公开(公告)号：US10696844B2

公开(公告)日：2020-06-30

申请号：US15120549

申请日：2015-02-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Long Xi ,  Yueshan He ,  Biwu Wang

IPC: B32B27/38 ,  B32B27/20 ,  B32B27/42 ,  B32B15/08 ,  B32B27/28 ,  C08L79/04 ,  C08L63/00 ,  C08J5/24 ,  H05K1/03 ,  C08K5/5399 ,  C08K5/521 ,  B32B27/16 ,  C08L79/08 ,  C08K5/3445 ,  C08K3/36 ,  C08L61/06 ,  C08L61/34 ,  C08K3/22 ,  B32B15/092 ,  B32B27/18

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

公开(公告)号：US09771479B2

公开(公告)日：2017-09-26

申请号：US15027353

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: B32B15/04 ,  C08L79/04 ,  C08K3/00 ,  C08K5/49 ,  C08L25/10 ,  C08L71/12 ,  C09D179/04 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  B32B15/098 ,  B32B15/20 ,  C08G14/06 ,  C08G14/12 ,  C09J161/34 ,  B32B5/02 ,  B32B5/26 ,  B32B7/10 ,  B32B15/14 ,  B32B15/18 ,  B32B15/08

CPC classification number: C08L79/04 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/10 ,  B32B15/098 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2457/08 ,  C08G14/06 ,  C08G14/12 ,  C08K3/00 ,  C08K3/36 ,  C08K5/14 ,  C08K5/49 ,  C08K5/5399 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L71/126 ,  C08L79/085 ,  C09D179/04 ,  C09J161/34 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0355

Abstract: The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

公开(公告)号：US09745464B2

公开(公告)日：2017-08-29

申请号：US14652065

申请日：2013-02-07

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yueshan He ,  Shiguo Su

IPC: C08L63/00 ,  H05K1/03 ,  C08L71/00 ,  B32B15/092 ,  C08J5/24 ,  B32B15/16 ,  B32B27/20 ,  C08G59/50 ,  C08G59/62 ,  C08L61/06 ,  H05K3/02

CPC classification number: C08L63/00 ,  B32B15/092 ,  B32B15/16 ,  B32B27/20 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/50 ,  C08G59/621 ,  C08J5/24 ,  C08J2361/06 ,  C08J2363/00 ,  C08K5/357 ,  C08K5/5399 ,  C08L61/06 ,  C08L71/00 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L79/04 ,  C08L85/02

Abstract: The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.

公开(公告)号：US20170009074A1

公开(公告)日：2017-01-12

申请号：US15120549

申请日：2015-02-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Long Xi ,  Yueshan He ,  Biwu Wang

IPC: C08L79/04 ,  B32B27/18 ,  H05K1/03 ,  B32B27/38 ,  B32B27/42 ,  C08J5/24 ,  B32B15/092 ,  B32B27/20

Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

Abstract translation: 本发明涉及一种无机阻燃树脂组合物，其基于有机固体的重量份，包含（A）1至10重量份的双马来酰亚胺树脂，（B）30至60重量份的 苯并恶嗪树脂，（C）10〜40重量份聚环氧化合物，（D）5〜25重量份含磷阻燃剂，（E）1〜25重量份固化剂， 是胺固化剂和/或酚醛树脂固化剂。 本发明还提供了由所述树脂组合物制备的用于印刷电路的预浸料，层压材料，层压材料。

公开(公告)号：US10400173B2

公开(公告)日：2019-09-03

申请号：US15475471

申请日：2017-03-31

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yongzhen Wang ,  Yueshan He ,  Zhongqiang Yang ,  Yongjing Xu

IPC: C08K5/544 ,  C09K21/12 ,  B32B15/092 ,  B32B27/20 ,  B32B37/06 ,  C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C07F9/659 ,  C08K5/5399 ,  C08K5/54 ,  C08L27/02 ,  D06M15/673

Abstract: The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.

公开(公告)号：US09840620B2

公开(公告)日：2017-12-12

申请号：US15022154

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  C08G14/06 ,  C08L61/34 ,  C08J5/24 ,  C08L71/12 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/285 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/3065 ,  C08G14/06 ,  C08J5/24 ,  C08J2371/12 ,  C08J2379/02 ,  C08J2425/10 ,  C08J2471/12 ,  C08K5/14 ,  C08K7/18 ,  C08L25/10 ,  C08L61/34 ,  C08L71/126 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/03 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012

Abstract: Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

公开(公告)号：US20160244611A1

公开(公告)日：2016-08-25

申请号：US15027353

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: C08L79/04 ,  H05K1/02 ,  H05K1/09 ,  C09D179/04 ,  H05K1/03

CPC classification number: C08L79/04 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/10 ,  B32B15/098 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2457/08 ,  C08G14/06 ,  C08G14/12 ,  C08K3/00 ,  C08K3/36 ,  C08K5/14 ,  C08K5/49 ,  C08K5/5399 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L71/126 ,  C08L79/085 ,  C09D179/04 ,  C09J161/34 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0355

Abstract: The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

Abstract translation: 本发明涉及无卤素树脂组合物，预浸料和由其制备的层压材料。 无卤素树脂组合物包含基于有机固体重量份的（A）40至80重量份的烯丙基改性的苯并恶嗪树脂，（B）10至20重量份的烃树脂，（C ）10〜40重量份烯丙基改性聚苯醚树脂，（D）10〜20重量份烯丙基改性双马来酰亚胺树脂，（E）0.01〜3重量份引发剂，（F） 10〜100重量份的填料，（G）0〜80重量份的含磷阻燃剂。 由无卤素树脂组合物制备的预浸料和层压材料具有较低的介电常数和介电损耗角正切值，更高的剥离强度，高玻璃化转变温度，优异的耐热性和更好的阻燃效果。