公开(公告)号：US20050148217A1

公开(公告)日：2005-07-07

申请号：US10995989

申请日：2004-11-23

申请人： Hem Takiar ,  Michael Patterson

发明人： Hem Takiar ,  Michael Patterson

IPC分类号： G06K19/077 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H01R12/00

CPC分类号： G06K19/07732 ,  G06K13/0825 ,  G06K19/077 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/02 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2203/0271 ,  Y10T29/4913 ,  H01L2924/00014

摘要： The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.

摘要翻译： 大致描述的本发明涉及一种小型存储卡，其包括允许存储卡更容易由用户处理的特征。 在各种实施例中，存储卡可以包括倒角和/或凸起部分，其允许存储卡被人的手（或机械装置）更容易地抓住，并且还提供额外的空间以存储诸如电容器和/ 或电阻。 因为不同的电子设备使用不同类型的存储卡，所以提供了一种适配器，其允许本文所公开的存储卡被用在用于其他类型的存储卡的电子设备上的端口或连接器中。

公开(公告)号：US20060261454A1

公开(公告)日：2006-11-23

申请号：US11133576

申请日：2005-05-19

申请人： Hem Takiar ,  Robert Miller ,  Warren Middlekauff ,  Michael Patterson ,  Shrikar Bhagath

发明人： Hem Takiar ,  Robert Miller ,  Warren Middlekauff ,  Michael Patterson ,  Shrikar Bhagath

IPC分类号： H01L23/02

CPC分类号： G06K19/07745 ,  G06K19/07732 ,  G11C5/04 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/0052 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

摘要翻译： 一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。 集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。 集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。

公开(公告)号：US09337153B2

公开(公告)日：2016-05-10

申请号：US14008457

申请日：2011-12-16

申请人： Peng Fu ,  Shan Luo ,  Zhong Lu ,  Kaiyou Qian ,  Chin Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Ye Bai

发明人： Peng Fu ,  Shan Luo ,  Zhong Lu ,  Kaiyou Qian ,  Chin Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Ye Bai

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/433 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.

摘要翻译： 公开了一种包括屏蔽电磁辐射和/或耗散热的金属层的存储器件，以及制造存储器件的方法。 金属层形成在金属层转移组件上。 将金属层转移组件和未封装的存储器件放置在模具中并封装。 在模塑料的包封和固化期间，金属层从屏蔽转移到封装的存储器件。

公开(公告)号：US08947883B2

公开(公告)日：2015-02-03

申请号：US11965691

申请日：2007-12-27

申请人： Suresh Upadhyayula ,  Robert C. Miller ,  Hem Takiar ,  Steven Sprouse ,  Ka Ian Yung

发明人： Suresh Upadhyayula ,  Robert C. Miller ,  Hem Takiar ,  Steven Sprouse ,  Ka Ian Yung

IPC分类号： H05K7/00 ,  G06K19/077 ,  H01L23/00

CPC分类号： H01L21/02 ,  G06K19/07732 ,  G06K19/07735 ,  G06K19/07743 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/85 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T29/41 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

摘要翻译： 公开了一种低调USB闪存设备及其形成方法。 USB闪存设备包括集成电路存储器部分和USB连接器。 存储器部分和USB连接器可以整体地形成在同一基板上。 USB闪存设备包括一个基板，在该基板上安装有一个或多个闪存芯片，控制器芯片，无源元件和LED，用于指示何时访问存储器。 与使用安装在印刷电路板上的TSOP封装的现有技术的USB存储器装置相比，本发明的半导体管芯被固定到衬底上并以SIP构造接合。 省略封装的TSOP封装允许减少USB闪存设备的总体厚度。

公开(公告)号：US08659133B2

公开(公告)日：2014-02-25

申请号：US13220354

申请日：2011-08-29

申请人： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

发明人： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

IPC分类号： H01L23/48 ,  H01L29/66

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

摘要翻译： 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。

公开(公告)号：US08637978B2

公开(公告)日：2014-01-28

申请号：US13235781

申请日：2011-09-19

申请人： Hem Takiar ,  Robert C. Miller ,  Warren Middlekauff ,  Michael W. Patterson ,  Shrikar Bhagath

发明人： Hem Takiar ,  Robert C. Miller ,  Warren Middlekauff ,  Michael W. Patterson ,  Shrikar Bhagath

IPC分类号： H01L23/12 ,  H01L23/02

CPC分类号： G06K19/07745 ,  G06K19/07732 ,  G11C5/04 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/0052 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

公开(公告)号：US08461675B2

公开(公告)日：2013-06-11

申请号：US11301715

申请日：2005-12-13

申请人： Hem Takiar ,  Ken Jian Ming Wang ,  Chih-Chin Liao ,  Han-Shiao Chen

发明人： Hem Takiar ,  Ken Jian Ming Wang ,  Chih-Chin Liao ,  Han-Shiao Chen

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L23/49838 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/0052 ,  H05K2201/09263 ,  H01L2924/00

摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

摘要翻译： 公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。 通过减小相邻封装轮廓之间的边界的宽度，在用于半导体封装的衬底面板上获得额外的空间。

公开(公告)号：US20130006564A1

公开(公告)日：2013-01-03

申请号：US13634068

申请日：2010-10-04

申请人： Didier Chavet ,  Cheeman Yu ,  Hem Takiar ,  Frank Lu ,  Chih-Chiang Tung ,  Jiaming Shi

发明人： Didier Chavet ,  Cheeman Yu ,  Hem Takiar ,  Frank Lu ,  Chih-Chiang Tung ,  Jiaming Shi

IPC分类号： G06F19/00 ,  H01L29/02

CPC分类号： H01L23/544 ,  H01L21/67294 ,  H01L22/12 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device.

摘要翻译： 公开了一种用于通过识别包括在半导体器件中的分立组件（裸片，衬底和/或无源）的方法来提供向后和向前可追溯性的系统。 本技术还包括用于产生唯一标识符和标记半导体器件的系统，该半导体器件具有能够使半导体器件以及该器件内的分立器件被跟踪并通过每个工艺进行跟踪并在半导体生产中测试的唯一标识符 设备。

公开(公告)号：US08318535B2

公开(公告)日：2012-11-27

申请号：US11769942

申请日：2007-06-28

申请人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

发明人： Ning Ye ,  Robert C. Miller ,  Cheemen Yu ,  Hem Takiar ,  Andre McKenzie

IPC分类号： H01L21/00

CPC分类号： H01L21/50 ,  B82Y10/00 ,  G11C29/1201 ,  G11C29/48 ,  H01L23/5388 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K1/117 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/10159 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

摘要翻译： 公开了一种由多模组件形成的便携式存储卡及其制造方法。 一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。 如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD TM卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。

公开(公告)号：US20120146247A1

公开(公告)日：2012-06-14

申请号：US13265666

申请日：2011-06-08

申请人： Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian ,  Rahav Yairi

发明人： Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian ,  Rahav Yairi

IPC分类号： H01L23/28

CPC分类号： G06K19/07732 ,  H01L2924/0002 ,  H05K5/0278 ,  H01L2924/00

摘要： A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of a curable fluid such as glue or ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.

摘要翻译： 公开了一种记录装置，其包括至少一个经过预处理的表面以粗糙化表面，以便在表面上更好地粘附可固化流体例如胶水或油墨。 存储器件的表面可以通过用激光在表面上刻划线或者通过用粒子喷射器形成离散的变形来预处理。 在封装过程中，通过在模板上提供粗糙图案也可以使表面粗糙化。 在另外的实施例中，表面可以被化学预处理以使表面粗糙化和/或增加表面的粘附能。