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公开(公告)号:US10746788B2
公开(公告)日:2020-08-18
申请号:US16296052
申请日:2019-03-07
Applicant: STMicroelectronics S.r.l.
Inventor: Alberto Pagani
Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
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公开(公告)号:US10715216B2
公开(公告)日:2020-07-14
申请号:US16272675
申请日:2019-02-11
Applicant: STMicroelectronics S.r.l.
Inventor: Alberto Pagani
IPC: H04B5/00 , H02J50/12 , H02J50/40 , H02J7/02 , H02J50/70 , H01F38/14 , H01L23/538 , H01L23/64 , H01L23/66 , H01L25/065 , H01Q1/22 , H01Q7/00 , H01Q1/27 , H01Q1/52 , H02J50/10 , A61B5/00
Abstract: A smart button for use in a network formed on a garment includes a housing and an antenna carried within the housing to communicate with elements of the network. A functional element is carried within the housing. An electronic circuit is carried within the housing and coupled to the antenna and the at least one functional element. The housing is formed by a stem carrying a head, and the antenna is housed within the head.
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123.
公开(公告)号:US20190072676A1
公开(公告)日:2019-03-07
申请号:US16174016
申请日:2018-10-29
Applicant: STMicroelectronics S.r.l.
Inventor: Sara Loi , Alberto Pagani
Abstract: A process for manufacturing an optical system includes forming a first hydrophobic surface at a semiconductor substrate, providing a first drop of transparent material having a first shape on the first hydrophobic surface, and allowing the first drop to harden to form a first optical element having the first shape. The optical system may be a particle detector, and the process may optionally further include forming a light source at the semiconductor substrate configured to generate a light beam that passes through the first optical element and a cavity to a photodetector.
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公开(公告)号:US20190011484A1
公开(公告)日:2019-01-10
申请号:US16130536
申请日:2018-09-13
Applicant: STMicroelectronics S.r.l.
Inventor: Alberto Pagani
IPC: G01R3/00 , G01R1/073 , G01R31/319 , G01R1/067
Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.
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公开(公告)号:US20180174964A1
公开(公告)日:2018-06-21
申请号:US15892467
申请日:2018-02-09
Applicant: STMicroelectronics S.r.l.
Inventor: Alberto Pagani
IPC: H01L23/522 , G01R31/302 , H01L23/66 , G01R31/315
CPC classification number: H01L23/5227 , G01R31/3025 , G01R31/315 , H01L23/66 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2224/4813 , H01L2224/48137 , H01L2224/48139 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/8592 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
Abstract: A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.
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公开(公告)号:US10001453B2
公开(公告)日:2018-06-19
申请号:US14781104
申请日:2014-03-28
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Alberto Pagani , Bruno Murari
CPC classification number: G01N27/223 , G01N17/04
Abstract: An integrated electronic device 1 for detecting at least one parameter related to humidity and/or presence of water and/or acidity/basicity of an environment surrounding the device is described. Such device 1 comprises a separation layer 14 from the surrounding environment, comprising at least one portion of insulating material 14, and further comprises a first conductive member 11 and a second conductive member 12, made of an electrically conductive material, arranged inside the separation layer 14, with respect to the surrounding environment, and separated from the surrounding environment by the separation layer 14. The device 1 also comprises a measurement module 15, having two measurement terminals 151, 152, electrically connected with the first 11 and the second 12 conductive members, respectively; the measurement module 15 is configured to provide an electric potential difference between the first 11 and the second 12 conductive members. The device 1 further comprises electrode means 13, configured to act as an electrode, arranged outside of the separation layer 14, with respect to the first 11 and the second 12 conductive members; the electrode means 13 are arranged so as to form, with the first 11 and the second 12 conductive members, an electromagnetic circuit having an electromagnetic circuit overall impedance variable based upon the exposure to environmental conditions with a variable level of humidity and/or acidity/basicity. The measurement module 15 is configured to measure the electromagnetic circuit overall impedance, which is present between the measurement terminals 151, 152, and to determine the at least one parameter to be detected, based on the overall impedance measured.
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127.
公开(公告)号:US20180166403A1
公开(公告)日:2018-06-14
申请号:US15889852
申请日:2018-02-06
Applicant: STMicroelectronics S.r.l.
Inventor: Federico Giovanni Ziglioli , Alberto Pagani
IPC: H01L23/64 , H01L21/768 , H01L21/50 , H01L49/02 , H01L21/441 , H01L23/495
CPC classification number: H01L23/642 , H01L21/441 , H01L21/50 , H01L21/561 , H01L21/768 , H01L23/3128 , H01L23/48 , H01L23/49537 , H01L23/49551 , H01L23/49575 , H01L23/49805 , H01L23/49822 , H01L23/5385 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L28/40 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/07802 , H01L2924/00
Abstract: A packaged semiconductor device includes an insulating material forming a side surface of the packaged semiconductor device. An integrated-circuit chip is embedded in the insulating material and includes a communication circuit. A wiring system is embedded in the insulating material and electrically couples the integrated-circuit chip with a plurality of package contact elements. A first communication pad is formed in the side surface and is operatively coupled to the communication circuit to enable signal exchange through the first communication pad.
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公开(公告)号:US20180113168A1
公开(公告)日:2018-04-26
申请号:US15848996
申请日:2017-12-20
Applicant: STMicroelectronics S.r.l.
Inventor: Alberto Pagani
IPC: G01R31/28
CPC classification number: G01R31/2891 , B06B2201/00 , C12Q1/00 , C12Q2304/00 , C12Q2326/00 , G01N1/00 , G01R1/06794 , G01R11/00 , G01R31/2884 , H01L21/00 , H01L22/34 , H01L2221/00 , H01L2924/00
Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
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129.
公开(公告)号:US20180102353A1
公开(公告)日:2018-04-12
申请号:US15839501
申请日:2017-12-12
Applicant: STMicroelectronics S.r.l.
Inventor: Alberto Pagani
IPC: H01L27/02 , H05K1/18 , H01L21/683 , H01L25/065 , H01L23/00 , H01L23/66 , H01L23/48 , H01L23/31 , H01L21/768 , H01L25/10 , H01L23/498 , H01L21/66 , H01L21/56
CPC classification number: H01L27/0203 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/768 , H01L22/22 , H01L23/3128 , H01L23/48 , H01L23/49833 , H01L23/66 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/09 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/94 , H01L24/95 , H01L25/0657 , H01L25/105 , H01L2221/68304 , H01L2221/68327 , H01L2221/6834 , H01L2223/6677 , H01L2224/0231 , H01L2224/02313 , H01L2224/02319 , H01L2224/02321 , H01L2224/02371 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/06187 , H01L2224/08137 , H01L2224/08146 , H01L2224/12105 , H01L2224/13024 , H01L2224/14183 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2105 , H01L2224/211 , H01L2224/28105 , H01L2224/29024 , H01L2224/30183 , H01L2224/32145 , H01L2224/32227 , H01L2224/45015 , H01L2224/45099 , H01L2224/48 , H01L2224/48091 , H01L2224/48175 , H01L2224/73207 , H01L2224/73215 , H01L2224/73251 , H01L2224/82106 , H01L2224/94 , H01L2224/95 , H01L2225/06531 , H01L2225/06541 , H01L2225/06555 , H01L2225/06565 , H01L2225/06568 , H01L2225/06572 , H01L2225/06596 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/00014 , H01L2924/12042 , H01L2924/15159 , H01L2924/207 , H05K1/181 , H05K1/189 , H05K2201/10515 , Y02P70/611 , H01L2224/02 , H01L2224/08 , H01L2224/16 , H01L2224/32 , H01L2224/19 , H01L2924/00
Abstract: An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.
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公开(公告)号:US20180052066A1
公开(公告)日:2018-02-22
申请号:US15783894
申请日:2017-10-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Alberto Pagani , Bruno Murari , Marco Ferrera , Domenico Giusti , Daniele Caltabiano
Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.
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