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公开(公告)号:US11944013B2
公开(公告)日:2024-03-26
申请号:US17447937
申请日:2021-09-17
发明人: Heng Wu , Dimitri Houssameddine , Huai Huang , Tianji Zhou
IPC分类号: H10N50/01 , G11C11/16 , H01L21/768 , H01L23/522 , H10B61/00 , H10N50/10 , H10N50/80 , H10N50/85
CPC分类号: H10N50/01 , G11C11/161 , H01L21/76802 , H01L21/76883 , H01L23/5226 , H10B61/00 , H10N50/10 , H10N50/80 , H10N50/85
摘要: A second BEOL layer including a via dielectric layer surrounding a via including an upper metal stud and a lower metal stud separated by a liner, and a magnetic tunnel junction (MTJ) stack aligned above the via. A first back end of line (BEOL) layer including a BEOL dielectric layer surrounding a BEOL metal layer, a second BEOL layer including a via dielectric layer surrounding a via including an upper metal stud and a lower metal stud separated by a liner, a magnetic tunnel junction (MTJ) stack aligned above the via. Forming a via dielectric layer as a second back end of line (BEOL) layer, an opening, a lower metal stud in the opening, a liner on the lower metal stud and on exposed side surfaces of the opening, an upper metal stud in remaining portions of the opening, and forming a magnetic tunnel junction (MTJ) stack aligned above.
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公开(公告)号:US20240098961A1
公开(公告)日:2024-03-21
申请号:US17949579
申请日:2022-09-21
发明人: Min Gyu Sung , Ruilong Xie , Heng Wu , Julien Frougier
IPC分类号: H01L27/11
CPC分类号: H01L27/1108
摘要: An integrated circuit structure includes a memory cell and multiple transistors therein. The multiple transistors are formed using channels including a stack having alternating layers of conductive semiconductor material and layers of other material that are insulative. Two or more of the multiple transistors have a same number of layers of the conductive semiconductor material in corresponding channel regions but have different numbers of active layers and inactive layers of the conductive semiconductor material. An active layer is a layer forming a channel in the channel region that is electrically coupled to S/D regions in a corresponding transistor, while a floating layer is a layer in the channel region electrically isolated from the S/D regions in the corresponding transistor. Methods for forming the integrated circuit structure are disclosed.
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公开(公告)号:US20240088241A1
公开(公告)日:2024-03-14
申请号:US17941248
申请日:2022-09-09
发明人: Ruilong Xie , Julien Frougier , Min Gyu Sung , Heng Wu
IPC分类号: H01L29/417 , H01L23/522 , H01L27/088 , H01L29/06 , H01L29/423 , H01L29/786
CPC分类号: H01L29/41775 , H01L23/5226 , H01L27/088 , H01L29/0673 , H01L29/42392 , H01L29/78696
摘要: A semiconductor structure includes a first source/drain contact disposed between a first gate structure and a second gate structure, a dielectric cap disposed on the first source/drain contact, and a first gate contact disposed over the dielectric cap. The first gate contact connects the first gate structure with the second gate structure.
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公开(公告)号:US20240087630A1
公开(公告)日:2024-03-14
申请号:US17931464
申请日:2022-09-12
发明人: Heng Wu , Krishna Thangaraj , Eric Raymond Evarts
IPC分类号: G11C11/16
CPC分类号: G11C11/1677 , G11C11/1673 , G11C11/1693
摘要: Embodiments are disclosed for a system that includes a data scrubbing circuit, a magnetoresistive random access memory (MRAM) having a memory array, and an analog persistent vital information circuit (APVIC) that performs a method. The method includes resetting weights corresponding to blocks of the memory array. The method further includes adjusting the weights based on a timer, data accesses on the memory blocks, and weight change values corresponding to the weights. The method also includes determining, in response to the timer, a data scrubbing threshold based on ambient temperature and magnetic field strength. The method additionally includes determining one of the weights meets the data scrubbing threshold. Further, the method includes providing, in response to the determination, an indication that a data scrubber, scrub one of the memory blocks corresponding to the weight that meets the data scrubbing threshold. Also, the method includes resetting the weight.
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公开(公告)号:US11894423B2
公开(公告)日:2024-02-06
申请号:US17677007
申请日:2022-02-22
发明人: Heng Wu , Dechao Guo , Ruqiang Bao , Junli Wang , Lan Yu , Reinaldo Vega , Adra Carr
IPC分类号: H01L29/06 , H01L21/02 , H01L29/66 , H01L29/78 , H01L29/165 , H01L27/088 , H01L21/8234 , H01L29/08
CPC分类号: H01L29/0673 , H01L21/02532 , H01L21/02603 , H01L21/823412 , H01L21/823418 , H01L21/823431 , H01L21/823437 , H01L21/823468 , H01L27/0886 , H01L29/0847 , H01L29/165 , H01L29/6656 , H01L29/6681 , H01L29/66545 , H01L29/66553 , H01L29/7851
摘要: Techniques are provided to fabricate semiconductor devices having a nanosheet field-effect transistor device disposed on a semiconductor substrate. The nanosheet field-effect transistor device includes a nanosheet stack structure including a semiconductor channel layer and a source/drain region in contact with an end portion of the semiconductor channel layer of the nanosheet stack structure. A trench formed in the source/drain region is filled with a metal-based material. The metal-based material filling the trench in the source/drain region mitigates the effect of source/drain material overfill on the contact resistance of the semiconductor device.
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公开(公告)号:US20230418504A1
公开(公告)日:2023-12-28
申请号:US17809184
申请日:2022-06-27
发明人: Krishna Thangaraj , Heng Wu , Eric Raymond Evarts
IPC分类号: G06F3/06
CPC分类号: G06F3/0653 , G06F3/0616 , G06F3/0679 , G06F12/0802
摘要: A memory system for storage access monitoring is provided. The memory system includes a media controller of a memory. An analog persistent circuit is coupled to the media controller and configured to monitor access to the memory. The analog persistent circuit stores persistent data related to memory access counts access signals from the command/address bus. A command/address bus is coupled to the analog persistent circuit. A memory array is communicatively coupled to the command address and the media controller.
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公开(公告)号:US20230387295A1
公开(公告)日:2023-11-30
申请号:US18232510
申请日:2023-08-10
发明人: Chen Zhang , Ruilong Xie , Heng Wu , Junli Wang , Brent A. Anderson
IPC分类号: H01L29/78 , H01L27/12 , H01L23/528 , H01L21/762 , H01L29/51 , H01L21/84 , H01L29/66 , H01L29/417
CPC分类号: H01L29/7827 , H01L27/1203 , H01L23/5286 , H01L21/76224 , H01L29/517 , H01L21/84 , H01L29/66666 , H01L29/41775
摘要: A semiconductor device is provided. The semiconductor device includes a buried power rail, a buried oxide (BOX) layer formed on the buried power rail, a plurality of channel fins formed on the BOX layer, a bottom epitaxial layer formed on the BOX layer and between the channel fins such that the BOX layer is between the buried power rail and the bottom epitaxial layer, a gate stack formed over the bottom epitaxial layer and contacting the channel fins, the gate stack including a work function metal (WFM) layer and a high-x layer, and a top epitaxial layer formed on the gate stack. In the semiconductor device, between two adjacent ones of the channel fins the BOX layer has an opening so that the bottom epitaxial layer is electrically connected to the buried power rail.
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公开(公告)号:US11830946B2
公开(公告)日:2023-11-28
申请号:US17671080
申请日:2022-02-14
发明人: Heng Wu , Shogo Mochizuki , Gen Tsutsui , Kangguo Cheng
IPC分类号: H01L29/78 , H01L29/66 , H01L29/417 , H01L21/8238 , H01L21/8234 , H10B63/00
CPC分类号: H01L29/785 , H01L21/823487 , H01L21/823885 , H01L29/41791 , H01L29/66795 , H01L29/7827 , H10B63/34
摘要: A method of forming a vertical transport fin field effect transistor device is provided. The method includes forming vertical fins on a substrate, depositing a protective liner on the sidewalls of the vertical fins, and removing a portion of the substrate to form a support pillar beneath at least one of the vertical fins. The method further includes etching a cavity in the support pillar of the at least one of the vertical fins, and removing an additional portion of the substrate to form a plinth beneath the support pillar of the vertical fin. The method further includes growing a bottom source/drain layer on the substrate adjacent to the plinth, and forming a diffusion plug in the cavity, wherein the diffusion plug is configured to block diffusion of dopants from the bottom source/drain layer above a necked region in the support pillar.
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公开(公告)号:US20230309324A1
公开(公告)日:2023-09-28
申请号:US17705320
申请日:2022-03-26
发明人: Heng Wu , Tenko Yamashita , Sanjay C. Mehta , Junli Wang
IPC分类号: H01L27/24
CPC分类号: H01L27/2436
摘要: A high density memory apparatus includes a plurality of transistors vertically stacked on top of each other. The plurality of transistors share a common source structure, but each of the plurality of transistors has its own horizontal nanosheet and gate stack that are separate from respective horizontal channel structures and gate stacks of the others of the plurality of transistors. Ends of the nanosheets distal from the gate stacks are doped to act as drains for the transistors. Each of a plurality of two-terminal memory units is electrically connected to the drain end of a corresponding one of the nanosheets. Some embodiments achieve in excess of 5000 memory bits/square micrometer (μm2); in some embodiments, in excess of 6000 bits/μm2.
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公开(公告)号:US20230307452A1
公开(公告)日:2023-09-28
申请号:US17656553
申请日:2022-03-25
发明人: Ruilong Xie , Julien Frougier , Nicolas Jean Loubet , Junli Wang , Ruqiang Bao , Min Gyu Sung , Heng Wu , Oleg Gluschenkov
IPC分类号: H01L27/092 , H01L23/528 , H01L29/78 , H01L29/06 , H01L29/423 , H01L29/786 , H01L21/8238 , H01L29/66
CPC分类号: H01L27/0922 , H01L23/528 , H01L27/0924 , H01L29/785 , H01L29/0665 , H01L29/42392 , H01L29/78696 , H01L21/823807 , H01L21/823821 , H01L21/823871 , H01L29/66795 , H01L29/66742
摘要: A semiconductor device includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer of the semiconductor device includes a standard-gate field-effect transistor. The second semiconductor layer of the semiconductor device includes an extended-gate field-effect transistor. The first semiconductor layer and the second semiconductor layer are formed on top of one another.
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