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    RESISTIVE COMPOSITION
    93.
    发明申请
    RESISTIVE COMPOSITION 有权
    电阻组合物

    公开(公告)号：US20170062091A1

    公开(公告)日：2017-03-02

    申请号：US15119637

    申请日：2015-08-20

    Applicant: Shoei Chemical Inc.

    Inventor： Hiroshi MASHIMA ,  Yukari MOROFUJI

    IPC: H01B1/20 ,  C03C8/02 ,  C03C8/10 ,  C03C8/04 ,  C09D5/24 ,  C03C8/16

    CPC classification number: H01B1/20 ,  C03C3/066 ,  C03C3/074 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C8/02 ,  C03C8/04 ,  C03C8/10 ,  C03C8/16 ,  C03C14/004 ,  C03C14/006 ,  C03C2214/04 ,  C03C2214/16 ,  C03C2214/30 ,  C09D5/24 ,  H01C7/003

    Abstract: An object of the present invention is to provide a resistive composition that can form a thick film resistor excluding a toxic lead component from a conductive component and glass and having characteristics equivalent to or superior to conventional resistors in terms of, in a wide resistance range, resistance values, TCR characteristics, current noise characteristics, withstand voltage characteristics and the like. The resistive composition of the present invention includes: ruthenium-based conductive particles including ruthenium dioxide; a glass frit that is essentially free of a lead component; and an organic vehicle, wherein the glass frit is a glass frit which is constituted such that in a case where a fired product of a mixture of the glass frit and the ruthenium dioxide has in a range of 1 kΩ/□ to 1 MΩ/□, the fired product exhibits a temperature coefficient of resistance in a plus range.

    Abstract translation: 本发明的目的是提供一种电阻组合物，其可以在宽电阻范围内从导电组件和玻璃形成不含有毒铅组分的厚膜电阻器，并且具有等于或优于常规电阻器的特性， 电阻值，TCR特性，电流噪声特性，耐电压特性等。 本发明的电阻组合物包括：包含二氧化钌的钌基导电颗粒; 基本上不含铅组分的玻璃料; 和有机载体，其中所述玻璃料是玻璃料，所述玻璃料的构成使得在所述玻璃料和所述二氧化钌的混合物的烧成品的浓度范围为1kΩ/□至1MΩ/□的情况下 ，烧制产品的电阻温度系数在正的范围内。

    CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME
    94.
    发明申请
    CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME 审中-公开
    芯片电阻及其制造方法

    公开(公告)号：US20170040091A1

    公开(公告)日：2017-02-09

    申请号：US15303731

    申请日：2015-03-30

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： SHOGO NAKAYAMA

    IPC: H01C1/032 ,  H01C7/00 ,  H01C1/148 ,  H01C17/00

    CPC classification number: H01C1/032 ,  H01C1/028 ,  H01C1/142 ,  H01C1/148 ,  H01C7/00 ,  H01C7/003 ,  H01C17/006 ,  H01C17/02 ,  H01C17/281

    Abstract: A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

    Abstract translation: 片状电阻器包括绝缘衬底，设置在绝缘衬底的上表面上的电阻元件，设置在电阻元件的上表面的两个端部中的相应的上表面电极上的一对上表面电极，以暴露部件 电阻元件的上表面的上表面电极，以及覆盖电阻元件的一部分并且不覆盖一对上表面电极的保护层。 一对上表面电极分别具有暴露的上表面和暴露的边缘表面。 一对上表面电极的每个边缘表面不从绝缘基板的各个边缘表面向外突出。 芯片电阻可以降低电阻的温度系数，提高电阻的温度系数。

    CHIP RESISTOR
    98.
    发明申请
    CHIP RESISTOR 有权
    芯片电阻

    公开(公告)号：US20150170804A1

    公开(公告)日：2015-06-18

    申请号：US14221822

    申请日：2014-03-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Hun CHO ,  Young Key Joo Kim ,  Chang Ho Lee ,  Byung Sung Kang

    IPC: H01C1/148 ,  H01C1/012

    CPC classification number: H01C7/003 ,  H01C7/18 ,  H01C17/006 ,  H01C17/06526 ,  H01C17/06533

    Abstract: A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.

    Abstract translation: 芯片电阻器可以包括：具有堆叠在其中的多个基板的主体; 多个电阻器，其形成在主体中，各自的基板插入其间并通过主体的两个端面露出; 以及分别覆盖主体的两个端面的第一和第二电极，并且分别连接到暴露的电阻器的两个端部。

    LAMINATE-TYPE CERAMIC ELECTRONIC COMPONENT
    99.
    发明申请
    LAMINATE-TYPE CERAMIC ELECTRONIC COMPONENT 有权
    层压型陶瓷电子元件

    公开(公告)号：US20150055273A1

    公开(公告)日：2015-02-26

    申请号：US14462244

    申请日：2014-08-18

    Applicant: TDK CORPORATION

    Inventor： Makoto ENDO ,  Koichi YAMAGUCHI ,  Keisuke ISHIDA

    IPC: H01G2/14 ,  H01G4/12 ,  H01G4/30

    CPC classification number: H01G4/1227 ,  H01C7/003 ,  H01C7/008 ,  H01C7/1006 ,  H01C7/18 ,  H01G4/30

    Abstract: A laminate-type ceramic electric component such as laminated ceramic capacitor which has excellent mechanical strength and also has thermal shock resistance at the same time is provided. A laminate-type ceramic electronic component comprises an inner layer part, in which dielectric layers comprising ABO3 (which represents a perovskite crystal in which A contains at least Ba and B contains at least Ti) as a main component and internal electrode layers are alternately laminated; and a pair of outer layer parts which sandwich the inner layer part, wherein the outer layer parts comprise a continuous film containing a Ba—Si—Ti—O based crystal phase.

    Abstract translation: 提供了具有优异的机械强度并且同时具有耐热冲击性的层压陶瓷电气部件，例如层压陶瓷电容器。 叠层型陶瓷电子部件包括：内层部，其中包含ABO 3（其中A含有至少Ba和B含有至少Ti的钙钛矿晶体）作为主要成分的电介质层和内部电极层交替层压 ; 以及夹着内层部的一对外层部，其中，外层部包含含有Ba-Si-Ti-O系结晶相的连续膜。

    Power resistor with integrated heat spreader
    100.
    发明授权
    Power resistor with integrated heat spreader 有权
    带集成散热器的功率电阻

    公开(公告)号：US08823483B2

    公开(公告)日：2014-09-02

    申请号：US13725018

    申请日：2012-12-21

    Applicant: Clark Smith ,  Todd Wyatt

    Inventor： Clark Smith ,  Todd Wyatt

    IPC: H01C1/14

    CPC classification number: H01C1/084 ,  H01C1/14 ,  H01C1/148 ,  H01C7/003 ,  H01C17/28 ,  Y10T29/49082 ,  Y10T29/49101

    Abstract: An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination.

    Abstract translation: 集成组件包括电阻器和散热器。 电阻器包括电阻元件和端子。 散热器与电阻器集成，并且包括导热和电绝缘材料的散热器和导热材料的端子并且位于散热器的边缘处。 电阻元件的顶表面的至少一部分与散热器导热接触。 每个电阻端子与散热器的相应端子进行导热接触。 一种制造电阻器和散热器的集成组件的方法包括形成散热器，形成电阻器，以及通过将电阻元件的顶表面的至少一部分接合到散热器而将散热器接合到电阻器 并将每个导电端子接合到相应的端接件。

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