Wafer-scale X-ray detector and method of manufacturing the same
    101.
    发明授权
    Wafer-scale X-ray detector and method of manufacturing the same 有权
    晶圆级X射线检测器及其制造方法

    公开(公告)号:US08482108B2

    公开(公告)日:2013-07-09

    申请号:US13109435

    申请日:2011-05-17

    IPC分类号: H01L31/115

    摘要: A wafer-scale x-ray detector and a method of manufacturing the same are provided. The wafer-scale x-ray detector includes: a seamless silicon substrate electrically connected to a printed circuit substrate; a chip array having a plurality of pixel pads formed on a central region thereof and a plurality of pin pads formed at edges thereof on the seamless silicon substrate; a plurality of pixel electrodes formed to correspond to the pixel pads; vertical wirings and horizontal wirings formed to compensate a difference of regions expanded towards the pixel electrodes from the pixel pads between the chip array and the pixel electrodes; a redistribution layer having an insulating layer to separate the vertical wirings and the horizontal wirings; and a photoconductor layer and a common electrode which cover the pixel electrodes on the redistribution layer.

    摘要翻译: 提供了晶片级X射线检测器及其制造方法。 晶片级x射线检测器包括:电连接到印刷电路衬底的无缝硅衬底; 芯片阵列,其具有形成在其中心区域上的多个像素焊盘和在其无端硅衬底上的边缘处形成的多个焊盘; 形成为对应于所述像素焊盘的多个像素电极; 垂直布线和水平布线形成以补偿从芯片阵列和像素电极之间的像素焊盘向像素电极扩展的区域的差异; 再分布层,具有用于分离垂直布线和水平布线的绝缘层; 以及覆盖再分布层上的像素电极的感光体层和公共电极。

    Transistors, methods of manufacturing a transistor, and electronic devices including a transistor
    102.
    发明授权
    Transistors, methods of manufacturing a transistor, and electronic devices including a transistor 有权
    晶体管,制造晶体管的方法以及包括晶体管的电子器件

    公开(公告)号:US08461597B2

    公开(公告)日:2013-06-11

    申请号:US12805648

    申请日:2010-08-11

    IPC分类号: H01L29/786

    摘要: Transistors, methods of manufacturing a transistor, and electronic devices including a transistor are provided, the transistor includes a channel layer, a source and a drain respectively contacting opposing ends of the channel layer, a gate corresponding to the channel layer, a gate insulating layer between the channel layer and the gate, and a first passivation layer and a second passivation layer sequentially disposed on the gate insulating layer. The first passivation layer covers the source, the drain, the gate, the gate insulating layer and the channel layer. The second passivation layer includes fluorine (F).

    摘要翻译: 提供晶体管,制造晶体管的方法和包括晶体管的电子器件,晶体管包括沟道层,分别接触沟道层的相对端的源极和漏极,对应于沟道层的栅极,栅极绝缘层 在沟道层和栅极之间,以及顺序地设置在栅极绝缘层上的第一钝化层和第二钝化层。 第一钝化层覆盖源极,漏极,栅极,栅极绝缘层和沟道层。 第二钝化层包括氟(F)。

    Oxide semiconductor transistors and methods of manufacturing the same
    103.
    发明授权
    Oxide semiconductor transistors and methods of manufacturing the same 有权
    氧化物半导体晶体管及其制造方法

    公开(公告)号:US08399882B2

    公开(公告)日:2013-03-19

    申请号:US12801500

    申请日:2010-06-11

    IPC分类号: H01L29/12

    CPC分类号: H01L29/7869

    摘要: Transistors and methods of manufacturing the same. A transistor may be an oxide thin film transistor (TFT) with a self-aligned top gate structure. The transistor may include a gate insulating layer between a channel region and a gate electrode that extends from two sides of the gate electrode. The gate insulating layer may cover at least a portion of source and drain regions.

    摘要翻译: 晶体管及其制造方法。 晶体管可以是具有自对准顶栅结构的氧化物薄膜晶体管(TFT)。 晶体管可以包括从栅电极的两侧延伸的沟道区和栅电极之间的栅极绝缘层。 栅绝缘层可以覆盖源区和漏区的至少一部分。

    Inverter, method of manufacturing the same, and logic circuit including the inverter
    104.
    发明授权
    Inverter, method of manufacturing the same, and logic circuit including the inverter 有权
    逆变器及其制造方法以及包括逆变器的逻辑电路

    公开(公告)号:US08383472B2

    公开(公告)日:2013-02-26

    申请号:US13067306

    申请日:2011-05-24

    IPC分类号: H01L21/336

    摘要: Provided are an inverter, a method of manufacturing the inverter, and a logic circuit including the inverter. The inverter may include a first transistor and a second transistor having different channel layer structures. A channel layer of the first transistor may include a lower layer and an upper layer, and a channel layer of the second transistor may be the same as one of the lower layer and the upper layer. At least one of the lower layer and the upper layer may be an oxide layer. The inverter may be an enhancement/depletion (E/D) mode inverter or a complementary inverter.

    摘要翻译: 提供逆变器,逆变器的制造方法以及包括逆变器的逻辑电路。 反相器可以包括具有不同沟道层结构的第一晶体管和第二晶体管。 第一晶体管的沟道层可以包括下层和上层,并且第二晶体管的沟道层可以与下层和上层之一相同。 下层和上层中的至少一层可以是氧化物层。 逆变器可以是增强/耗尽型(E / D)型逆变器或互补型逆变器。

    Non-volatile memory device and method of manufacturing the same
    105.
    发明授权
    Non-volatile memory device and method of manufacturing the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US08357992B2

    公开(公告)日:2013-01-22

    申请号:US12659516

    申请日:2010-03-11

    IPC分类号: H01L23/52 H01L29/00

    摘要: The non-volatile memory device may include a substrate, a plurality of first signal lines on the substrate in a vertical direction, a plurality of memory cells having ends connected to the plurality of first signal lines, a plurality of second signal lines perpendicular to the plurality of first signal lines on the substrate and each connected to other ends of the plurality of memory cells, and a plurality of selection elements on the substrate and connected to at least two of the plurality of first signal lines.

    摘要翻译: 非易失性存储器件可以包括衬底,在垂直方向上的衬底上的多个第一信号线,具有连接到多个第一信号线的端部的多个存储器单元,垂直于第一信号线的多个第二信号线 基板上的多个第一信号线,并且各自连接到多个存储单元的另一端,以及多个选择元件,并且连接到多个第一信号线中的至少两个。

    Large-Scale X-Ray Detectors
    106.
    发明申请
    Large-Scale X-Ray Detectors 有权
    大型X射线探测器

    公开(公告)号:US20120223241A1

    公开(公告)日:2012-09-06

    申请号:US13212759

    申请日:2011-08-18

    IPC分类号: H01L27/146 G01T1/24 G01T1/16

    摘要: An X-ray detector including a plurality of chips on a printed circuit board, each of the plurality of chips including a plurality of pixel pads on a center portion of the printed circuit board and a plurality of pin pads surrounding the plurality of pixel pads, a plurality of pixel electrodes on and corresponding to the plurality of chips, a redistribution layer electrically connecting the plurality of pixel electrodes and the plurality of pixel pads, a plurality of first electrode pads on a surface opposite to a surface of the plurality of chips including the plurality of pin pads, a wire electrically connecting the plurality of first electrode pads and the plurality of pin pads, a photoconductor on the plurality of pixel electrodes, and a common electrode on the photoconductor.

    摘要翻译: 一种在印刷电路板上包括多个芯片的X射线检测器,所述多个芯片中的每一个包括印刷电路板的中心部分上的多个像素焊盘和围绕所述多个像素焊盘的多个焊盘, 在多个芯片上并对应于多个芯片的多个像素电极,将多个像素电极和多个像素焊盘电连接的再分配层,在与多个芯片的表面相反的表面上的多个第一电极焊盘,包括 所述多个针焊盘,电连接所述多个第一电极焊盘和所述多个焊盘的导线,所述多个像素电极上的光电导体以及所述光电导体上的公共电极。

    Channel layers and semiconductor devices including the same
    107.
    发明授权
    Channel layers and semiconductor devices including the same 有权
    通道层和包括其的半导体器件

    公开(公告)号:US08232551B2

    公开(公告)日:2012-07-31

    申请号:US12458491

    申请日:2009-07-14

    IPC分类号: H01L29/26

    CPC分类号: H01L29/7869 H01L29/78696

    摘要: Channel layers and semiconductor devices including the channel layers are disclosed. A channel layer may include a multi-layered structure. Layers forming the channel layer may have different carrier mobilities and/or carrier densities. The channel layer may have a double layered structure including a first layer and a second layer which may be formed of different oxides. Characteristics of the transistor may vary according to materials used to form the channel layers and/or thicknesses thereof.

    摘要翻译: 公开了包括沟道层的通道层和半导体器件。 沟道层可以包括多层结构。 形成沟道层的层可具有不同的载流子迁移率和/或载流子密度。 沟道层可以具有双层结构,其包括可由不同氧化物形成的第一层和第二层。 晶体管的特性可以根据用于形成沟道层的材料和/或其厚度而变化。

    Heterojunction diode, method of manufacturing the same, and electronic device including the heterojunction diode
    108.
    发明授权
    Heterojunction diode, method of manufacturing the same, and electronic device including the heterojunction diode 有权
    异质结二极管及其制造方法以及包含异质结二极管的电子器件

    公开(公告)号:US08227872B2

    公开(公告)日:2012-07-24

    申请号:US12591917

    申请日:2009-12-04

    IPC分类号: H01L29/76 H01L29/732

    摘要: Example embodiments relate to a heterojunction diode, a method of manufacturing the heterojunction diode, and an electronic device including the heterojunction diode. The heterojunction diode may include a first conductive type non-oxide layer and a second conductive type oxide layer bonded to the non-oxide layer. The non-oxide layer may be a Si layer. The Si layer may be a p++ Si layer or an n++ Si layer. A difference in work functions of the non-oxide layer and the oxide layer may be about 0.8-1.2 eV. Accordingly, when a forward voltage is applied to the heterojunction diode, rectification may occur. The heterojunction diode may be applied to an electronic device, e.g., a memory device.

    摘要翻译: 示例实施例涉及异质结二极管,制造异质结二极管的方法,以及包括异质结二极管的电子器件。 异质结二极管可以包括结合到非氧化物层的第一导电型非氧化物层和第二导电型氧化物层。 非氧化物层可以是Si层。 Si层可以是p ++ Si层或n ++ Si层。 非氧化物层和氧化物层的功函数差可以为约0.8-1.2eV。 因此,当向异质结二极管施加正向电压时,可能发生整流。 异质结二极管可以被施加到电子设备,例如存储器件。