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    ACTIVATION SOLUTION FOR ELECTROLESS PLATING ON DIELECTRIC LAYERS
    102.
    发明申请
    ACTIVATION SOLUTION FOR ELECTROLESS PLATING ON DIELECTRIC LAYERS 审中-公开
    用于电介质层上电镀的激活解决方案

    公开(公告)号：US20090162681A1

    公开(公告)日：2009-06-25

    申请号：US12334460

    申请日：2008-12-13

    申请人： Artur KOLICS

    发明人： Artur KOLICS

    IPC分类号： B32B15/04 ,  B05D5/12 ,  B01J31/12

    CPC分类号： B01J31/1633 ,  B01J31/1805 ,  B01J2231/60 ,  B01J2231/62 ,  B01J2531/824 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/31 ,  H01L21/288 ,  H01L21/76874

    摘要： Presented is a solution to activate an oxide surface for electroless deposition of a metal. The solution comprises a binding agent having at least one functional group capable of forming a chemical bond with the oxide surface and at least one functional group capable of forming a chemical bond with a catalyst. Also present are methods of fabricating electronic devices and electronic devices fabricated using the method.

    摘要翻译： 提出了激活金属的无电沉积的氧化物表面的解决方案。 溶液包含具有至少一个能够与氧化物表面形成化学键的官能团和至少一个能够与催化剂形成化学键的官能团的结合剂。 还存在使用该方法制造电子器件和电子器件的方法。

    Stabilization and Performance of Autocatalytic Electroless Processes
    104.
    发明申请
    Stabilization and Performance of Autocatalytic Electroless Processes 审中-公开
    自动催化无电极工艺的稳定性和性能

    公开(公告)号：US20080206474A1

    公开(公告)日：2008-08-28

    申请号：US11791512

    申请日：2005-12-13

    申请人： Anders Remgard

    发明人： Anders Remgard

    IPC分类号： B05D1/18 ,  B32B15/04 ,  C04B41/51

    CPC分类号： C23C18/1675 ,  C23C18/1601 ,  C23C18/1651 ,  C23C18/1882 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  C23C18/54 ,  Y10T428/31678

    摘要： Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties. The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents.

    摘要翻译： 公开了一种使用自催化无电解镀液将金属镀金的方法，其中浴在其浊点温度以上运行，使得浴中存在至少两相。 还描述了用于涂覆银金属的自催化无电镀浴。 还公开了一种将银金属直接自动电镀到硅表面上而不需要中间金属层的方法。 获得的银的沉积物是均匀的，无孔的并且具有电性能。 该技术可以应用于不同的方法和浴制剂，即不同的金属，络合剂和还原剂。

    Plating pretreatment agent and metal plating method using the same
    106.
    发明授权
    Plating pretreatment agent and metal plating method using the same 有权
    电镀预处理剂及使用其的金属电镀方法

    公开(公告)号：US06780467B2

    公开(公告)日：2004-08-24

    申请号：US10169894

    申请日：2002-07-08

    申请人： Toru Imori

    发明人： Toru Imori

    IPC分类号： B06D310

    CPC分类号： C23C18/1879 ,  C23C18/1882 ,  C23C18/34 ,  C23C18/40 ,  H05K3/181 ,  H05K3/389 ,  H05K2203/1157 ,  H05K2203/124

    摘要： The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.

    摘要翻译： 本发明提供一种金属电镀方法，即使在难以施加化学镀的材料上也能以良好的方式进行无电解电镀以及该方法的预处理剂。 将待镀敷的物品用预处理剂处理，所述预处理剂是通过在其分子中混合具有金属捕获官能团的硅烷偶联剂的溶液和含有在沉积镀层中显示催化活性的金属的溶液而制备的 金属如铜，镍等从化学镀溶液涂覆到待镀制品的表面上，以使上述金属被上述硅烷偶联剂捕获，然后加入还原剂。 之后，进行化学镀，使得在上述预处理物品的表面上形成金属薄膜。 然后，可以进行所需的金属电镀。

    Electroless deposition method
    108.
    发明申请
    Electroless deposition method 有权
    无电沉积法

    公开(公告)号：US20030189026A1

    公开(公告)日：2003-10-09

    申请号：US10117712

    申请日：2002-04-03

    发明人： Deenesh Padhi ,  Joseph Yahalom ,  Sivakami Ramanathan ,  Chris R. McGuirk ,  Srinivas Gandikota ,  Girish Dixit

    IPC分类号： B05D003/10 ,  B05D001/36 ,  B05D001/18

    CPC分类号： H01L21/02074 ,  C23C18/1694 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1851 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/1893 ,  C23C18/31 ,  C23C18/34 ,  C23C18/36 ,  C23C18/50 ,  H01L21/02068 ,  H01L21/28518 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76874 ,  H01L2221/1089

    摘要： Methods and apparatus are provided for forming a metal or metal suicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.

    摘要翻译： 提供了通过无电沉积技术形成金属或金属硅化物层的方法和装置。 在一个方面，提供了一种用于处理衬底的方法，包括在衬底表面上沉积起始层，清洁衬底表面，以及通过将引发层暴露于无电镀溶液而在引发层上沉积导电材料。 该方法可以进一步包括用酸性溶液蚀刻衬底表面并在沉积起始层之前清洁酸性溶液的衬底。 起始层可以通过将基材表面暴露于贵金属化学电解溶液或含硼烷溶液来形成。 导电材料可以用含硼烷的还原剂沉积。 导电材料可以用作钝化层，阻挡层，种子层，或用于形成金属硅化物层。

    Pretreating agent for metal plating
    109.
    发明申请
    Pretreating agent for metal plating 有权
    金属电镀预处理剂

    公开(公告)号：US20020192379A1

    公开(公告)日：2002-12-19

    申请号：US10169894

    申请日：2002-07-08

    发明人： Toru Imori

    IPC分类号： B05D003/10

    CPC分类号： C23C18/1879 ,  C23C18/1882 ,  C23C18/34 ,  C23C18/40 ,  H05K3/181 ,  H05K3/389 ,  H05K2203/1157 ,  H05K2203/124

    摘要： The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.

    摘要翻译： 本发明提供一种金属电镀方法，即使在难以施加化学镀的材料上也能以良好的方式进行无电解电镀以及该方法的预处理剂。 将待镀敷的物品用预处理剂处理，所述预处理剂是通过在其分子中混合具有金属捕获官能团的硅烷偶联剂的溶液和含有在沉积镀层中显示催化活性的金属的溶液而制备的 金属如铜，镍等从化学镀溶液涂覆到待镀制品的表面上，以使上述金属被上述硅烷偶联剂捕获，然后加入还原剂。 之后，进行化学镀，使得在上述预处理物品的表面上形成金属薄膜。 然后，可以进行所需的金属电镀。