：2005-08-04

申请号：US10985325

申请日：2004-11-10

申请人： Masahiro Ono ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

发明人： Masahiro Ono ,  Shigeru Kondo ,  Kazuhiro Nishikawa ,  Yoshihiko Yagi ,  Kazuto Nishida

IPC分类号： H01L23/538 ,  H01L25/065 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K1/11

CPC分类号： H05K1/183 ,  H01L23/5385 ,  H01L25/0652 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/09701 ,  H01L2924/15156 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00012

摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

摘要翻译： 立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从 电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。 因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

公开(公告)号：US06966964B2

公开(公告)日：2005-11-22

申请号：US10328189

申请日：2002-12-26

申请人： Koujiro Nakamura ,  Yoshihiko Yagi ,  Michiro Yoshino ,  Kazuto Nishida

发明人： Koujiro Nakamura ,  Yoshihiko Yagi ,  Michiro Yoshino ,  Kazuto Nishida

IPC分类号： H01L25/18 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L21/98 ,  H01L25/065 ,  H01L25/07 ,  B32B31/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83874 ,  H01L2224/83951 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device whereby semiconductor elements like semiconductor bare chips are mounted with high productivity on both surfaces of a circuit board while preventing the board from warping, and an apparatus for manufacturing a semiconductor device for faithfully embodying the manufacturing method. Semiconductor elements temporarily fixed on both surfaces of a circuit board are heated while being pressurized in directions to be each pressed against the board, whereby adhesive on both surfaces of the board is thermally set simultaneously and bumps on each semiconductor elements are press-bonded to their opposing board electrodes on the board to be electrically connected. Ultraviolet rays are irradiated to a circumference of mixed curing adhesive applied to at least one surface of the circuit board to form an ultraviolet curing part only on the circumference of the adhesive, thereby increasing strength for temporarily fixing the semiconductor elements to the circuit board.

摘要翻译： 一种制造半导体器件的方法，其中半导体元件如半导体裸芯片以高生产率安装在电路板的两个表面上同时防止板翘曲，以及用于制造半导体器件的装置，用于忠实地体现该制造方法。 临时固定在电路板的两个表面上的半导体元件在被压靠在板上的方向被加压的同时被加热，由此在板的两个表面上的粘合剂被同时热定形，并且将每个半导体元件上的凸块压接在它们 板上的相对的电路板电极要电连接。 紫外线照射到施加到电路板的至少一个表面的混合固化粘合剂的周边，以在粘合剂的周围仅形成紫外线固化部分，从而增加将半导体元件临时固定到电路板的强度。

公开(公告)号：US20080135283A1

公开(公告)日：2008-06-12

申请号：US11883801

申请日：2006-04-14

申请人： Kunio Hibino ,  Yoshihiro Tomura ,  Yoshihiko Yagi ,  Kazuhiro Nishikawa

发明人： Kunio Hibino ,  Yoshihiro Tomura ,  Yoshihiko Yagi ,  Kazuhiro Nishikawa

IPC分类号： H05K3/30 ,  H01B5/00 ,  H05K1/18 ,  B29C39/10

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13113 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/245 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2203/0113 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.

摘要翻译： 在电子部件的引线电极上形成突起电极，突出电极包括形成在电子部件的引线电极上的第一导体和通过使用具有凹度的转移模具覆盖在第一导体上的第二导体。 通过这种结构，可以以细间距形成任何构造的突出电极。

公开(公告)号：US08033016B2

公开(公告)日：2011-10-11

申请号：US11883801

申请日：2006-04-14

申请人： Kunio Hibino ,  Yoshihiro Tomura ,  Yoshihiko Yagi ,  Kazuhiro Nishikawa

发明人： Kunio Hibino ,  Yoshihiro Tomura ,  Yoshihiko Yagi ,  Kazuhiro Nishikawa

IPC分类号： H01K3/10

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13113 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/245 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2203/0113 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.

摘要翻译： 在电子部件的引线电极上形成突起电极，突出电极包括形成在电子部件的引线电极上的第一导体和通过使用具有凹度的转移模具覆盖在第一导体上的第二导体。 通过这种结构，可以以细间距形成任何构造的突出电极。

公开(公告)号：US07845954B2

公开(公告)日：2010-12-07

申请号：US11995339

申请日：2006-04-17

申请人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

发明人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC分类号： H01R12/00

CPC分类号： H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

摘要翻译： 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

公开(公告)号：US07762819B2

公开(公告)日：2010-07-27

申请号：US11918121

申请日：2006-07-06

申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC分类号： H01R12/00

CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20090215287A1

公开(公告)日：2009-08-27

申请号：US11918121

申请日：2006-07-06

申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC分类号： H01R12/14

CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20080139013A1

公开(公告)日：2008-06-12

申请号：US11995339

申请日：2006-04-17

申请人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

发明人： Yoshihiro Tomura ,  Yasushi Nakagiri ,  Kunio Hibino ,  Yoshihiko Yagi ,  Akihiro Miyashita ,  Masahiro Ono ,  Masato Mori

IPC分类号： H01R12/00 ,  H01R43/00

CPC分类号： H01R12/00 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1627 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/145 ,  H05K3/28 ,  H05K3/284 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49117 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

摘要翻译： 安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6） 在互连板（3）上的埋设在互连板（3）的端接材料（9）中。 因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。