公开(公告)号：US20120161326A1

公开(公告)日：2012-06-28

申请号：US13330719

申请日：2011-12-20

申请人： Kwang-Seong Choi ,  Yong Sung Eom ,  Hyun-cheol Bae ,  Jong Tae Moon

发明人： Kwang-Seong Choi ,  Yong Sung Eom ,  Hyun-cheol Bae ,  Jong Tae Moon

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided is a composition for filling a Through Silicon Via (TSV) including: a metal powder; a solder powder; a curable resin; a reducing agent; and a curing agent. A TSV filling method using the composition and a substrate including a TSV plug formed of the composition are also provided.

摘要翻译： 提供了一种用于填充通硅（TSV）的组合物，其包括：金属粉末; 焊粉; 可固化树脂; 还原剂; 和固化剂。 还提供了使用该组合物的TSV填充方法和包含由该组合物形成的TSV塞的基板。

公开(公告)号：US08044757B2

公开(公告)日：2011-10-25

申请号：US12648117

申请日：2009-12-28

申请人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

发明人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Yong Sung Eom ,  Jong Tae Moon ,  Moo Jung Chu ,  Jong-Hyun Lee

IPC分类号： H01F5/00 ,  H01F27/29 ,  H01F27/28 ,  H01L23/34 ,  H01L23/48

CPC分类号： H01F17/0013 ,  H01F2017/002 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/19107 ,  H01L2924/00014

摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.

摘要翻译： 提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到 第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

公开(公告)号：US20100073238A1

公开(公告)日：2010-03-25

申请号：US12366348

申请日：2009-02-05

申请人： Dong Suk JUN ,  Jong Tae Moon ,  Kwang-Seong Choi ,  Yong II Jun ,  Hee-Bum Jung

发明人： Dong Suk JUN ,  Jong Tae Moon ,  Kwang-Seong Choi ,  Yong II Jun ,  Hee-Bum Jung

IPC分类号： H01Q1/38

CPC分类号： H01Q9/0407 ,  H01Q9/0457

摘要： Provided is a microstrip patch antenna. The microstrip patch antenna includes a dielectric layer, a feed circuit disposed in the dielectric layer, at least one slot disposed in the dielectric layer and vertically spaced apart from the feed circuit, and a patch antenna disposed outside the dielectric layer and vertically spaced apart from the at least one slot.

摘要翻译： 提供了一种微带贴片天线。 微带贴片天线包括电介质层，设置在电介质层中的馈电电路，设置在电介质层中的至少一个狭缝和与供电电路垂直间隔开的贴片天线，以及布置在电介质层外部并垂直间隔开的贴片天线 至少一个槽。

公开(公告)号：US07553092B2

公开(公告)日：2009-06-30

申请号：US11450743

申请日：2006-06-08

申请人： Kwang Seong Choi ,  Yong Duck Chung ,  Young Shik Kang ,  Dong Suk Jun ,  Je Ha Kim ,  Jong Tae Moon

发明人： Kwang Seong Choi ,  Yong Duck Chung ,  Young Shik Kang ,  Dong Suk Jun ,  Je Ha Kim ,  Jong Tae Moon

IPC分类号： G02B6/36

CPC分类号： G02F1/0121 ,  G02B6/4201 ,  G02B6/4279 ,  H01L2224/48091 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is an optical module used in a communication system employing a radio over fiber (ROF) technology delivering a radio frequency (RF) signal through an optical fiber. The optical module includes: an optical device; a signal line for transporting a radio frequency (RF) signal input from an external circuit to the optical device; and a resistor separately disposed from the signal line and having one end connected with the optical device, wherein the input impedance seen from the signal line is matched by the resistor. A bias voltage supplied to operate the optical device is applied through an inductor connected to the signal line between the optical device and a filter. Here, the filter formed by a pattern of the signal line prevents the bias voltage from being supplied to the external circuit. In order to amplify the RF signal input from the external circuit, an amplifier may be connected between the external circuit and the filter.

摘要翻译： 提供了一种用于通过光纤传送射频（RF）信号的无线电光纤（ROF）技术的通信系统中的光学模块。 光学模块包括：光学装置; 用于将从外部电路输入的射频（RF）信号传送到光学装置的信号线; 以及与信号线分开设置并且具有与光学装置连接的一端的电阻，其中从信号线看到的输入阻抗由电阻器匹配。 提供用于操作光学器件的偏置电压通过连接到光学器件和滤光器之间的信号线的电感器施加。 这里，由信号线的图案形成的滤波器防止偏置电压被提供给外部电路。 为了放大从外部电路输入的RF信号，可以在外部电路和滤波器之间连接放大器。

公开(公告)号：US08723292B2

公开(公告)日：2014-05-13

申请号：US13493458

申请日：2012-06-11

申请人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Jong Tae Moon ,  Jong-Moon Park

发明人： Hyun-Cheol Bae ,  Kwang-Seong Choi ,  Jong Tae Moon ,  Jong-Moon Park

IPC分类号： H01L27/08

CPC分类号： H01L27/08 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5227 ,  H01L27/0694 ,  H01L2924/0002 ,  H01L2924/19042 ,  H01L2924/00

摘要： Disclosed is a silicon interposer that can reduce the entire area of a semiconductor package and increase the degree of integration by forming inductors at a lower part in addition to an upper part of a silicon substrate. The silicon interposer includes a silicon substrate, an upper inductor layer formed at the upper part of the silicon substrate and a lower inductor layer formed at the lower part of the silicon substrate.

摘要翻译： 公开了一种硅插入器，其可以减少半导体封装的整个面积，并且除了硅衬底的上部之外，通过在下部形成电感器来增加集成度。 硅插入器包括硅衬底，形成在硅衬底的上部的上电感器层和形成在硅衬底的下部的下电感层。

公开(公告)号：US20130074918A1

公开(公告)日：2013-03-28

申请号：US13561226

申请日：2012-07-30

申请人： Jin Woo Jeong ,  Yoon Ho Song ,  Sung Youl Choi ,  Je Ha Kim ,  Jong Tae Moon ,  Jung Wook Lim ,  Hun Kyun Pak

发明人： Jin Woo Jeong ,  Yoon Ho Song ,  Sung Youl Choi ,  Je Ha Kim ,  Jong Tae Moon ,  Jung Wook Lim ,  Hun Kyun Pak

IPC分类号： H01L31/0232 ,  C03C27/06 ,  H01L31/0256 ,  H01L31/0296 ,  H01L31/0272 ,  B32B37/14 ,  H01L31/0264

CPC分类号： C03C27/06 ,  E06B3/6612 ,  H01L31/0488 ,  Y02B10/10 ,  Y02E10/50 ,  Y10T156/10

摘要： Disclosed are vacuum window glazing including a solar cell function and a manufacturing method thereof. The vacuum window glazing includes a first sheet glass, a second sheet glass that is vacuum-bonded to the first sheet glass; a vacuum layer that is formed between the first sheet glass and the second sheet glass; and a solar cell panel that is formed on a surface of the second sheet glass in a direction of the vacuum layer. By this configuration, power can be produced through the solar cell formed within the vacuum window glazing while more increasing the heat insulation effect of the vacuum window glazing, and the cooling and heating efficiency of the building can be greatly improved using the outer wall covered with glass.

摘要翻译： 公开了包括太阳能电池功能的真空窗玻璃及其制造方法。 真空窗玻璃包括第一平板玻璃，与第一平板玻璃真空接合的第二平板玻璃; 形成在所述第一平板玻璃和所述第二平板玻璃之间的真空层; 以及在真空层的方向上形成在第二平板玻璃的表面上的太阳能电池面板。 通过这种构造，可以通过在真空窗玻璃中形成的太阳能电池产生电力，同时更加增加真空窗玻璃的隔热效果，并且可以使用覆盖有真空窗玻璃的外壁来大大提高建筑物的冷却和加热效率 玻璃。

公开(公告)号：US20120222738A1

公开(公告)日：2012-09-06

申请号：US13411501

申请日：2012-03-02

申请人： Soo Young OH ,  Yong Sung Eom ,  Jong Tae Moon ,  Kwang Seong Choi

发明人： Soo Young OH ,  Yong Sung Eom ,  Jong Tae Moon ,  Kwang Seong Choi

IPC分类号： H01L31/0224 ,  H01L31/0232

CPC分类号： H01L31/022425 ,  H01B1/22 ,  H01L31/02168 ,  Y02E10/50

摘要： A conductive composition for a front electrode busbar of a silicon solar cell includes a metallic powder, a solder powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing a front electrode busbar of a silicon solar cell includes applying the composition to the front surface of the silicon solar cell wherein its front electrode finger line is formed. A substrate includes a front electrode busbar of a silicon solar cell, formed with a conductive composition. A silicon solar cell includes one or more electrodes containing a conductive composition including a conductive powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing the silicon solar cell includes forming a first electrode array with a first conductive composition, forming a second electrode, and forming a third electrode with a third conductive composition.

摘要翻译： 硅太阳能电池的前电极汇流条的导电组合物包括金属粉末，焊料粉末，固化树脂，还原剂和固化剂。 制造硅太阳能电池的前电极汇流条的方法包括将该组合物涂布在其前电极指线形成的硅太阳能电池的正面上。 基板包括由导电组合物形成的硅太阳能电池的前电极母线。 硅太阳能电池包括一个或多个包含导电组合物的电极，所述导电组合物包括导电粉末，可固化树脂，还原剂和固化剂。 制造硅太阳能电池的方法包括：用第一导电组合物形成第一电极阵列，形成第二电极，并用第三导电组合物形成第三电极。

公开(公告)号：US08030200B2

公开(公告)日：2011-10-04

申请号：US12565171

申请日：2009-09-23

申请人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

发明人： Yong Sung Eom ,  Kwang-Seong Choi ,  Hyun-Cheol Bae ,  Jong-Hyun Lee ,  Jong Tae Moon

IPC分类号： H01L21/44

CPC分类号： H01L24/81 ,  H01L21/486 ,  H01L21/563 ,  H01L23/29 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/1134 ,  H01L2224/1152 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81192 ,  H01L2224/818 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for fabricating a semiconductor package, includes the steps of forming a first terminal at a first substrate; mixing a polymer resin and solder particles to provide a mixture; covering at least one of an upper surface and side surfaces of the first terminal with the mixture; and heating the first substrate at a temperature higher than a melting point of the solder particles of the mixture to form a solder layer that covers the at least one of an upper surface and a side surface of the first terminal. The solder particles flow or diffuse toward the terminal in the heated polymer resin to adhere to at least some of the exposed surfaces of the terminal thereby forming the solder layer. The solder layer improves the adhesive strength between the terminals of the semiconductor chip and the substrate in the subsequent flip chip bonding process.

摘要翻译： 一种半导体封装的制造方法，包括在第一基板上形成第一端子的工序; 混合聚合物树脂和焊料颗粒以提供混合物; 用所述混合物覆盖所述第一端子的上表面和侧表面中的至少一个; 以及在高于混合物的焊料颗粒的熔点的温度下加热第一衬底，以形成覆盖第一端子的上表面和侧表面中的至少一个的焊料层。 焊料颗粒朝向加热的聚合物树脂中的端子流动或扩散以粘附到端子的至少一些暴露表面，从而形成焊料层。 焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子与衬底之间的粘合强度。

公开(公告)号：US20110090651A1

公开(公告)日：2011-04-21

申请号：US12765619

申请日：2010-04-22

申请人： Sunghae Jung ,  Dong Suk Jun ,  Jong Tae Moon ,  Hyun-cheol Bae ,  Moo Jung Chu

发明人： Sunghae Jung ,  Dong Suk Jun ,  Jong Tae Moon ,  Hyun-cheol Bae ,  Moo Jung Chu

IPC分类号： H05K7/00

CPC分类号： H03H9/0557 ,  H01L2224/48091 ,  H01L2924/1461 ,  H03H9/0514 ,  H03H9/1014 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a package structure. The package structure includes a first substrate, a first device, a second substrate, a first via contact, and at least one second device. The first device is formed on the first substrate. The second substrate has an air gap over the first substrate and covers the first device. The first via contact is connected to the first device through the second substrate. At least one second device is electrically connected to the first via contact, and is stacked on the second substrate.

摘要翻译： 提供了一种封装结构。 封装结构包括第一衬底，第一器件，第二衬底，第一通孔触点和至少一个第二器件。 第一装置形成在第一基板上。 第二基板在第一基板上具有空隙并覆盖第一装置。 第一通孔接触件通过第二基板连接到第一器件。 至少一个第二装置电连接到第一通孔接触件，并且堆叠在第二基板上。

公开(公告)号：US20110089577A1

公开(公告)日：2011-04-21

申请号：US12761715

申请日：2010-04-16

申请人： Yong Sung Eom ,  Jong Tae Moon ,  Kwang-Seong Choi

发明人： Yong Sung Eom ,  Jong Tae Moon ,  Kwang-Seong Choi

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L25/50 ,  H01L24/29 ,  H01L2224/114 ,  H01L2224/1152 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83138 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06575 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes.

摘要翻译： 提供了一种在提高制造成品率的同时将倒装芯片接合的方法和结构。 在该方法中，分别在设置在第一和第二基板上的第一电极和/或第二电极上形成焊料凸点。 此外，第一和第二电极被布置成使第二树脂彼此面对，该第二树脂包括设置在第一和第二基板之间的间隔球。 此外，在流动第二树脂时，第一和第二基板被压制直到第一和第二基板之间的距离小于间隔球的直径，以便连接第一和第二电极之间的焊料凸块。