公开(公告)号：US07939944B2

公开(公告)日：2011-05-10

申请号：US12843279

申请日：2010-07-26

申请人： Chien-Ko Liao ,  Chin-Tien Chiu ,  Jack Chang Chien ,  Cheeman Yu ,  Hem Takiar

发明人： Chien-Ko Liao ,  Chin-Tien Chiu ,  Jack Chang Chien ,  Cheeman Yu ,  Hem Takiar

IPC分类号： H01L23/48

CPC分类号： H01L23/49833 ,  H01L23/525 ,  H01L24/48 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1438 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.

摘要翻译： 公开了具有再分配层的半导体器件及其形成方法。 在晶片上制造半导体管芯之后，将带组件施加到与晶片上的每个半导体管芯的表面接触的晶片表面上。 带组件包括作为基底层的后研磨带，以及粘附到后研磨带的胶片组件。 膜组件又包括粘附膜，其上沉积有导电材料的薄层。 使用例如激光器将再分布层图案追踪到带组件中。 此后，可以去除带组件的未加热部分，在每个半导体管芯上留下加热的再分布层图案。

公开(公告)号：US20100055847A1

公开(公告)日：2010-03-04

申请号：US12614960

申请日：2009-11-09

申请人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

发明人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

IPC分类号： H01L21/56

CPC分类号： G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

公开(公告)号：US20080128879A1

公开(公告)日：2008-06-05

申请号：US11679094

申请日：2007-02-26

申请人： Hem Takiar ,  Shrikar Bhagath ,  Chin-Tien Chiu ,  Ong King Hoo

发明人： Hem Takiar ,  Shrikar Bhagath ,  Chin-Tien Chiu ,  Ong King Hoo

IPC分类号： H01L25/065

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85186 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and second semiconductor die are separated by a low profile intermediate adhesive layer in which the wire bond loops from the first semiconductor die are embedded. After the intermediate layer is applied, the second semiconductor die may be stacked on top of the intermediate layer. A dielectric layer may be formed on a back surface of the second semiconductor die. As the back side of the second semiconductor die is an electrical insulator, the intermediate layer need not space the wire bond loops from the second semiconductor die as in the prior art, and the apex of bond wires may come into contact with the dielectric layer. The intermediate layer may thus be made thinner in comparison to conventional stacked semiconductor die configurations.

摘要翻译： 公开了一种低剖面半导体封装，其包括至少安装到衬底的第一和第二层叠半导体管芯。 第一半导体管芯和第二半导体管芯由嵌入第一半导体管芯的引线接合环路的低剖面中间粘合剂层分开。 在施加中间层之后，第二半导体管芯可以堆叠在中间层的顶部上。 可以在第二半导体管芯的后表面上形成电介质层。 由于第二半导体管芯的背面是电绝缘体，所以如现有技术那样，中间层不需要与第二半导体管芯的引线接合环空间，并且接合线的顶点可能与介电层接触。 因此，与传统的堆叠半导体管芯配置相比，中间层可以被制成更薄。

公开(公告)号：US20070132066A1

公开(公告)日：2007-06-14

申请号：US11301715

申请日：2005-12-13

申请人： Hem Takiar ,  Ken Wang ,  Chih-Chin Liao ,  Han-Shiao Chen

发明人： Hem Takiar ,  Ken Wang ,  Chih-Chin Liao ,  Han-Shiao Chen

IPC分类号： H01L23/544

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L23/49838 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/0052 ,  H05K2201/09263 ,  H01L2924/00

摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

摘要翻译： 公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。 通过减小相邻封装轮廓之间的边界的宽度，在半导体封装的衬底面板上获得额外的空间。

公开(公告)号：US20070032101A1

公开(公告)日：2007-02-08

申请号：US11536974

申请日：2006-09-29

申请人： Edwin Cuellar ,  Eliyahou Harari ,  Robert Miller ,  Hem Takiar ,  Robert Wallace

发明人： Edwin Cuellar ,  Eliyahou Harari ,  Robert Miller ,  Hem Takiar ,  Robert Wallace

IPC分类号： H01R12/00

CPC分类号： G06K19/077 ,  G06K19/072 ,  G06K19/07732 ,  G06K19/07733 ,  G06K19/07741 ,  H05K1/117

摘要： Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A sleeve that is moveable by hand may be included to expose the set of contacts being used.

摘要翻译： 封闭的可重新编程的非易失性存储卡包括至少两组电触点，内部存储器与之连接。 两组触点具有不同的图案，优选地根据两种不同的接触标准，例如存储卡标准和通用串行总线（USB）的标准。 可以遵循的一种存储卡标准是安全数字（SD）卡的标准。 因此，这些卡可以与与一组联系而不是另一组相容的不同主机使用。 可以包括可手动移动的套筒以暴露所使用的一组触点。

公开(公告)号：US20070004094A1

公开(公告)日：2007-01-04

申请号：US11171095

申请日：2005-06-30

申请人： Hem Takiar ,  Shrikar Bhagath ,  Ken Wang

发明人： Hem Takiar ,  Shrikar Bhagath ,  Ken Wang

IPC分类号： H01L21/58

CPC分类号： H01L23/49855 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0271 ,  H05K2201/09681 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.

摘要翻译： 公开了用于半导体封装的衬底的表面上的虚拟电路图案，该虚拟电路图案包括直线段，其长度受到控制，以便不在所述线段内产生高于所需应力的应力。 虚拟电路图案可以由线或邻接的或间隔开的多边形（例如六边形）形成。 虚拟电路图案的部分也可以形成为随机选择的取向，尺寸和位置。

公开(公告)号：USD533556S1

公开(公告)日：2006-12-12

申请号：US29208280

申请日：2004-06-24

申请人： Hiroyuki Yamada ,  Yutaka Nakamura ,  Hiroyuki Sakamoto ,  Hem Takiar ,  Robert Miller

设计人： Hiroyuki Yamada ,  Yutaka Nakamura ,  Hiroyuki Sakamoto ,  Hem Takiar ,  Robert Miller

公开(公告)号：US20060267173A1

公开(公告)日：2006-11-30

申请号：US11140608

申请日：2005-05-26

申请人： Hem Takiar ,  Shrikar Bhagath ,  Ken Ming Wang

发明人： Hem Takiar ,  Shrikar Bhagath ,  Ken Ming Wang

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Improved techniques for stacking integrated circuit dies within an integrated circuit package are disclosed. These improved techniques allow greater stacking density of integrated circuit dies within an integrated circuit package. Additionally, the improved stacking techniques permit conventional bonding techniques for electrical connection of the various integrated circuit dies to each other or to a substrate. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit dies within integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit dies arranged in a stack.

摘要翻译： 公开了用于在集成电路封装内堆叠集成电路管芯的改进的技术。 这些改进的技术允许集成电路封装内的集成电路管芯的堆叠密度更高。 此外，改进的堆叠技术允许用于将各种集成电路管芯彼此或与衬底电连接的常规焊接技术。 这些改进的方法对于在集成电路封装内堆叠相同尺寸（并且通常是相同功能的）集成电路管芯特别有用。 这种集成电路封装的一个例子是非易失性存储器集成电路封装，其包含堆叠地布置的多个相同大小的存储器集成电路管芯。

公开(公告)号：US20050230484A1

公开(公告)日：2005-10-20

申请号：US10826801

申请日：2004-04-16

申请人： Edwin Cuellar ,  Eliyahou Harari ,  Robert Miller ,  Hem Takiar ,  Robert Wallace

发明人： Edwin Cuellar ,  Eliyahou Harari ,  Robert Miller ,  Hem Takiar ,  Robert Wallace

IPC分类号： G06K19/077 ,  H05K1/11 ,  G06K19/06

CPC分类号： G06K19/077 ,  G06K19/072 ,  G06K19/07732 ,  G06K19/07733 ,  G06K19/07741 ,  H05K1/117

摘要： Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A sleeve that is moveable by hand may be included to expose the set of contacts being used.

摘要翻译： 封闭的可重新编程的非易失性存储卡包括至少两组电触点，内部存储器与之连接。 两组触点具有不同的图案，优选地根据两种不同的接触标准，例如存储卡标准和通用串行总线（USB）的标准。 可以遵循的一种存储卡标准是安全数字（SD）卡的标准。 因此，这些卡可以与与一组联系而不是另一组相容的不同主机使用。 可以包括可手动移动的套筒以暴露所使用的一组触点。

公开(公告)号：US20050148217A1

公开(公告)日：2005-07-07

申请号：US10995989

申请日：2004-11-23

申请人： Hem Takiar ,  Michael Patterson

发明人： Hem Takiar ,  Michael Patterson

IPC分类号： G06K19/077 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H01R12/00

CPC分类号： G06K19/07732 ,  G06K13/0825 ,  G06K19/077 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/02 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2203/0271 ,  Y10T29/4913 ,  H01L2924/00014

摘要： The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.

摘要翻译： 大致描述的本发明涉及一种小型存储卡，其包括允许存储卡更容易由用户处理的特征。 在各种实施例中，存储卡可以包括倒角和/或凸起部分，其允许存储卡被人的手（或机械装置）更容易地抓住，并且还提供额外的空间以存储诸如电容器和/ 或电阻。 因为不同的电子设备使用不同类型的存储卡，所以提供了一种适配器，其允许本文所公开的存储卡被用在用于其他类型的存储卡的电子设备上的端口或连接器中。