公开(公告)号：US20060073624A1

公开(公告)日：2006-04-06

申请号：US10956624

申请日：2004-09-30

Applicant: Rahul Manepalli ,  Ravindra Tanikella

Inventor： Rahul Manepalli ,  Ravindra Tanikella

IPC: H01L21/00 ,  B41J2/16

CPC classification number: H01L24/83 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A die-attach composition includes a resin such as a thermosetting resin, a hardener, and a low molecular weight oligomer diluent. A die-attach composition includes a polyimide in a major amount and a resin such as a thermosetting resin in a minor amount. The die-attach composition also includes a reactive polymer diluent. Combinations of the low molecular weight oligomer diluent and the reactive polymer diluent are included. The die-attach composition is applied to surface mount technology such as wire-bond dice. A computing system is also included that uses the die-attach composition.

Abstract translation: 模具附着组合物包括树脂如热固性树脂，硬化剂和低分子量低聚物稀释剂。 模具附着组合物包括主要量的聚酰亚胺和少量的热固性树脂等树脂。 模片附着组合物还包括反应性聚合物稀释剂。 包括低分子量低聚物稀释剂和反应性聚合物稀释剂的组合。 将芯片附着组合物应用于诸如引线键合芯片的表面贴装技术。 还包括使用芯片附着组合物的计算系统。

公开(公告)号：US07790598B2

公开(公告)日：2010-09-07

申请号：US12394542

申请日：2009-02-27

Applicant: Mengzhi Pang ,  Christopher J. Bahr ,  Ravindra Tanikella ,  Charan Gurumurthy

Inventor： Mengzhi Pang ,  Christopher J. Bahr ,  Ravindra Tanikella ,  Charan Gurumurthy

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577

Abstract: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.

Abstract translation: 根据一些实施例，提供了一种方法，装置和系统。 在一些实施例中，该方法包括在衬底的表面上提供阻焊材料，在阻焊材料的顶部上涂覆掩模材料，回流焊料位于通过阻焊材料和掩模材料形成的开口中， 焊料回流后的掩模材料。

公开(公告)号：US20090196000A1

公开(公告)日：2009-08-06

申请号：US12394542

申请日：2009-02-27

Applicant: Mengzhi Pang ,  Christopher J. Bahr ,  Ravindra Tanikella ,  Charan Gurumurthy

Inventor： Mengzhi Pang ,  Christopher J. Bahr ,  Ravindra Tanikella ,  Charan Gurumurthy

IPC: H05K7/02 ,  B05D5/12

CPC classification number: H01L24/11 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577

Abstract: According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.

Abstract translation: 根据一些实施例，提供了一种方法，装置和系统。 在一些实施例中，该方法包括在衬底的表面上提供阻焊材料，在阻焊材料的顶部上涂覆掩模材料，回流焊料位于通过阻焊材料和掩模材料形成的开口中， 焊料回流后的掩模材料。

公开(公告)号：US20080087986A1

公开(公告)日：2008-04-17

申请号：US11986998

申请日：2007-11-27

Applicant: Ravindra Tanikella

Inventor： Ravindra Tanikella

IPC: H01L23/532 ,  H01L23/52

CPC classification number: H01L23/49894 ,  C08F283/04 ,  C08G73/121 ,  C08K3/36 ,  C08K9/10 ,  C08K2201/011 ,  C08L79/08 ,  C08L2666/66 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/15787 ,  H01L2924/15791 ,  H01L2924/18161 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/28 ,  H05K3/421 ,  H05K3/422 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/1163 ,  H05K2203/121 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

Abstract translation: 用于微电子封装的高度可靠的互连。 在一个实施例中，积聚互连中的电介质层具有玻璃化转变温度的等级; 并且稍后施加的电介质层在低于较早施加的电介质层的玻璃化转变温度的温度下被层压。 在一个实施方案中，通过热固化工艺增加了积聚互连中早期施加的介电膜的玻璃化转变温度，以超过用于层压后来施加的电介质膜的温度。 在一个实施方案中，在层压聚酰亚胺材料的膜（例如，通过催化剂的密封剂的光化学或热降解）之后，用嵌入的催化剂形成聚酰亚胺材料以促进交联。 在一个实施例中，阻焊剂开口壁具有通过激光辅助接种产生的可湿性层，使得阻焊剂开口壁之间没有间隙，并且在阻焊剂开口中没有底部填充物。