Semiconductor device and method for manufacturing the same
    91.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08552434B2

    公开(公告)日:2013-10-08

    申请号:US13680345

    申请日:2012-11-19

    IPC分类号: H01L27/14 H01L21/00

    摘要: An object is, in a thin film transistor in which an oxide semiconductor is used as an active layer, to prevent change in composition, film quality, an interface, or the like of an oxide semiconductor region serving as an active layer, and to stabilize electrical characteristics of the thin film transistor. In a thin film transistor in which a first oxide semiconductor region is used as an active layer, a second oxide semiconductor region having lower electrical conductivity than the first oxide semiconductor region is formed between the first oxide semiconductor region and a protective insulating layer for the thin film transistor, whereby the second oxide semiconductor region serves as a protective layer for the first oxide semiconductor region; thus, change in composition or deterioration in film quality of the first oxide semiconductor region can be prevented, and electrical characteristics of the thin film transistor can be stabilized.

    摘要翻译: 在使用氧化物半导体作为有源层的薄膜晶体管中,为了防止用作有源层的氧化物半导体区域的组成,膜质量,界面等的变化,并且为了稳定化 薄膜晶体管的电气特性。 在其中使用第一氧化物半导体区域作为有源层的薄膜晶体管中,在第一氧化物半导体区域和用于薄的第一氧化物半导体区域的保护绝缘层之间形成具有比第一氧化物半导体区域低导电性的第二氧化物半导体区域 由此第二氧化物半导体区域用作第一氧化物半导体区域的保护层; 因此,可以防止第一氧化物半导体区域的组成变化或膜质量的劣化,并且能够稳定薄膜晶体管的电特性。

    Fabrication System and Manufacturing Method of Light Emitting Device
    95.
    发明申请
    Fabrication System and Manufacturing Method of Light Emitting Device 有权
    发光装置制造系统及制造方法

    公开(公告)号:US20130157400A1

    公开(公告)日:2013-06-20

    申请号:US13768387

    申请日:2013-02-15

    IPC分类号: H01L33/44

    摘要: The present invention provides a vapor deposition method and a vapor deposition system of film formation systems by which EL materials can be used more efficiently and EL materials having superior uniformity with high throughput rate are formed. According to the present invention, inside a film formation chamber, an evaporation source holder in a rectangular shape in which a plurality of containers sealing evaporation material is moved at a certain pitch to a substrate and the evaporation material is vapor deposited on the substrate. Further, a longitudinal direction of an evaporation source holder in a rectangular shape may be oblique to one side of a substrate, while the evaporation source holder is being moved. Furthermore, it is preferable that a movement direction of an evaporation source holder during vapor deposition be different from a scanning direction of a laser beam while a TFT is formed.

    摘要翻译: 本发明提供一种可以更有效地使用EL材料的成膜系统的气相沉积方法和气相沉积系统,并且形成具有高生产率的均匀性优异的EL材料。 根据本发明,在成膜室内部,将密封蒸发材料的多个容器以一定间距移动到基板上的矩形状的蒸发源保持器和蒸发材料蒸镀在基板上。 此外,蒸发源保持器的纵向方向可以在基板的一侧倾斜,同时蒸发源保持器被移动。 此外,优选的是,蒸镀源夹持器在气相沉积期间的移动方向与形成TFT的激光束的扫描方向不同。