公开(公告)号：US09997554B2

公开(公告)日：2018-06-12

申请号：US14582758

申请日：2014-12-24

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel Grebet ,  Wee Chin Judy Lim

IPC: H01L27/146 ,  H04N5/225 ,  G02B5/20

CPC classification number: H01L27/14625 ,  G02B5/208 ,  H01L27/14618 ,  H01L2224/16225 ,  H04N5/2253

Abstract: One or more embodiments disclosed herein are directed to a chip scale package camera module that includes a glass interposer between a lens and an image sensor. In some embodiments, the glass interposer is made from one or more layers of optical quality glass and includes an infrared filter coating. The glass interposer also includes electrically conductive paths to connect the image sensor, mounted on one side of the glass interposer, with other components such as capacitors, which may be mounted on a different side of the glass interposer, and the rest of the camera system. The conductive layers include traces and vias that are formed in the glass interposer in areas away from the path of light in the camera module, such that the traces and vias do not block the light between the lens and the image sensor.

公开(公告)号：US09972557B2

公开(公告)日：2018-05-15

申请号：US14567070

申请日：2014-12-11

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

公开(公告)号：US09918667B2

公开(公告)日：2018-03-20

申请号：US14200828

申请日：2014-03-07

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian ,  Calvin Leung

IPC: G01N27/327 ,  A61B5/1473 ,  A61B5/145 ,  A61B5/1468

CPC classification number: A61B5/1473 ,  A61B5/14532 ,  A61B5/1468 ,  G01N27/3272

Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.

公开(公告)号：US09810653B2

公开(公告)日：2017-11-07

申请号：US14334572

申请日：2014-07-17

Applicant: STMicroelectronics Pte Ltd

Inventor： Ravi Shankar ,  Olivier Le Neel ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/12

CPC classification number: G01N27/12 ,  G01N27/123 ,  G01N27/125 ,  G01N27/128

Abstract: Miniature resistive gas detectors incorporate thin films that can selectively identify specific gases when heated to certain characteristic temperatures. A solid state gas sensor module is disclosed that includes a gas sensor, a heater, and a temperature sensor, stacked over an insulating recess. The insulating recess is partially filled with a support material that provides structural integrity. The solid state gas sensor module can be integrated on top of an ASIC on a common substrate. With sufficient thermal insulation, such a gas detector can be provided as a low-power component of mobile electronic devices such as smart phones. A method of operating a multi-sensor array allows detection of relative concentrations of different gas species by either using dedicated sensors, or by thermally tuning the sensors to monitor different gas species.

公开(公告)号：US09754916B2

公开(公告)日：2017-09-05

申请号：US15297948

申请日：2016-10-19

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/78 ,  H01L21/48 ,  H01L23/495 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L23/29

CPC classification number: H01L24/92 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49513 ,  H01L23/49575 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0569 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/43 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.

公开(公告)号：US09671671B2

公开(公告)日：2017-06-06

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wee Chin Judy Lim ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  G02F1/35 ,  B23K1/00 ,  B23K101/38

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

公开(公告)号：US09598278B2

公开(公告)日：2017-03-21

申请号：US14679906

申请日：2015-04-06

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Olivier Le Neel ,  Tien Choy Loh

IPC: H01L29/84 ,  H01L27/14 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B2203/0127

Abstract: The present disclosure is directed to a device that includes a substrate and a sensor formed on the substrate. The sensor includes a chamber formed from a plurality of integrated cavities, a membrane above the substrate, the membrane having a plurality of openings, each opening positioned above one of the cavities, and a plurality of diamond shaped anchors positioned between the membrane and the substrate, the anchors positioned between each of the cavities. A center of each opening is also a center of one of the cavities.

公开(公告)号：US09576912B1

公开(公告)日：2017-02-21

申请号：US14957865

申请日：2015-12-03

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi Ma ,  Kim-Yong Goh ,  Xueren Zhang

IPC: H01L23/12 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0391 ,  H01L2224/05008 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/94 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2224/023 ,  H01L2924/07025

Abstract: A wafer level chip scale package (WLCSP) includes a semiconductor substrate, a back end of line (BEOL) layer on the semiconductor substrate and having a peripheral edge recessed inwardly from an adjacent peripheral edge of the semiconductor substrate. A first dielectric layer is over the BEOL layer and wraps around the peripheral edge of the BEOL layer. A redistribution layer is over the first dielectric layer and a second dielectric layer is over the redistribution layer.

Abstract translation: 晶片级芯片级封装（WLCSP）包括半导体衬底，半导体衬底上的后端（BEOL）层，并且具有从半导体衬底的相邻外围边缘向内凹陷的外围边缘。 第一电介质层在BEOL层上方并且缠绕在BEOL层的外围边缘周围。 再分布层在第一介电层上方，第二介电层位于再分布层上。

公开(公告)号：US09524866B2

公开(公告)日：2016-12-20

申请号：US14957141

申请日：2015-12-02

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Chong Jieh Chew

IPC: H01L21/76 ,  H01L21/02 ,  H01L21/033 ,  H01L21/311

CPC classification number: H01L21/02252 ,  H01L21/02129 ,  H01L21/02274 ,  H01L21/02321 ,  H01L21/02334 ,  H01L21/0234 ,  H01L21/033 ,  H01L21/31144

Abstract: A method for making semiconductor devices may include forming a phosphosilicate glass (PSG) layer on a semiconductor wafer, with the PSG layer having a phosphine residual surface portion. The method may further include exposing the phosphine residual surface portion to a reactant plasma to integrate at least some of the phosphine residual surface portion into the PSG layer. The method may additionally include forming a mask layer on the PSG layer after the exposing.

公开(公告)号：US09455292B2

公开(公告)日：2016-09-27

申请号：US14741561

申请日：2015-06-17

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48095 ,  H01L2224/73265

Abstract: An image sensing device may include an interconnect layer, an image sensor IC coupled to the interconnect layer and having an image sensing surface, and an IR filter aligned with the image sensing surface opposite the interconnect layer. The image sensing device may include a flexible interconnect layer aligned with the interconnect layer and having a flexible substrate extending laterally outwardly from the interconnect layer, and electrically conductive traces on the flexible substrate. The image sensing device may also include solder bodies coupling the interconnect layer and the flexible interconnect layer and also defining a gap between the interconnect layer and the flexible interconnect layer.

Abstract translation: 图像感测装置可以包括互连层，耦合到互连层并具有图像感测表面的图像传感器IC和与互连层相对的图像感测表面对准的IR滤光器。 图像感测装置可以包括与互连层对准的柔性互连层，并且具有从互连层横向向外延伸的柔性衬底以及柔性衬底上的导电迹线。 图像感测装置还可以包括耦合互连层和柔性互连层并且还限定互连层和柔性互连层之间的间隙的焊料体。