公开(公告)号：US20080094087A1

公开(公告)日：2008-04-24

申请号：US11827689

申请日：2007-07-13

Applicant: Ho-jin Lee

Inventor： Ho-jin Lee

IPC: G01R31/02 ,  G01J5/00

CPC classification number: G01R31/2891 ,  G01R31/311 ,  H01L21/681

Abstract: In a device for detecting a chip location and a method of detecting a chip location using the device, the device includes a chuck to which a wafer to be inspected is fixable, an infrared irradiation unit capable of irradiating infrared light to a target semiconductor chip of the wafer from the backside of the wafer, and a scope disposed opposite to the infrared irradiation unit with respect to the wafer. In this manner, it can be readily be determined whether the scope is aligned with a target semiconductor chip to which a probe card is connected for inspection by a backside emission method. Furthermore, the target semiconductor chip to be inspected can be readily detected among semiconductor chips viewed through the scope. Therefore, TAT (turn around time) for inspection can be largely reduced.

Abstract translation: 在用于检测芯片位置的装置和使用该装置检测芯片位置的方法中，该装置包括：待检查晶片可固定的卡盘;能够将红外光照射到目标半导体芯片的红外线照射单元 来自晶片背面的晶片和相对于晶片与红外辐射单元相对设置的镜片。 以这种方式，可以容易地确定范围是否与通过背面发射方法连接用于检查的探针卡的目标半导体芯片对准。 此外，可以在通过范围观看的半导体芯片中容易地检测要检查的目标半导体芯片。 因此，TAT（转机时间）可以大大降低。

公开(公告)号：US07346069B2

公开(公告)日：2008-03-18

申请号：US10625209

申请日：2003-07-22

Applicant: Ki-Dong Lee ,  Yong Hoon Cho ,  Ho Jin Lee

Inventor： Ki-Dong Lee ,  Yong Hoon Cho ,  Ho Jin Lee

IPC: H04L12/28

CPC classification number: H04B7/18584

Abstract: A dynamic resource allocation apparatus and method for assigning timeslot in a return channel in multi-frequency time division multiple access MF-TDMA in order to have a maximum throughput is disclosed. The apparatus includes: resource request amount collection unit for accumulating a requested resource amount corresponding to each of terminals during a super-frame period; resource request amount processing unit for dividing an accumulated requested resource amount by the number of frame pairs in a super frame and storing a sum of a result of dividing and rounding up a remain of the division to a nearest integer as a request amount of each corresponding terminal; and resource allocation unit for deciding a time slot allocated at each of terminals corresponding to a frame pair based on optimal allocation amount, which is decided based on the request amount by the requested amount processing unit.

Abstract translation: 公开了一种用于在多频时分多址MF-TDMA中的返回信道中分配时隙以便具有最大吞吐量的动态资源分配装置和方法。 该装置包括：资源请求量收集单元，用于在超帧期间累积对应于每个终端的请求资源量; 资源请求量处理单元，用于将累积的请求资源量除以超帧中的帧对的数量，并将除法和舍入结果的和除以最小整数作为每个对应的请求量 终奌站; 以及资源分配单元，用于基于由请求量处理单元基于所述请求量确定的最佳分配量来确定在与每一个对应的终端处分配的时隙。

公开(公告)号：US20060115013A1

公开(公告)日：2006-06-01

申请号：US11184592

申请日：2005-07-19

Applicant: Il Kim ,  Ho-Kyom Kim ,  Deock-Gil Oh ,  Ho-Jin Lee

Inventor： Il Kim ,  Ho-Kyom Kim ,  Deock-Gil Oh ,  Ho-Jin Lee

IPC: H04L23/02

CPC classification number: H04L27/0012

Abstract: A blind modulation classification apparatus in a satellite communication system improves performance in non-ideal communication environment having frequency error and phase error, by reducing computational burden of test statistic and possibility of numerical error of hardware, with computation of likelihood for each stage independently. The blind modulation classification apparatus includes a plurality of likelihood computing units, each for computing a likelihood value of a received baseband signal for corresponding one of a plurality of modulation schemes; a maximum selecting and setting units for selecting the maximum among the calculated likelihood values and setting a flag corresponding to the maximum to ‘1’ and the other flags to ‘0’; a plurality of flag summing-up units for summing up the flags of the plurality of the modulation schemes; and a modulation scheme selecting unit for selecting the maximum among the summed-up values and selecting the modulation scheme corresponding to the selected value.

Abstract translation: 卫星通信系统中的盲调制分类装置通过减少测试统计量的计算负担和硬件的数值误差的可能性，通过独立地计算每个阶段的可能性来提高具有频率误差和相位误差的非理想通信环境中的性能。 盲调制分类装置包括多个似然度计算单元，每个似然运算单元用于计算多个调制方案中的相应一个的接收基带信号的似然值; 最大选择和设置单位，用于在所计算的似然值中选择最大值，并将与最大值相对应的标志设置为“1”，将其他标志设置为“0”; 多个标记求和单元，用于对多个调制方案的标志进行相加; 以及调制方式选择单元，用于选择累加值中的最大值，并选择与所选值对应的调制方案。

公开(公告)号：US20060100846A1

公开(公告)日：2006-05-11

申请号：US11182133

申请日：2005-07-14

Applicant: Sang-Uk Lee ,  Jae-Hoon Kim ,  Ho-Jin Lee ,  Seong-Pal Lee

Inventor： Sang-Uk Lee ,  Jae-Hoon Kim ,  Ho-Jin Lee ,  Seong-Pal Lee

IPC: G06F9/45

CPC classification number: B64G7/00 ,  B64G1/24 ,  H04L67/38

Abstract: A hybrid-type satellite simulation system and a method thereof are disclosed. The system includes: a satellite modeling unit including a satellite model and a software model having flight dynamics and space environment data; a satellite operation unit for generating a telecommand, transmitting the telecommand to the satellite simulation system, receiving simulation result as a telemetry, analyzing the simulation result and displaying the analyzed result; a simulator kernel for managing and controlling the satellite simulation system; a TCP/IP interface processing unit for performing an interface function of TCP/IP level between the simulator kernel and a satellite onboard computer; an onboard computer interface processing unit for performing an interface function between the satellite onboard computer and the TCP/IP interface processing unit; and a satellite onboard computer including flight software for controlling a satellite.

Abstract translation: 公开了一种混合型卫星仿真系统及其方法。 该系统包括：包括卫星模型和具有飞行动力学和空间环境数据的软件模型的卫星建模单元; 用于产生遥控的卫星操作单元，向卫星仿真系统发送遥控信号，接收模拟结果作为遥测，分析仿真结果并显示分析结果; 用于管理和控制卫星仿真系统的模拟器内核; TCP / IP接口处理单元，用于在模拟器内核和机载计算机之间执行TCP / IP级别的接口功能; 车载计算机接口处理单元，用于在卫星机载计算机和TCP / IP接口处理单元之间执行接口功能; 以及包含用于控制卫星的飞行软件的卫星机载计算机。

公开(公告)号：US06684074B1

公开(公告)日：2004-01-27

申请号：US09610803

申请日：2000-07-06

Applicant: Sung Uk Hong ,  Shin Ha Kang ,  Ho Jin Lee

Inventor： Sung Uk Hong ,  Shin Ha Kang ,  Ho Jin Lee

IPC: H04Q720

CPC classification number: H04W88/08 ,  H04W16/24 ,  H04W36/18

Abstract: A switching device in a digital unit of a multi-sector base station, which uses switching elements incorporated in the digital unit and adapted to switch 3 sectors into multiple sectors, thereby being capable of implementing a multi-sector base station system allowing a softer handoff among all sectors. The switching elements are adapted to support the switching of the next channel element stage in the digital unit included in the existing 3-sector base station to implement a base station system, thereby allowing all handoff between sectors to be conducted in a softer handoff fashion while allowing all channel elements to be set for all sectors covered by the base station upon setting a traffic channel, thereby achieving an efficient allocation of channel elements. In accordance with the present invention, a 6-sector base station system is efficiently implemented in accordance with the setting of a timing capable of supporting an addition of switching elements, an operation of switching elements upon setting pilot, sync, and access channels, and an operation of switching elements upon a handoff and call setting. Since one digital unit can support 6 sectors, the overall configuration of the multi-sector base station system can be simplified and easily made.

Abstract translation: 一种多扇区基站的数字单元中的开关装置，其使用并入数字单元中的开关元件，并且适于将3个扇区切换成多个扇区，从而能够实现允许更软切换的多扇区基站系统 在所有部门之间。 开关元件适于支持包括在现有3扇区基站中的数字单元中的下一个信道单元级的切换以实现基站系统，从而允许扇区之间的所有切换以较软的切换方式进行，同时 允许在设置业务信道时为基站覆盖的所有扇区设置所有信道单元，从而实现信道单元的有效分配。 根据本发明，根据能够支持开关元件的添加的定时的设置，设置导频，同步和接入信道时的开关元件的操作，可以有效地实现6扇区基站系统，以及 在切换和呼叫设置时切换元件的操作。 由于一个数字单元可以支持6个扇区，所以可以简化和容易地实现多扇区基站系统的整体配置。

公开(公告)号：US20170110445A1

公开(公告)日：2017-04-20

申请号：US15391424

申请日：2016-12-27

Applicant: PIL-KYU KANG ,  Byung Lyul Park ,  Taeyeong Kim ,  Yeun-Sang Park ,  Dosun Lee ,  Ho-Jin Lee ,  Jinho Chun ,  JU-IL CHOI ,  Yi Koan Hong

Inventor： PIL-KYU KANG ,  Byung Lyul Park ,  Taeyeong Kim ,  Yeun-Sang Park ,  Dosun Lee ,  Ho-Jin Lee ,  Jinho Chun ,  JU-IL CHOI ,  Yi Koan Hong

IPC: H01L25/00 ,  H01L21/304 ,  H01L23/48 ,  H01L25/065 ,  H01L21/66 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/304 ,  H01L21/561 ,  H01L21/76898 ,  H01L22/32 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/08146 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor device having a chip stack and an interconnection terminal is provided. The chip stack includes a first semiconductor chip, a second semiconductor chip and a third semiconductor chip stacked on each other. The interconnection terminal is electrically coupled to the chip stack. The first semiconductor chip includes a first front surface and a first backside surface. The second semiconductor chip includes a second front surface, a second backside surface, a second circuit layer and a through-electrode which is electrically coupled to the second circuit layer and penetrates the second semiconductor chip. The third semiconductor chip includes a third front surface, a third backside surface opposite to the third front surface and a third circuit layer adjacent to the third front surface. The first front surface and the second front surface face each other. The third front surface and the second backside surface face each other.

公开(公告)号：US20150137326A1

公开(公告)日：2015-05-21

申请号：US14463645

申请日：2014-08-19

Applicant: Pil-Kyu KANG ,  Byung Lyul PARK ,  SungHee KANG ,  TAESEONG KIM ,  TAEYEONG KIM ,  KWANGJIN MOON ,  Jae-Hwa PARK ,  SUKCHUL BANG ,  Seongmin SON ,  JIN HO AN ,  Ho-Jin LEE ,  JEONGGI JIN

Inventor： Pil-Kyu KANG ,  Byung Lyul PARK ,  SungHee KANG ,  TAESEONG KIM ,  TAEYEONG KIM ,  KWANGJIN MOON ,  Jae-Hwa PARK ,  SUKCHUL BANG ,  Seongmin SON ,  JIN HO AN ,  Ho-Jin LEE ,  JEONGGI JIN

IPC: H01L23/48 ,  H01L21/311 ,  H01L21/02 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/7682 ,  H01L21/76831 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor substrate having a top surface and a bottom surface facing each other, an interlayer dielectric layer provided on the top surface of the semiconductor substrate and including an integrated circuit, an inter-metal dielectric layer provided on the interlayer dielectric layer and including at least one metal interconnection electrically connected to the integrated circuit, an upper dielectric layer disposed on the inter-metal dielectric layer, a through-electrode penetrating the inter-metal dielectric layer, the interlayer dielectric layer, and the semiconductor substrate, a via-dielectric layer surrounding the through-electrode and electrically insulating the through-electrode from the semiconductor substrate. The via-dielectric layer includes one or more air-gaps between the upper dielectric layer and the interlayer dielectric layer.

Abstract translation: 半导体器件包括具有彼此相对的顶表面和底表面的半导体衬底，设置在半导体衬底的顶表面上并且包括集成电路的层间介质层，设置在层间介电层上的金属间介电层 并且包括电连接到集成电路的至少一个金属互连，设置在金属间电介质层上的上部电介质层，贯穿金属间介电层的贯通电极，层间绝缘层和半导体基板， 所述通孔电介质层包围所述贯通电极，并且使所述通孔与所述半导体基板电绝缘。 通孔电介质层包括上电介质层和层间电介质层之间的一个或多个气隙。

公开(公告)号：US09025089B2

公开(公告)日：2015-05-05

申请号：US12948211

申请日：2010-11-17

Applicant: Ho-Jin Lee

Inventor： Ho-Jin Lee

IPC: G02F1/1335 ,  G02F1/1333 ,  G06F3/041 ,  G06F3/01

CPC classification number: G06F3/041 ,  G06F3/016

Abstract: A touch panel device in which a support portion is provided to include an actuator for generating vibration giving an excellent sense of touch without the need for a separate mounting space. To this end, the touch panel device having a front cover portion, a touch sensor unit divided into an upper transparent electrode layer and a lower transparent electrode layer, and a substrate provided under the touch sensor portion includes an actuator for delivering vibration to the front cover portion, a reinforcing portion having the actuator attached thereto to attach the actuator to the touch sensor unit, and a support portion formed on the substrate to provide an opening in a first side thereof and a closed second side, such that the actuator is inserted into and coupled to the opening and the support portion supports the actuator to deliver the vibration of the actuator to the front cover portion.

Abstract translation: 一种触摸面板装置，其中提供支撑部分以包括用于产生振动的致动器，从而具有优异的触摸感，而不需要单独的安装空间。 为此，具有前盖部分，分为上透明电极层和下透明电极层的触摸传感器单元和设置在触摸传感器部分下方的基板的触摸面板装置包括用于将振动传递到前面的致动器 覆盖部分，具有附接到其上的致动器以将致动器附接到触摸传感器单元的加强部分，以及形成在基板上的支撑部分，以在其第一侧和闭合的第二侧提供开口，使得致动器被插入 并且支撑部分支撑致动器以将致动器的振动传递到前盖部分。

公开(公告)号：US20140217322A1

公开(公告)日：2014-08-07

申请号：US13983428

申请日：2012-01-17

Applicant: Kinji Yamada ,  Ho-Jin Lee ,  Toshimitsu Kikuchi ,  Taisuke Kasahara ,  Hiromoto Katsuyama

Inventor： Kinji Yamada ,  Ho-Jin Lee ,  Toshimitsu Kikuchi ,  Taisuke Kasahara ,  Hiromoto Katsuyama

IPC: H01G11/56

CPC classification number: H01G11/56 ,  H01G11/06 ,  H01G11/62 ,  H01G11/64 ,  Y02E60/13

Abstract: A lithium-ion capacitor includes a non-aqueous electrolyte solution that includes (A) a compound represented by the following general formula (1), (B) a cyclic carbonate ester that includes at least one carbon-carbon unsaturated bond, and (C) a carboxylic ester, the non-aqueous electrolyte solution having a ratio (MB/MC) of 0.001 to 0.5, the ratio (MB/MC) being the ratio of the content (MB) (mmol/g) of the cyclic carbonate ester (B) to the content (MC) (mmol/g) of the carboxylic ester (C). Z+.[X(CN)m(Y)n]−  (1) wherein X is at least one element selected from boron, aluminum, silicon, phosphorus, and arsenic, Y is a halogen, Z is lithium or magnesium, m is an integer from 3 to 6, and n is an integer from 0 to 5, provided that m+n≧3.

Abstract translation: 锂离子电容器包括非水电解液，其包含（A）由以下通式（1）表示的化合物，（B）包含至少一个碳 - 碳不饱和键的环状碳酸酯和（C ）羧酸酯，所述非水电解质溶液的比例（MB / MC）为0.001〜0.5，所述比例（MB / MC）为所述环状碳酸酯的含量比（MB）（mmol / g） （B）至羧酸酯（C）的含量（MC）（mmol / g）。 Z +。[X（CN）m（Y）n] - （1）其中X是选自硼，铝，硅，磷和砷中的至少一种元素，Y是卤素，Z是锂或镁，m是 3〜6的整数，n为0〜5的整数，m +n≥3。

公开(公告)号：US20140124901A1

公开(公告)日：2014-05-08

申请号：US14153478

申请日：2014-01-13

Applicant: Ho-jin Lee ,  Kang-wook Lee ,  Myeong-soon Park ,  Ju-iI Choi ,  Son-kwan Hwang

Inventor： Ho-jin Lee ,  Kang-wook Lee ,  Myeong-soon Park ,  Ju-iI Choi ,  Son-kwan Hwang

IPC: H01L23/528 ,  H01L23/522

CPC classification number: H01L23/528 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/13009 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/00012

Abstract: Methods of forming an integrated circuit device include forming an interlayer dielectric layer on a first surface of a semiconductor substrate and then forming an interconnect hole that extends through the interlayer dielectric layer and into the semiconductor substrate. A first sidewall spacer layer is formed on a sidewall of the interconnect hole. The semiconductor substrate at a bottom of the interconnect hole is isotropically etched to define an undercut recess in the semiconductor substrate. This etching step is performed using the first sidewall spacer layer as an etching mask. The interconnect hole and the uncut recess are then filled with a through-via electrode. A second surface of the semiconductor substrate is removed for a sufficient duration to expose the uncut recess containing the through-via electrode.

Abstract translation: 形成集成电路器件的方法包括在半导体衬底的第一表面上形成层间电介质层，然后形成延伸穿过层间电介质层并进入半导体衬底的互连孔。 第一侧壁间隔层形成在互连孔的侧壁上。 在互连孔的底部的半导体衬底被各向同性蚀刻以在半导体衬底中限定底切凹部。 该蚀刻步骤使用第一侧壁间隔层作为蚀刻掩模进行。 然后用通孔电极填充互连孔和未切割凹部。 去除半导体衬底的第二表面足够的持续时间以露出包含通孔电极的未切割凹部。