中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

38 records (took 0.026 seconds)

    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING CURVED AND/OR PLANAR SURFACES
    11.
    发明申请
    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING CURVED AND/OR PLANAR SURFACES 有权

    公开(公告)号：US20210249572A1

    公开(公告)日：2021-08-12

    申请号：US16664686

    申请日：2019-10-25

    Applicant: CREE, INC.

    Inventor： Arthur Pun ,  Jeremy Nevins ,  Jesse Reiherzer ,  Joseph Clark

    IPC: H01L33/54 ,  H01L25/075

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

    LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL
    12.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE WITH LIGHT-ALTERING MATERIAL 有权

    公开(公告)号：US20210005793A1

    公开(公告)日：2021-01-07

    申请号：US17016701

    申请日：2020-09-10

    Applicant: Cree, Inc.

    Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

    IPC: H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

    Light-emitting diode package with light-altering material
    13.
    发明授权
    Light-emitting diode package with light-altering material 有权

    公开(公告)号：US10522722B2

    公开(公告)日：2019-12-31

    申请号：US15957454

    申请日：2018-04-19

    Applicant: Cree, Inc.

    Inventor： Kyle Damborsky ,  Derek Miller ,  Jack Vu ,  Peter Scott Andrews ,  Jasper Cabalu ,  Colin Blakely ,  Jesse Reiherzer

    IPC: H01L33/00 ,  H01L33/52 ,  H01L33/26 ,  H01L33/60 ,  H01L33/50

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.

    Compact LED package with reflectivity layer
    14.
    发明授权
    Compact LED package with reflectivity layer 有权

    公开(公告)号：US10424702B2

    公开(公告)日：2019-09-24

    申请号：US14183218

    申请日：2014-02-18

    Applicant: CREE, INC.

    Inventor： Jesse Reiherzer ,  Jeremy Nevins ,  Michael John Bergmann ,  Joseph Gates Clark

    IPC: H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L23/00

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.

    LED PACKAGE WITH ENCAPSULANT HAVING CURVED AND PLANAR SURFACES
    18.
    发明申请
    LED PACKAGE WITH ENCAPSULANT HAVING CURVED AND PLANAR SURFACES 有权
    具有弯曲和平面表面的包装的LED包装

    公开(公告)号：US20140027795A1

    公开(公告)日：2014-01-30

    申请号：US13957290

    申请日：2013-08-01

    Applicant: CREE, INC.

    Inventor： Jesse Reiherzer ,  Andrew Signor ,  Joseph Gates Clark ,  Michael John Bergmann

    IPC: H01L33/50 ,  H01L33/58

    CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The encapsulant can also have a upper curved surface with a relatively large radius of curvature, with the combination of curved and planar surfaces resulting in efficient emission of light with a relatively narrow emission profile.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有弯曲和平坦表面的密封剂。 封装可以包括具有一个或多个LED的基座，并且在具有多个LED的基座中，每个LED可以发射与其它LED相同或不同的波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 密封剂可以位于基座上，至少一些LED上，其中每个平面表面是垂直的并且与底座的边缘中的一个对准。 密封剂还可以具有具有相对较大曲率半径的上曲面，弯曲和平面表面的组合导致具有相对窄的发射轮廓的光的有效发射。

    Indicia for light emitting diode chips
    19.
    发明授权
    Indicia for light emitting diode chips 有权

    公开(公告)号：US11145689B2

    公开(公告)日：2021-10-12

    申请号：US16203709

    申请日：2018-11-29

    Applicant: Cree, Inc.

    Inventor： Nikolas Hall ,  Derek Miller ,  Anoop Mathew ,  Colin Blakely ,  Luis Breva ,  Jesse Reiherzer ,  David Todd Emerson

    IPC: H01L23/544 ,  H01L27/15 ,  H01L33/22 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chips and related methods are disclosed. LED chips are provided that include an indicia arranged between a primary light-emitting face and a mounting face of the LED chip. The indicia may include at least one of a logo, one or more alphanumeric characters, or a symbol, among others that are configured to convey information. Arrangements of at least one of an n-contact, a p-contact, or a reflector layer of the LED chip may form the indicia. LED chips are also provided where at least a portion of an indicia is arranged on a mounting face of the LED chip. Indicia are provided that may be visible through primary light-emitting faces when LED chips are electrically activated or electrically deactivated. In this regard, the indicia may be embedded within LED chips while still being able to convey information.

    Solid-state light emitting devices including light emitting diodes in package structures
    20.
    发明授权
    Solid-state light emitting devices including light emitting diodes in package structures 有权

    公开(公告)号：US11101411B2

    公开(公告)日：2021-08-24

    申请号：US16453447

    申请日：2019-06-26

    Applicant: Cree, Inc.

    Inventor： Peter Scott Andrews ,  Colin Blakely ,  Jesse Reiherzer ,  Arthur F. Pun

    IPC: H01L33/50 ,  H01L33/60 ,  H01L33/26

    Abstract: Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. LED packages are disclosed that include an LED chip with multiple discrete active layer portions mounted on a submount. The LED packages may further include wavelength conversion elements and light-altering materials. The multiple discrete active layer portions may be electrically connected in series, parallel, or in individually addressable arrangements. The LED chip with the multiple discrete active layer portions may provide the LED package with improved brightness, improved alignment, simplified manufacturing, and reduced costs.

Patent Agency Ranking