公开(公告)号：US07705245B2

公开(公告)日：2010-04-27

申请号：US11530344

申请日：2006-09-08

申请人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

发明人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K1/113 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/025 ,  H05K3/064 ,  H05K3/244 ,  H05K3/386 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0156 ,  H05K2203/0733 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.

摘要翻译： 电子器件基板由薄板加强基板形成; 叠层在所述加强基板上的外部连接布线层，并且包括设置在所述加强基板上的电绝缘体，形成在所述电绝缘体中的开口，设置在所述开口中的第一导体图案和通孔导体，并且彼此一体地形成 ; 以及第二导体图案，其形成在与所述加强基板的所述电绝缘体的相对侧上，并且至少部分地电连接到所述通孔导体。

公开(公告)号：US20090323299A1

公开(公告)日：2009-12-31

申请号：US12553815

申请日：2009-09-03

申请人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

发明人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： H05K7/00 ,  H05K3/46

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/06 ,  H05K3/243 ,  H05K3/284 ,  H05K2203/0156 ,  H05K2203/0571 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.

摘要翻译： 一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。 基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。

公开(公告)号：US20060225918A1

公开(公告)日：2006-10-12

申请号：US11376556

申请日：2006-03-16

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K7/00 ,  H05K3/30

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US07939935B2

公开(公告)日：2011-05-10

申请号：US11701337

申请日：2007-02-01

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： H01L23/12 ,  H01L23/053

CPC分类号： H05K3/4652 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/112 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205 ,  H05K3/244 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0264 ,  H05K2203/0376 ,  H05K2203/0733 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A core substrate-less electronic device is fabricated by using an electronic device substrate 10. The electronic device substrate 10 a metal core substrate 11, and an external connection wiring layer 100 provided on the metal core substrate 11, and an electronic parts-mounting layer 110 provided on the external connection wiring layer 100. The external connection wiring layer 100 has a first plating film 103 as an external connection terminal, and a PSR film 101 as an electrical insulating material. The electronic parts-mounting layer 110 has a conductive film 113 as an internal conductor pattern and a PSR film 111 as an electrical insulating material. A surface of the conductive film 113 is in a same plane as a surface of the PSR film 111.

摘要翻译： 通过使用电子器件基板10制造无芯基板电子器件。电子器件基板10，金属芯基板11和设置在金属芯基板11上的外部连接布线层100以及电子部件安装层 设置在外部连接布线层100上。外部连接布线层100具有作为外部连接端子的第一镀膜103和作为电绝缘材料的PSR膜101。 电子部件安装层110具有作为内部导体图案的导电膜113和作为电绝缘材料的PSR膜111。 导电膜113的表面与PSR膜111的表面在同一平面内。

公开(公告)号：US07681310B2

公开(公告)日：2010-03-23

申请号：US11255025

申请日：2005-10-21

申请人： Akira Chinda ,  Nobuaki Miyamoto

发明人： Akira Chinda ,  Nobuaki Miyamoto

IPC分类号： H01K3/10

CPC分类号： H05K3/427 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/421 ,  H05K2201/0352 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method is provided for fabricating a double-sided wiring board for mounting an electronic component thereon having metal wiring patterns formed both on upper and lower sides of an electrically-insulating board. The metal wiring patterns are electrically connected each other through a through-hole and/or a blind via-hole. The method has the steps of: laminating a metal layer with a support substrate on at least one side of the electrically-insulating board; removing the support substrate from the metal layer so that the metal layer is left on the electrically-insulating board; and forming the through-hole and/or the blind via-hole in the electrically-insulating board.

摘要翻译： 提供了一种制造用于安装其上的电子部件的双面布线板的方法，其上形成有电绝缘板的上侧和下侧上的金属布线图案。 金属布线图案通过通孔和/或盲孔通过电连接。 该方法具有以下步骤：在电绝缘板的至少一侧上层叠具有支撑基板的金属层; 从金属层移除支撑基板，使得金属层留在电绝缘板上; 以及在电绝缘板中形成通孔和/或盲通孔。

公开(公告)号：US20070268675A1

公开(公告)日：2007-11-22

申请号：US11701337

申请日：2007-02-01

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/4652 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/112 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205 ,  H05K3/244 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0264 ,  H05K2203/0376 ,  H05K2203/0733 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A core substrate-less electronic device is fabricated by using an electronic device substrate 10. The electronic device substrate 10 a metal core substrate 11, and an external connection wiring layer 100 provided on the metal core substrate 11, and an electronic parts-mounting layer 110 provided on the external connection wiring layer 100. The external connection wiring layer 100 has a first plating film 103 as an external connection terminal, and a PSR film 101 as an electrical insulating material. The electronic parts-mounting layer 110 has a conductive film 113 as an internal conductor pattern and a PSR film 111 as an electrical insulating material. A surface of the conductive film 113 is in a same plane as a surface of the PSR film 111.

摘要翻译： 通过使用电子器件基板10制造无芯基板的电子器件。 电子器件基板10，金属芯基板11和设置在金属芯基板11上的外部连接布线层100以及设置在外部连接布线层100上的电子部件安装层110。 外部连接布线层100具有作为外部连接端子的第一镀膜103和作为电绝缘材料的PSR膜101。 电子部件安装层110具有作为内部导体图案的导电膜113和作为电绝缘材料的PSR膜111。 导电膜113的表面与PSR膜111的表面在同一平面内。

公开(公告)号：US20070034519A1

公开(公告)日：2007-02-15

申请号：US11544720

申请日：2006-10-10

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Manoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Manoru Mita

IPC分类号： C25D5/02

CPC分类号： H05K3/423 ,  H01L2924/0002 ,  H05K3/0023 ,  H05K3/025 ,  H05K3/108 ,  H05K3/386 ,  H05K3/421 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0733 ,  H01L2924/00

摘要： On both surfaces of an electric insulating material 1, a surface conductive layer 2A and a back surface conductive layer 2B are formed by transcription. Further, a via hole 5 penetrating through the surface conductive layer 2A and the electric insulating material 1 is provided. After forming a photosensitive plating resist pattern 14, the via hole 5 is filled with a copper plating filler 15, and the surface wiring layer 9A and the back surface wiring layer 9B are formed. Thereafter, the photosensitive plating resist pattern 14 as well as the surface conductive layer 2A and the back surface conductive layer 2B provided under the photosensitive plating resist pattern 14 are removed to fabricate a double-sided wiring board 11.

摘要翻译： 在电绝缘材料1的两面，通过转印形成表面导电层2A和背面导电层2B。 此外，设置穿过表面导电层2A和电绝缘材料1的通孔5。 在形成感光电镀抗蚀剂图案14之后，通孔5填充有镀铜填料15，并且形成表面布线层9A和背面布线层9B。 此后，除去设置在感光电镀抗蚀剂图案14下面的感光电镀抗蚀剂图案14以及表面导电层2A和背面导电层2B，以制造双面布线板11。

公开(公告)号：US20060275771A1

公开(公告)日：2006-12-07

申请号：US10551867

申请日：2004-03-31

申请人： Hideyuki Suzuki ,  Nobuaki Miyamoto ,  Taro Takumura ,  Daisuke Nishida

发明人： Hideyuki Suzuki ,  Nobuaki Miyamoto ,  Taro Takumura ,  Daisuke Nishida

IPC分类号： C12Q1/68 ,  G01N33/53 ,  G06F19/00

CPC分类号： G01N21/6408 ,  G01N21/6428 ,  G01N2021/6441

摘要： A method of detecting a fluorescent molecule in a test sample, the following steps: (a) a step of measuring in a time-dependent manner individual fluorescence intensities of a plurality of species of fluorescent molecules each having an inherent fluorescence lifetime; and (b) a step of comparing the measured fluorescence intensities.

摘要翻译： 一种检测试样中的荧光分子的方法，其特征在于以下步骤：（a）以时间依赖的方式测定各种具有固有荧光寿命的多种荧光分子的荧光强度的步骤; 和（b）比较测量的荧光强度的步骤。

公开(公告)号：US4402931A

公开(公告)日：1983-09-06

申请号：US383332

申请日：1982-05-28

申请人： Isao Tanabe ,  Ryoichi Nagata ,  Toru Watanabe ,  Nobuaki Miyamoto

发明人： Isao Tanabe ,  Ryoichi Nagata ,  Toru Watanabe ,  Nobuaki Miyamoto

IPC分类号： C01G45/02 ,  H01M4/50 ,  C01G45/00 ,  C01B31/24

CPC分类号： C01G45/02 ,  H01M4/50 ,  C01P2004/03 ,  C01P2004/61 ,  C01P2006/10 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/82

摘要： Manganese dioxide having high bulk density, high tap density and high activity for use in batteries can be obtained by decomposing an aqueous solution of ammonia complex of manganese at a temperature of 68.degree. C. or higher than roasting the resulting manganese carbonate in an atmosphere of oxygen and 15-85% of steam at a temperature of 275.degree. to 375.degree. C.

摘要翻译： 可以通过在68℃或更高的温度下分解锰的氨络合物的水溶液，在所得的碳酸锰的气氛中，分解得到的碳酸锰的气氛中，可以获得具有高堆积密度，高振实密度和高活性的二氧化锰 氧气和15-85％的蒸汽在275°至375℃的温度下