公开(公告)号：US6049500A

公开(公告)日：2000-04-11

申请号：US153462

申请日：1998-09-15

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C5/00 ,  G11C5/02 ,  G11C5/06 ,  G11C11/34 ,  G11C11/406 ,  H01L23/485 ,  G11C8/00

CPC分类号： G11C5/025 ,  G11C11/406 ,  G11C5/063 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025

摘要： Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

公开(公告)号：US6018191A

公开(公告)日：2000-01-25

申请号：US35104

申请日：1998-03-05

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H01L23/52

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US5793099A

公开(公告)日：1998-08-11

申请号：US646031

申请日：1996-05-07

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsurou Matsumoto

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

公开(公告)号：US5092729A

公开(公告)日：1992-03-03

申请号：US602679

申请日：1990-10-24

申请人： Takashi Yamazaki ,  Toshinori Kobayashi

发明人： Takashi Yamazaki ,  Toshinori Kobayashi

IPC分类号： H01J37/20 ,  H01J37/252 ,  H01J37/30 ,  H01J37/317 ,  H01L21/027 ,  H01L21/66 ,  H01L21/677 ,  H01L21/683

CPC分类号： H01L21/67748 ,  H01L21/6831

摘要： A wafer transporting apparatus comprising at least one carrier for supporting a substantially circular thin wafer having a flat plane, the carrier including a supporting base for supporting the wafer thereon, and a electrostatic chuck provided in the supporting base and having a contacting surface which face-wise contacts the flat plane of the wafer supported on the supporting base. The electrostatic chuck attracts the wafer so that the flat plane of the wafer contacts the contacting surface of the electrostatic chuck when the electrostatic chuck is energized. A holder holds the wafer at a position which has a predetermined positional relationship with respect to the supporting base. The carrier is selectively transported between a plurality of stations including a work station, fixing device for fixing the carrier transported to the work station at a predetermined position in the work station, and an arrangement for energizing the electrostatic chuck when the carrier is fixed at the predetermined position in the work station and deenergizing the electrostatic chuck when the carrier is apart from the predetermined position.

摘要翻译： 一种晶片输送装置，包括至少一个载体，用于支撑具有平坦平面的基本上圆形的薄晶片，所述载体包括用于在其上支撑晶片的支撑基座和设置在所述支撑基座中并具有接触表面的静电卡盘， 明智地接触支撑在支撑基座上的晶片的平面。 当静电卡盘通电时，静电卡盘吸引晶片，使得晶片的平面与静电卡盘的接触表面接触。 保持器将晶片保持在相对于支撑基座具有预定位置关系的位置。 载体在包括工作站的多个站之间选择性地传送，用于固定在工作站中的预定位置处传送到工作站的载体的固定装置，以及当载体固定在工作站时使静电卡盘通电的装置 在工作站中的预定位置，并且当托架离开预定位置时静电卡盘断电。

公开(公告)号：US5068712A

公开(公告)日：1991-11-26

申请号：US409332

申请日：1989-09-19

申请人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

发明人： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/06 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/73215 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  Y10T29/49121

摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

摘要翻译： 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。 鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。 在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小 杂散容量，提高信号传输速率和减少电气噪声。

公开(公告)号：US5047346A

公开(公告)日：1991-09-10

申请号：US396421

申请日：1989-08-21

申请人： Tomoya Kitazume ,  Takashi Yamazaki ,  Hitoshi Iwatsubo

发明人： Tomoya Kitazume ,  Takashi Yamazaki ,  Hitoshi Iwatsubo

IPC分类号： C07C43/178 ,  C07C69/63 ,  C09K19/04 ,  C09K19/20 ,  C12P7/04 ,  C12P41/00

CPC分类号： C07C43/1786 ,  C07C69/63 ,  C09K19/0403 ,  C09K19/2007 ,  C12P41/004 ,  C12P7/04 ,  C09K2019/0407 ,  C09K2019/0444

摘要： 3-(2-Trifluoro-1-hydroxyethyl)propenyl benzyl ether or derivatives thereof having the formula ##STR1## wherin R is a substituted or not substituted phenyl group and a mark * shows an asymmetric carbon atom, and derivatives thereof are provided, which are useful as a material for preparing liquid crystal compound.

摘要翻译： 具有下式的3-（2-三氟-1-羟乙基）丙烯基苄基醚或其衍生物R是取代或未取代的苯基，标记*表示不对称碳原子，并提供其衍生物，其中 可用作制备液晶化合物的材料。

公开(公告)号：US4526643A

公开(公告)日：1985-07-02

申请号：US578082

申请日：1984-02-08

申请人： Haruo Okano ,  Takashi Yamazaki ,  Yasuhiro Horiike ,  Hiromichi Horie

发明人： Haruo Okano ,  Takashi Yamazaki ,  Yasuhiro Horiike ,  Hiromichi Horie

IPC分类号： H01J37/32 ,  H01J37/34 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C23F1/02

CPC分类号： H01L21/31116 ,  H01J37/32623 ,  H01J37/3408 ,  H01J37/3455

摘要： A dry etching apparatus using reactive ions is disclosed. A housing in which a workpiece is etched is provided with a cathode electrode on which the workpiece is mounted, and an anode electrode arranged opposite the cathode electrode. An etching gas is supplied to the housing, and pressure inside of the housing is held at a certain level. High frequency voltage is applied between the cathode and anode electrodes. A plurality of magnets are arranged outside of the housing to generate magnetic fields around the cathode electrode. The plurality of magnets are separated from one another, with a predetermined clearance being interposed therebetween, to form an endless track. The plurality of magnets are moved along the endless track, to thereby cause the magnetic fields to be moved in one direction on the cathode electrode.

摘要翻译： 公开了一种使用反应离子的干蚀刻装置。 在其中蚀刻工件的壳体设置有安装有工件的阴极电极和与阴极电极相对布置的阳极电极。 蚀刻气体被供给到壳体，壳体内的压力保持在一定水平。 在阴极和阳极之间施加高频电压。 多个磁体设置在外壳的外部，以在阴极周围产生磁场。 多个磁体彼此分离，其间插入预定的间隙，以形成环形轨道。 多个磁体沿着环形轨道移动，从而使得磁场在阴极上沿一个方向移动。

公开(公告)号：US10114911B2

公开(公告)日：2018-10-30

申请号：US13104495

申请日：2011-05-10

申请人： Takashi Yamazaki ,  Yoshimasa Kadooka ,  Toshiaki Hisada ,  Seiryo Sugiura ,  Takumi Washio ,  Junichi Okada

发明人： Takashi Yamazaki ,  Yoshimasa Kadooka ,  Toshiaki Hisada ,  Seiryo Sugiura ,  Takumi Washio ,  Junichi Okada

IPC分类号： G06F17/50

摘要： A fluid structure interaction simulation method includes a graph information forming process to form graph information of nodes obtained by discretizing a computing region for each of a fluid and a structure that are represented by meshes, and a main time development loop process to simulate a physical phenomenon. The loop process includes arranging IMEs (Interaction Mediating Elements) that move with a displacement of the structure, on a boundary of the structure, defining, within the IME, correcting functions of a pressure and a velocity of the fluid that interact with the pressure and the velocity of the fluid and the displacement of the structure, and executing a simulation based on the correcting functions, in a state in which the meshes of the fluid are mismatched to the meshes of the structure.

公开(公告)号：US09553554B2

公开(公告)日：2017-01-24

申请号：US14359725

申请日：2012-06-04

申请人： Masaru Kimura ,  Kohei Teramoto ,  Takashi Yamazaki ,  Takuya Taniguchi

发明人： Masaru Kimura ,  Kohei Teramoto ,  Takashi Yamazaki ,  Takuya Taniguchi

IPC分类号： H03G11/00 ,  H03G3/00 ,  H04R3/00 ,  H04R3/04 ,  H03G5/16 ,  H03G9/00 ,  H03G9/02 ,  H04R29/00

CPC分类号： H03G3/00 ,  H03G5/165 ,  H03G9/005 ,  H03G9/025 ,  H04R3/00 ,  H04R3/007 ,  H04R3/04 ,  H04R29/00 ,  H04R29/001

摘要： A signal processing device includes an excessive input estimating unit that estimates excessive input of a target signal, a controller that calculates frequency characteristics which will lessen the excessive input of the target signal from the excessive input information estimated by the excessive input estimating unit, and a frequency characteristic modification unit that modifies the frequency characteristics of the target signal in accordance with the frequency characteristics the controller calculates.

摘要翻译： 信号处理装置包括估计目标信号的过大输入的过度输入估计单元，计算能够根据由过度输入估计单元估计出的过大输入信息来减小目标信号的过度输入的频率特性的控制器，以及 频率特性修改单元，其根据控制器计算的频率特性修改目标信号的频率特性。

公开(公告)号：US20150030181A1

公开(公告)日：2015-01-29

申请号：US14373721

申请日：2012-12-14

申请人： Masaru Kimura ,  Takashi Yamazaki

发明人： Masaru Kimura ,  Takashi Yamazaki

IPC分类号： G10L21/0208 ,  G10L21/0232

CPC分类号： G10L21/0208 ,  G10L21/0232 ,  H03G5/165 ,  H03G9/005 ,  H03G9/025 ,  H04R3/04

摘要： A device includes a HPF 702 that modifies frequency characteristics of a target signal; a phase correcting unit 701 that corrects the phase characteristics of the target signal to make the phase characteristics nearly equal to phase characteristics of the HPF 702; a first multiplier 705 that adjusts the gain of the signal output from the phase correcting unit 701; a second multiplier 706 that adjusts the gain of the signal output from the HPF 702; a coefficient determining unit that determines the gain coefficients of the first and second multipliers 705 and 706 in such a manner that the sum of the gain coefficient of the first multiplier 705 and the gain coefficient of the second multiplier 706 becomes a fixed value; and an adder 713 that adds the two signals output from the first multiplier 705 and second multiplier 706.

摘要翻译： 装置包括修改目标信号的频率特性的HPF 702; 相位校正单元701，其校正目标信号的相位特性，以使相位特性几乎等于HPF 702的相位特性; 调整从相位校正单元701输出的信号的增益的第一乘法器705; 调节从HPF 702输出的信号的增益的第二乘法器706; 系数确定单元，其以第一乘法器705的增益系数和第二乘法器706的增益系数的和变为固定值的方式确定第一和第二乘法器705和706的增益系数; 以及将从第一乘法器705和第二乘法器706输出的两个信号相加的加法器713。